At a glance
| Booth | Q5458 |
| Country | TW |
| Website | www.suncorp.com.tw |
Company profile
SUN Corporation, Ltd. was established in 2008 and was renamed from Fortrend Engineering (Hsinchu) Corporation, Ltd. in October 2024; it develops, manufactures and sells semiconductor equipment based on its own intellectual property. The company focuses on semiconductor automation and microenvironment-control products, covering wafer handling, transfer robots, front-end automation and ultra-clean thermal-process equipment. Its SMIF loading and unloading core technology traces back to Fortrend Engineering in the United States, with the company describing nearly 20 years of accumulated technology and market experience behind the current product generation. The earlier business lineage began in 1999 when Taiwan Fortrend Technology was established and received technology transfer from Fortrend Engineering to manufacture SMIF equipment. In 2001 the organization developed its UDC control system and completed its first self-designed 12-inch wafer Equipment Front-End Module (EFEM), which was installed and operated at a customer site. In 2002 it introduced its first 12-inch wafer-level baking system and installed it at a customer site, followed by continuing orders. In 2008 Fortrend Engineering in the United States acquired the Hsinchu semiconductor business division and established the company that later became SUN Corporation, Ltd. The Lamina EFEM/Sorter series was introduced in 2009 and became a second major product line after receiving stable domestic and overseas orders. The company shipped a self-designed oven system to a United States customer in 2012 and acquired ICCI high-temperature furnace-control systems and Super-TMX software in 2013, enabling aftermarket core-component support for Thermco furnace equipment. In 2016 the Lamina EFEM was combined with a fully automated high-temperature baking system developed with YES, with an order of about one hundred systems delivered over one year. The Taiwan operation became independent from Fortrend Engineering in the United States in 2017, and in 2018 it developed a dedicated E2000 EFEM for ASM that was installed and put into operation in Singapore. In 2021 the company received major Wolfspeed and OSRAM orders for full-factory SMIF automation systems, adding named international semiconductor customers to its deployment record. A wholly owned SMIF Automation Sdn. Bhd. subsidiary was established in Malaysia in 2022 to serve local customers and support expansion in Southeast Asia. In 2023 the UDC3 automatic-control system was introduced to update existing equipment-control hardware and graphical user-interface software. In 2024 Dufu Industries Sdn. Bhd. invested in SMIF Automation and received exclusive agency rights in Malaysia, while the Taiwan company adopted the SUN Corporation, Ltd. name in October of the same year.
Exhibits
SUN Corporation, Ltd. organizes its core offering into three major product lines: SMIF automation for 8-inch and 12-inch wafer loading and unloading, wafer-robot and Load Port based EFEM/Sorter systems, and high-temperature dust-free oxygen-free wafer baking ovens with fully automated transfer systems. Its SMIF systems can include Lot ID reading through Smart tag, infrared and RFID technologies, supporting automated identification together with wafer loading and unloading. The LPT+ family includes new 200mm and 300mm SMIF load ports introduced in 2024, extending the company's SMIF automation platform to current wafer-handling configurations. The Bravo series wafer robots were also introduced as a new product generation focused on production capacity, precision, stability and clean-operation performance for standard Sorter and customized EFEM systems. SUN's FVO oven series uses multi-axis temperature-control technology over a +60~450 degree range, with temperature uniformity specified at ± 1% of the set temperature and chamber cleanliness better than Class-10 across the full range. The FVO oven systems have received orders from advanced wafer fabs in Taiwan and overseas and are used for high-end three-dimensional integrated-circuit (3DIC) packaging processes. In 2026 SUN introduced a 310mm x 310mm Panel Level Packaging (PLP) high-temperature vacuum oxygen-free baking system and a 510mm x 515mm PLP high-temperature oxygen-free baking system. The 2026 product additions also include the Vision Mapping series, designed to reduce breakage risk when robots pick high-warpage wafers, and a 510mm x 515mm PLP Robot, Load Port and EFEM product family. In 2025 the company introduced the Lamina+ 310mm x 310mm PLP EFEM, the 310mm x 310mm PLP Load Port, a high-efficiency HMJ robot, and a <10ppm vacuum oxygen analyzer. Another 2025 product was the third-generation FVO-300-450 X3, a 300mm wafer high-cleanliness high-temperature vacuum oxygen-free baking system with fully owned intellectual property and updated temperature-control and automation specifications. The 2024 equipment additions included the Bravo SCARA wafer-handling robot, the LPT+ Adaptive SMIF robot and a fully electric 300mm FOUP Opener. The broader 200mm Wafer SMIF product family includes LPT+, PLM, PLS and POS, while Sorter/EFEM products include EFEM, Sorter, Load Port and Pre-aligner equipment. Wafer cure-oven offerings include both high-temperature and low-temperature equipment, and named oven products include SIO-300-200 Series Low Temperature Vacuum Oven and FVO-450 Series High Temperature Vacuum Oven. Furnace-control offerings include ICCI products, GMI Host, SLC-99 Controllers and Super-TMX software, extending the company's equipment scope beyond wafer transfer into furnace-control replacement and support. ICCI SLC-99 Controllers provide replacement control for diffusion furnaces from Bruce, TEL, Thermco, Tystar and Tempress, for Gasonics Hypox Systems, and for ASM and Pacific Western Plasma CVD Systems. Taken together, the product range connects SMIF loading, Lot ID identification, robot handling, wafer alignment, Load Port interfaces, EFEM/Sorter integration, thermal curing, PLP automation and furnace-control functions within semiconductor process and advanced-packaging equipment.
Capabilities and products
- 8-inch and 12-inch SMIF loading/unloading automation
- Lot ID Smart tag/IR/RFID reading
- wafer robot and Load Port EFEM/Sorter
- high-temperature dust-free oxygen-free wafer baking system
- 200mm/300mm SMIF Load Ports
- FVO oven with +60~450°C, ±1% uniformity and Class-10 cleanliness
- 310mm x 310mm PLP high-temperature vacuum oxygen-free baking
- 510mm x 515mm PLP high-temperature oxygen-free baking
- Vision Mapping for high-warpage wafers
- 510mm x 515mm PLP Robot, Load Port and EFEM
- 310mm x 310mm PLP EFEM
- 310mm x 310mm PLP Load Port
- <10ppm vacuum oxygen analyzer
- fully electric 300mm FOUP Opener
- automatic wafer sorter
- Wafer Aligner edge finding
- high-temperature wafer baking equipment
- low-temperature wafer baking equipment
- furnace control components
- Super-TMX furnace control software