At a glance
| Booth | R8024 |
| Country | CN |
| Website | en.youibot.com |
Company profile
Shenzhen Youibot Robotics Co., Ltd. is a provider of mobile robotic solutions and specializes in robot-driven automated logistics for semiconductor smart-manufacturing facilities. Its semiconductor solutions use high-precision SLAM navigation technology and advanced software systems to support stable, flexible and highly efficient production operations and intelligent upgrades in semiconductor manufacturing. The company's semiconductor coverage spans nodes, epitaxy and FAB through modules and packaging/testing, and it states that its solutions cover 1st, 2nd and 3rd generation semiconductor manufacturing. Shenzhen Youibot Robotics Co., Ltd. states that it is the No.1 mobile robotics company in semiconductor shipment volume. Its product and software structure combines multiple mobile-robot series with YOUIFleet and YOUITMS software, while semiconductor logistics is organized around material transport, robot scheduling, fleet coordination and integration with manufacturing and warehouse systems.
Exhibits
The Operation Series combines mobile robots with robotic arms, vision, clamping jaws and related technologies so that robots can move between semiconductor processes to transfer and load or unload FOUP Pods, magazines and other materials. The ATS Series Autonomous Transfer Robot is designed for semiconductor and high-tech manufacturing environments, providing precise, reliable and contamination-controlled material transport across production zones with autonomous navigation, intelligent fleet management and system integration for stable 24/7 handling of wafers, FOUPs, FOSBs and other critical materials. Across its semiconductor solution, high-precision composite mobile robots handle FOUP/FOSB, SMIF POD, cassettes and magazines, with the stated goals of improving production efficiency, quality consistency and cost effectiveness in enclosed clean manufacturing environments. The material-handling robots and mobile manipulators connect material flow and information flow between processes and automate wafer transfer or material loading and unloading at workshops and manufacturing equipment, while cobots and mobile robotic platforms with arms are used for human-robot collaborative operation. The software architecture links MES/WMS with Youi TMS for industrial logistics management, including order management, warehouse management, waybill management, transportation-module management, waybill scheduling and robot scheduling, and with Youi Fleet for transportation tasks, vehicle management, route planning, vehicle scheduling and traffic control. OW12 is a mobile manipulator for loading and transferring 12'' FOUP Pods, OW8 is a cobot-equipped mobile manipulator for loading and transferring 8'' FOUP Pods, and ATS is a configurable robot for transferring FOUP Pods in semiconductor manufacturing. The semiconductor robots are described with Class100 cleanliness, smooth contamination-resistant surfaces, reduced human intervention, precise FOUP POD gripping through vision sensors and controlled end grippers, and automatic operation without fixed tracks in complex environments. Built-in SLAM algorithms locate robot position and direction on a map, create movement routes and support obstacle avoidance, while integrated robot controls and end-sensing systems reduce deployment switching and use workflow and logging for operation traceability. A packaging-and-testing case uses 12 robots for loading and unloading, with each robot performing 215 tasks daily, handling 1,070 trays and traveling an average of 9,675 meters; collectively, the 12 robots execute 2,580 tasks, handle 12,840 trays and cover 116,100 meters each day. A FAB inter-bay wafer-transfer case uses 23 robots across 12 Intra Bays to transport SMIF Pods; each robot has 20 storage slots, and the stated solution is 3-4 times more efficient than manual handling and 5 times more efficient than OHT, with 33,120 materials moving daily and a stated labor-shortage figure of 58 employees. For an 8-inch power-semiconductor wafer workshop, more than 80 OW8 wafer-handling robots automate loading and unloading and handle 32,000 FOUPs daily, with mixed-site scheduling across 7 robot types and 24/7 operation. For a high-cleanliness 12-inch wafer-processing workshop operating as a Class 10 cleanroom with equipment required to meet ISO Class 4 standards, five robots are described as supporting the automation upgrade and executing 780 daily tasks. For cross-building 8-inch wafer transport, 12 robots including ATS6 units use vibration-damping storage and Fusion SLAM algorithms, with the stated results including 6,972 daily material transfers and vibration below 0.1g during transport. Within the Operation Series, OW12-300 is designed for 12-inch wafer manufacturing and full-process fab automation, supports FOUP/FOSB/Metal CST, is listed for ISO Class 3 cleanroom compatibility with vibration ≤0.5g, uses a CE & SEMI-certified hardware architecture, carries 12-inch wafer carriers, has an 8 h run time and a size of 1085x775x1510mm. OW8-350 is designed for front-end semiconductor manufacturing with omnidirectional movement and a four-slot carrier for narrow aisles; it is listed for ISO Class 3 cleanroom compatibility, 650 mm narrow-aisle operation, a ≤25 s material pick-and-place cycle time, an 8 h run time and a size of 1070*665*1100mm. OWC is an Open Cassette automated transport robot for semiconductor fabs and multi-point, multi-process Open CST material flows; it is described with an omnidirectional chassis, safety and intelligent scheduling, 24/7 operation, agile handling and efficient docking, with an 8 h run time and a size of 1070*665*1100mm. OT12 is an autonomous material-handling robot for semiconductor chip manufacturing and automated magazine loading and unloading, integrating a mobile robot with a collaborative robot, horizontal and vertical radar detection, Class 100 cleanliness and a vibration level of 0.5 g, with an 8 h run time and a size of 1070*665*1100mm. The OW series, including OW12, OW8 and OWC, is designed for fully automated handling of 12-inch and 8-inch FOUP PODs, SMIF PODs, Open CSTs and Magazins throughout semiconductor manufacturing, using a flexible cobot, end gripper and vision sensors to reduce direct wafer contact and keep vibration below ≤0.5G on flat ground. OW robots interface with electronic shelves, the ATS-series wafer-transfer bus and process equipment for automated pickup and stable transport, while 360° horizontal LiDAR supports navigation and obstacle avoidance and selected models add vertical LiDAR at load height to prevent same-level collisions. The MOS integrated cobot-control system developed by Shenzhen Youibot Robotics Co., Ltd. combines upper cobot control and multiple end-effector sensors in one operating system, reducing multi-system integration complexity and deployment time while workflows and logs provide traceability; the platform also lists planar and vertical safety scanning, electronic-rack storage-level monitoring and an HMI interface for real-time operator inspection. In wafer-handling scenarios, OW-series robots use integrated robotic arms, end clamps and sensors for stable, precise FOUP POD gripping and placement on body storage positions, while sensor-equipped electronic shelves provide FOUP POD traceability and support efforts to reduce production errors.
Capabilities and products
- mobile-robot automated logistics for semiconductor manufacturing
- cross-process FOUP and magazine transfer and loading/unloading
- mobile manipulator for 12-inch FOUP handling
- mobile manipulator for 8-inch FOUP handling
- ATS autonomous FOUP transfer robot
- Open Cassette automated transport robot
- automatic magazine loading and unloading robot
- YOUITMS industrial logistics management system
- YOUIFleet fleet scheduling assistance system