At a glance
| Booth | P5812 |
| Country | CN |
| Website | www.tensun.cn |
Company profile
Shenzhen Tensun Precision Equipment Co., Ltd was founded in July 2006 and develops precision dispensing and precision cutting equipment built around precision motion-control technology. Its two principal equipment lines are dispensing systems and semiconductor cutting or dicing systems. The company applies its equipment to 3C electronics, new-display manufacturing, semiconductor packaging and testing, and related precision-assembly processes. Its core technical capabilities include precision motion control, dispensing process control, and cutting process control. The product platform includes online jet dispensers, desktop dispensing equipment, dispensing valves and controllers, semiconductor cutting machines, and OLED or LED packaging equipment. Semiconductor cutting applications include wafers, LED wafers, EMC lead frames, PCBs, infrared filters, sapphire, and ceramic materials. In display manufacturing, the equipment range covers OLED-related dispensing, bonding, and bending processes. Mobile-device applications include camera modules, displays, speakers, batteries, motherboards, and antenna-related assembly and dispensing. The company reports more than 130 patents associated with its precision-equipment and process technologies. Across these markets, the equipment combines motion accuracy, dispensing control, machine vision, automation, and material handling for production-line integration.
Exhibits
A fully automated LOCA line for AR and VR dual-lens assembly handles loading, film removal, plasma cleaning, air-knife cleaning, visual and laser alignment, LOCA dispensing, and final curing steps. The AR and VR line supports dual dispensing and DOT dispensing, high-vacuum bubble removal, UV pre-curing and curing, Vertex thickness measurement, AOI, and NG sorting. The listed bonding speed is 0.05 mm/s with 0.01 mm/s resolution, and the process description gives a 10-second standing step and 177-second total cycle for one station. With six parallel stations, the AR and VR line lists a takt time of no more than 30 seconds. The JVS100 piezoelectric jet valve can operate in non-contact or contact dispensing and is listed with a minimum glue point of 0.2 mm and minimum volume of 2 nL. JVS100 temperature control is listed at plus or minus 0.2 degrees C, with stable operation at 500 Hz and instantaneous operation up to 1500 Hz. The valve lists a minimum dot size of 150 micrometers, minimum line width of 200 micrometers, and dispensing-volume precision within 2 percent. Applications include SiP, MEMS, SMT, PCB, FPC, and other micro-dispensing processes. FAD9500H is an LED-packaging dispenser for SMD packages including 1010, 1806, 3003, 3004, 3803, 3804, and 3806. For SMD 3806, the listed production rate is 27,000 to 32,000 units per hour; the machine uses three dispensing valves and can add a weight-based closed-loop option. An automated optical-lens inkjet line processes left and right SUB1 and SUB2 products on one line and integrates ink application, film handling, magnetic-ring work, hot-air curing, and waste-film handling. The lens line lists a takt time of no more than 30 seconds and a process cycle of 127.5 seconds. Sherpa91N is a high-precision semiconductor dispenser with listed X/Y repeatability of plus or minus 0.003 mm and Z repeatability of plus or minus 0.005 mm. It supports 8-inch and 12-inch wafer tables and lists positioning capability within 10 micrometers. Sherpa91N applications include SiP, MEMS, CSP, BGA, WLP, underfill, solder, dam-and-fill, and silver-material dispensing. FAD9600 is an automatic LED dispenser with dual stations and a stated efficiency improvement of 20 percent. The system supports four dispensing valves, 0.01 microliter dispensing resolution, positioning accuracy of plus or minus 0.01 mm over 300 mm, and automatic loading. Materials listed for FAD9600 include UV adhesive, red adhesive, hot-melt material, epoxy, and silver paste. FAD9100 supports LED packages including SMD020, 2020, 2835, 3014, 3030, and 5630 and uses three dispensing valves with CCD vision. For SMD3030, the listed FAD9100 production rate is 28,000 to 35,000 units per hour. SVS81 is a single-component screw dispensing system for materials with viscosity from 20,000 to 2,000,000 cP. It supports 0 to 1200 rpm screw speed and listed pulse operation up to 200 Hz for micro-dot and line dispensing. Target materials include silver paste, conductive adhesive, solder paste, UV adhesive, silicone, epoxy, grease, and thermal-interface materials, including high-viscosity or particle-filled formulations. FAD9700 uses dual dispensing heads that can work synchronously or asynchronously for chip-level and package-level dispensing. Applications include COB, EMC3030, and SMD3003, with a listed output of 5,000 to 7,000 units per hour, two valves, dual CCD, and plus or minus 0.05 mm positioning accuracy. The FD400 five-axis dispensing platform is intended for complex three-dimensional surfaces used in AR and VR, mobile, and wearable-device products. The system uses a true five-axis configuration with dual stations and can add 3D line-scan inspection as an option. The platform lists 10 controlled axes, X/Y repeatability of plus or minus 0.005 mm, and Z repeatability of plus or minus 0.01 mm. MSS91 is a peristaltic solder dispensing valve designed for particle-containing fluids used in SiP, BGA, solder, silver-paste, and conductive-material applications. The valve supports pulse control and lists minimum dot and line dimensions of 100 micrometers and 150 micrometers, with a listed maximum dispensing frequency of 150 Hz. The company also offers semiconductor cutting equipment for wafers, LED wafers, EMC lead frames, PCBs, infrared filters, sapphire, and ceramics. Its cutting and dispensing platforms therefore address both material separation and precision material deposition in semiconductor packaging, LED, display, optical, mobile, and AR or VR manufacturing.
Capabilities and products
- Wafer dicing machines
- Substrate dicing machines
- Substrate thinning machines
- Dual-station integrated dicing and sorting equipment
- Chip sorting machines
- Wafer-level dispensing machines
- Substrate-level dispensing machines
- Panel-level packaging dispensing machines
- Heat-spreader dispensing and bonding systems
- Substrate AOI inspection equipment
- Dual-head, dual-station dispensing machines
- Desktop dispensing machines
- Piezoelectric jet dispensing valves
- Volumetric screw dispensing valves
- Two-component screw dispensing valves
- Volumetric dispensing valves
- Pneumatic dispensing controllers
- Peristaltic dispensing controllers
- Heated dispensing controllers
- Automated LOCA bonding equipment for AR/VR dual lenses
- High-speed solder-paste jet printers
- OLED module dispensing and bending process equipment
- Fully automated LED packaging dispensing systems
- Automated inkjet production lines for AR/VR optical lenses
- Multi-angle tilted precision dispensing equipment for semiconductors
- Single-component screw metering and dispensing systems
- Five-axis, dual-station dispensing equipment with 3D vision guidance
- Ultra-low-volume peristaltic dispensing valves for solder paste and silver adhesive
- Precision underfill dispensing
- Precision dam-and-fill dispensing
- Precision dispensing for bonding and sealing
- Dispensing for component encapsulation and pin protection