At a glance
| Booth | T9308 |
| Website | www.superchem.co.kr |
Company profile
SSK Co., Ltd. provides FFKM (Perfluoroelastomer) sealing solutions for semiconductor and display manufacturing and develops its compounds using proprietary Nano-Organic Filler and Non-Filler technologies. Its FFKM development is directed at sealing applications that must withstand plasma exposure, aggressive process gases, chemical environments, particle-control requirements, elevated temperature, and repeated static or dynamic operation. The company's portfolio combines material formulation for O-rings with composite sealing designs for semiconductor equipment, giving it offerings for conventional seal locations as well as dynamic slit-door interfaces.
Exhibits
The SUPERCHEM® O-RING range includes S360, S543, S549, and S309, with SSK Co., Ltd. positioning these FFKM products for semiconductor and display sealing requirements. Its Nano-Organic Filler and Non-Filler technologies are used to develop FFKM materials with plasma resistance, chemical stability, and very low particle generation for demanding process environments. Compounds including S360, S543, and S549 are engineered for exposure to NF3, O2, O3, and fluorine-based plasma chemistries while maintaining sealing performance at temperatures up to 310°C. S360 is specified for both static and dynamic sealing and is described as maintaining low compression set and strong recovery at temperatures up to 310°C, including conditions involving repetitive motion and other demanding operating conditions. The low particle generation and chemical stability of S360 make it suitable for high-purity process applications identified by the company as CVD, PEALD, Etching, and Ash/Strip. These properties allow S360 to address sealing positions where process cleanliness, chemical exposure, thermal load, and seal recovery must be considered together rather than as separate requirements. SSK Co., Ltd. also offers a Bonded Slit Door, a composite sealing solution in which an FFKM or FKM elastomer is bonded to an aluminum plate for dynamic sealing in semiconductor manufacturing equipment. The integrated Bonded Slit Door design removes friction between metal components and the O-ring, helping prevent O-ring drop-out and twisting within the gland during dynamic operation. By combining the elastomer and aluminum plate in one composite assembly, the Bonded Slit Door is designed to maintain reliable sealing under the demanding movement conditions of semiconductor equipment. Across its FFKM O-rings and Bonded Slit Door, the offering addresses both material-level demands such as plasma and chemical resistance and equipment-level demands such as dynamic sealing stability.
Capabilities and products
- FFKM sealing solutions for semiconductor and display
- plasma-resistant ultra-low-particle FFKM materials
- FFKM sealing up to 310°C
- Bonded Slit Door dynamic sealing for semiconductor equipment