At a glance
| Booth | R7324 |
| Country | TW |
| Website | www.st.com/content/st_com/en/about/who-we-are.html |
Company profile
STMicroelectronics is a global semiconductor company and global Integrated Device Manufacturer (IDM), serving customers with semiconductor innovations across a broad range of electronic systems and applications. The company describes one global team of 49,000 people, including 9,500 employees in R&D, and a customer base of more than 200,000 around the world. Its R&D scale is also represented by 20,000 patents and 195 active R&D programs, supporting continued development across differentiated semiconductor technologies. As an IDM, STMicroelectronics invests in proprietary technologies and an extensive manufacturing footprint, and it designs, produces and delivers products while providing expertise, supply security and quality to customers. The company states that it masters the complete semiconductor value chain from R&D and chip design through production, sales and support, with a network of high-tech manufacturing facilities intended to provide flexible and robust supply. Its manufacturing organization includes 14 manufacturing sites, and manufacturing accounts for 63% of ST staff. Through decades of investment, STMicroelectronics has developed chip-manufacturing and packaging technologies that connect its technology development with products and customer applications. STMicroelectronics delivers its technology as microchips embedded in products ranging from electric cars and key fobs to factory machines, data centers, washing machines, hard disks, smartphones and toothbrushes. Its innovation focus includes Smart Mobility, where electrification solutions are designed to support greener and more affordable electric vehicles and digitalization solutions are intended to make driving smarter and safer. A second focus is Power & Energy, where the company applies its experience to efficient power and energy management solutions that address increasing energy demand while reducing environmental impact. A third focus is cloud-connected autonomous things, including secure and connected autonomous devices enabled by edge AI. Sustainability has been described as integral to STMicroelectronics for over 30 years, shaping how it conducts business, works with customers, partners and employees, and approaches innovation. The company states that 100% of new products go through its eco-design process, reports 40% EU-Taxonomy eligible revenue, and lists 15 years of product stewardship. Its workforce information also lists 46 hours of training per person and reports that 84% of employees felt proud working at ST.
Exhibits
STMicroelectronics' differentiated technology portfolio is organized to address performance, efficiency, integration and reliability, with technology domains intended to support more efficient, secure and integrated application-ready solutions. Its silicon photonics platform addresses the shift from electrical to optical connectivity in data centers and next-generation AI infrastructure, supporting optical-transceiver needs where performance, power efficiency and compact design are important. For wide-bandgap power conversion, GaN-based transistors provide high energy efficiency and power density, while Silicon Carbide (SiC) uses intrinsic advantages over mainstream silicon to enable higher energy efficiency in sustainable applications. BiCMOS technology supports high-performance RF ICs in compact, power-efficient designs and is part of the company's next-generation connectivity and mixed-signal technology portfolio. Space ASIC technology platforms provide differentiated technologies for radiation hardening, supporting semiconductor designs intended for aerospace and space environments. FD-SOI combines low power and high reliability for cost-effective RF/mmW and mixed-signal applications. PCM phase-change memory is described as delivering higher density and greater robustness than Flash and other embedded-memory technologies. The 40 nm eSTM embedded select-in-trench memory technology is used to make MCUs smaller, more cost-effective and higher-performing. RF-SOI enables advanced RF front-end modules across a full range of applications, while MEMS technology advances next-generation sensors and actuators through process, packaging and manufacturing innovation. For power management, the portfolio includes smart-power and high-power technologies that support reliable control and efficient power conversion across many applications. BCD, invented by ST in the mid-1980s and continuously developed since then, is a key technology for power ICs. STi²Fuse intelligent switches provide fast, resettable over-current protection while simplifying wiring and reducing weight. VIPower technologies combine high-power control, status communication and device protection in one device. The trench-gate field-stop architecture is used to help cost-effective IGBT devices provide robust switching in higher-power applications, while Superjunction MDmesh high-voltage MOSFETs target optimized silicon performance for efficiency-critical applications. STMicroelectronics also provides solutions for low Earth orbit infrastructure at scale, supported by its technology portfolio and IDM model across the LEO value chain. A security-by-design approach builds security in from the start so designers can develop trusted products and resilient solutions built for compliance. Microcontroller and microprocessor offerings include the STM32 family together with STM32CubeMX, STM32CubeIDE, STM32CubeProgrammer and the ST Edge AI Suite for development and edge-AI workflows. The broader product and application scope spans automotive, industrial and IoT applications, personal electronics, communications equipment, computers and peripherals, imaging and photonics solutions, and space products.
Capabilities and products
- semiconductor technology design and manufacturing
- low Earth orbit (LEO) infrastructure solutions
- silicon photonics platform
- GaN-based power transistors
- SiC power technologies
- BiCMOS RF IC technology
- radiation-hardened Space ASIC technology platforms
- FD-SOI RF/mmW and mixed-signal technology
- phase-change memory (PCM) technology
- 40 nm embedded select-in-trench memory (eSTM)
- MEMS sensors and actuators technology
- RF-SOI RF front-end technology
- BCD smart power IC technology
- STi²Fuse intelligent switches
- TGFS IGBT technology
- high-voltage superjunction MOSFETs
- microcontrollers and microprocessors including STM32