At a glance
| Booth | N0276 |
| Country | TW |
| Website | www.speedfam.com.tw |
Company profile
Speedfam Co., Ltd. was established in 1979 as an independent subsidiary of SPEEDFAM Group, which was founded in the United States in 1959. The company works in global precision planarization technology and equipment for fields including silicon wafers, semiconductor wafers, LCD displays, LED sapphire, precision optoelectronics, precision ceramics and metals. Speedfam Co., Ltd. has accumulated more than 30 years of experience connected with the United States and Japan and provides Total Solution services spanning marketing, process development, design and manufacturing, and technical services. Its own equipment development covers high-precision single-side lapping, grinding and polishing machines, double-side lapping and polishing machines, wafer automatic waxing machines in the SWM/LWM families, wafer-level diamond grinding machines in the BSG family, and edge-grinder design and manufacturing. The company also handles SpeedFam semiconductor-grade high-precision planarization equipment including Lapper, Polisher and DCP systems, together with edge polishers, edge grinders, edge profilers, fine grinders, DSS and related consumables. A core technical specialization is high-precision flattening and cleaning, supported by process work that extends from workpiece experiments and accuracy confirmation through design, procurement, manufacturing, installation and process services. The organization describes its global base and long-term coordination with customers in different industries as inputs to product design, with engineering and service activities connected across equipment development and customer processes. Its operating model combines equipment manufacturing with process development and technical service so customers can work with the same organization from application experiments and accuracy verification through installation and process support.
Exhibits
SpeedFam single-sided lappers and polishers perform surface lapping and polishing to achieve flatness, thickness control and surface-roughness requirements, while double-sided lapping and polishing machines are offered with fixtures and relevant consumables. The company supplies fixtures and consumable products for lapping and polishing and also provides OVERHAUL and RETROFITTING services for semiconductor, LED, solar, optoelectronics, optical and other mechanical equipment used in overseas manufacturing. The self-manufactured single-side equipment lineup includes 15B, 24B, 32B and 50B single-side lapping and polishing machines and a 36B single-side polishing machine. Double-side equipment includes 4-5-6B, 9B and 16B double-side lapping and polishing machines and a 28B double-side lapping machine. Wheel-grinding equipment includes the BSG-V series and a dual-axis automatic wheel grinder, while waxing equipment includes 24 / 32MS and 36MS manual waxing machines and 24SWM and 32/36SWM semi-automatic waxing machines. Grinding consumables include grinding powder, fixtures, grinding plates and diamond grinding wheels, while polishing consumables include polishing fluid, diamond polishing fluid and polishing pads. The product range also lists Melchiorre fine grinders and solution areas covering automation integration, LED-chip back-thinning automation integration, heterogeneous-integration lapping and polishing, silicon-carbide wafer processing, compound-semiconductor materials and academic R&D. For silicon-carbide wafer processing, the listed equipment includes 32BSG-V, FSG-2200, 50ALWM, 40GPAW-OSC and 50GPAW-TD, and the application is identified as 6 / 8 inch SiC lapping and polishing. Single-crystal silicon carbide is described as a semiconductor material for high-power, high-temperature and high-frequency fields that can withstand operating environments up to 1500°C and has high thermal conductivity for heat dissipation. Its bandgap is stated as 3.26 eV, supporting operation at high voltage, high current and high frequency for power-electronic devices such as power diodes, MOSFETs and IGBTs. The material is also described as having high mechanical strength and chemical stability, with wear and corrosion resistance for demanding environments such as oil and gas extraction. The listed silicon-carbide application fields include electric vehicles, renewable energy and aerospace, connecting Speedfam's lapping, polishing, grinding and automation equipment to compound-semiconductor processing requirements. Technical services and equipment refurbishment complement the equipment, consumables, automation-integration and material-processing offerings.
Capabilities and products
- single-side lapping/polishing equipment
- double-side lapping/polishing equipment
- wafer automatic waxing equipment
- wafer-level diamond grinding equipment
- edge-grinder design and manufacturing
- 6/8-inch SiC wafer lapping and polishing
- lapping consumables supply
- polishing consumables supply
- OVERHAUL and RETROFITTING for semiconductor/LED/solar equipment
- LED chip back-thinning automation integration
- heterogeneous-integration lapping and polishing
- fine-grinder supply (Melchiorre)