At a glance
| Booth | K2483 |
| Country | TW |
| Website | www.kensho.com.tw/html/about.php |
Company profile
SHYAN SHENG HITECH CO., LTD. was founded in 1986 as a distributor of factory-automation machinery and components from overseas, helping customers implement automation, reduce costs, and improve production efficiency. Over the years, it built a sales foundation and, as technology industries developed, introduced various high-tech production and inspection equipment. The company sets excellent service quality that meets high customer demand as a goal, operates on a principle of integrity, and pursues practical and steady growth through employee consensus and solidarity.
Exhibits
Its listed offerings include a Desktop Simulated Annealing Quantum Computer, a Printed Circuit Board (PCB) Depaneling Machine, and a Work Assistance Camera System RICOH SC-10A. Its wafer-inspection offering combines defect inspection and dimensional measurements so incorrectly processed wafers do not continue through production, while Confovis measuring systems help identify process deviations, find causes, and support correction. WAFERinspect measuring systems use the patented confocal optical measuring method Structured Illumination Microscopy (SIM) to perform both defect detection and dimensional measurements on one tool. Confocal 3D measurement is independent of material, including silicon, epoxy, glass, chrome, and photoresist, supports artifact-free measurement even on demanding surfaces, reaches 60 confocal frames per second (250 million measuring points / s), and covers layer thickness, film thickness, layer stack, topography, coplanarity, bumps, roughness, and step height. 2D critical-dimension measurements cover line / space, VIAs, oblong holes, and overlay. Defect inspection covers macro defects, micro defects, particle inspection, golden sample, artificial intelligence, and neural networks. Visual-inspection functions include operator mode, color images, depth-of-focus shots, stitching, documentation through a comment function, digital inking, and visual inspection with fine alignment and KLARFF files. The MRSI-M3 3-Micron Flip-chip Die Bonder supports ultra-precision, high-complexity die attach in high-volume production and provides force control, ultra-precise placement, and 360° die orientation for advanced packaging. Its configurable platform combines 3-micron accuracy, automation, speed, and reliability, and supports in-situ eutectic die bonding, UV epoxy die attach, and flip chip assembly. The MRSI-M3 is suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices, and photonic packages, and can handle components from small dies to large sensors. An advanced cast composite base supports fast and accurate moves with virtually no settling time, while a large work envelope supports a wide range of configurations. Its axis system uses brushless DC linear servomotors with linear glass-scale encoder feedback for high speeds and accurate movements, and internal temperature monitoring plus gas cooling of known heat sources is used to minimize thermal expansion. Closed-loop force control supports placement of delicate Gallium Arsenide (GaAs) dies with as little as 10 grams of force and programmable forces up to 2kg. Die can be picked from waffle pack, Gel-Pak®, wafer, tape and reel, and custom trays. Configuration options include epoxy dispensing pumps, epoxy stamping, and eutectic bonding with scrub and temperature control, allowing the MRSI-M3 to handle a wide range of processes.
Capabilities and products
- agency/distribution of factory-automation machinery and components
- supply of wafer 3D/2D defect and dimensional measurement equipment (Confovis)
- supply of 3-micron flip-chip die bonders (MRSI)
- supply of PCB depaneling machines
- supply of work-assistance camera systems (RICOH SC-10A)
- supply of desktop simulated-annealing quantum computers