At a glance
| Booth | K2584 |
| Country | TW |
| Website | www.surfxtechnologies.com |
Company profile
Surfx Technologies Taiwan Co., Ltd. was founded in 1999 and develops surface-treatment technology for materials, with a stated focus on semiconductor, electronics-assembly, aerospace, and medical-device manufacturing. The company developed and brought to market a low-temperature, variable-chemistry plasma platform that operates at atmospheric pressure, allowing plasma treatment to be applied without a vacuum chamber. Its products incorporate advanced plasma technology covered by multiple U.S. patents, and the company presents customer commitment, product quality, and service as central parts of its manufacturing support. Surfx Technologies Taiwan Co., Ltd. applies this atmospheric-pressure plasma approach to material-surface preparation where cleaning, activation, bonding, adhesion, coating preparation, and production-line integration are required. Surfx Technologies Taiwan Co., Ltd. describes its mission as becoming the worldwide leader in material surface treatment for its target industries and promises to deliver high-quality products for customer manufacturing needs.
Exhibits
The product portfolio includes particle-free, low-temperature plasma systems for high-performance electronics manufacturing, with Atomflo™-INT, STA-10iL, the Atomflo™ 600 controller and coolant control module, and multiple atmospheric plasma sources. Atomflo™-INT is configured for integration into new or existing process equipment, and its external rack-mounted controller can support one or two plasma heads embedded inside the primary machine. Ethernet IP communication provides process control and data logging, while the INT is specified as complying with U.S., EU, and SEMI EH&S standards. The integration-ready Atomflo™-INT supports both in-line and batch-tool surface treatment and provides real-time monitoring, precise control, automated data logging, and traceability for plasma cleaning and activation. The system fits standard 19-inch server racks; the standard controller is 437 x 622 x 219 millimeters and the coolant module is 437 x 523 x 219 millimeters, giving equipment designers defined footprints for installation planning. Users can select plasma heads ranging from 2-millimeter spots to 100-millimeter-wide linear beams, so the same platform can support localized treatment as well as wider-area and higher-volume processing. Atomflo™-INT operates at atmospheric pressure, enabling continuous in-line treatment without the pump-down and pump-up cycles associated with vacuum plasma batch processing. Its real-time process monitoring supports parameter adjustment and gas-flow control, including argon flow up to 60 LPM and hydrogen-argon mixtures up to 20 LPM. Controlled oxygen and hydrogen mixtures are used for surface cleaning and activation of sensitive microelectronics and high-value components, while combined plasma chemistry is used to remove organic residue and maintain substrate integrity. Surface preparation is intended to remove dirt, organic material, and oxidation that can interfere with adhesion and coating performance, and the system is positioned for continuous manufacturing of medical devices, microelectronics, and other high-performance components. The STA-10iL automated plasma system cleans and activates substrates to improve bonding and is intended for electronics manufacturing and semiconductor packaging. STA-10iL includes in-line conveyance as standard for high-speed, high-volume production, and an optional drawer can be installed for high-mix, low-volume production. The Atomflo™ 600 controller contains an RF power supply, an auto-tuning matching network, three mass-flow controllers for argon, nitrogen or oxygen, and hydrogen (5%H2/Ar), together with a Windows 10 computer and an eight-inch touch screen. The coolant control module uses closed-loop water circulation to keep the plasma source at a constant operating temperature, improving plasma-process performance and reliability. The SPS-100 is a 100 mm-wide linear-beam plasma source for cleaning and activating substrates to improve bonding and adhesion; RF power, gas feed, optical detection, and water cooling are supplied by the Atomflo™ 600 controller and coolant control module. SPS-100 is particularly suited to semiconductor processing, while SPS-M is a spot plasma source that treats a circular area about one centimeter in diameter for selective processing of semiconductor packages and printed circuit boards. SPS-50 is a 50 mm linear-beam plasma source for precise cleaning and activation of sensitive substrates, with semiconductor wafer preparation and electronics assembly listed among its applications. SPS-25 is a 25 mm linear-beam source powered by the Atomflo™ 600 controller and uses argon plasma cleaning and process gases for sensitive substrates in electronics, medical-device, and semiconductor manufacturing. Across these systems, Surfx Technologies Taiwan Co., Ltd. supplies integrated plasma surface-treatment equipment that can be built into existing manufacturing tools and used for semiconductor packaging, wafer preparation, electronics assembly, selective package processing, and other surface-cleaning and activation steps.
Capabilities and products
- low-temperature variable-chemistry atmospheric-pressure plasma surface treatment
- integration-ready atmospheric-pressure plasma system
- plasma cleaning and activation for semiconductor packaging substrates
- 100 mm linear-beam plasma source
- approximately 1 cm spot plasma source
- 50 mm linear-beam plasma source
- 25 mm linear-beam plasma source