At a glance
| Booth | T9023 |
| Country | CN |
| Website | expo.semi.org/taiwan2026/Public/eBooth.aspx?BoothID=661898 |
Company profile
Shenzhen SinceVision Technology Co., Ltd. was founded in 2014 and is a manufacturer of sensor technology. The company is described as a China-based industrial-sensor and scientific-imaging company specializing in the R&D and production of industrial sensors, high-speed imaging systems and high-sensitivity cameras. Its broader product scope includes high-speed cameras, sCMOS cameras, 3D cameras, 3D laser profile measurement instruments, point laser displacement sensors, spectral confocal displacement sensors, through-beam edge sensors and color sensors. Applications are listed in industrial automation, automotive, electronics and 3C, lithium batteries, photovoltaics, semiconductors, research and low-light detection. For semiconductor inspection, the company's application information includes wafer flatness, chip defects, thickness and BGA inspection, positioning the portfolio around machine vision, 3D measurement and industrial sensing.
Exhibits
SinceVision 3D Laser Profile is a high-precision non-contact 3D measurement sensor that uses laser triangulation technology for 3D profile, point-cloud and height measurement. The 3D Laser Profile is specified with 6400 pixels, a 67 kHz sampling rate and IP67 protection for semiconductor and industrial measurement. SinceVision Laser Displacement Sensor uses laser triangulation technology for non-contact measurement and is specified with 2 μm accuracy, ±0.1% F.S. linearity and IP67 protection for high-precision semiconductor applications. SinceVision Spectral Confocal Displacement Sensor uses optical dispersion and confocal technology for non-contact height, thickness and profile measurement, with 33 kHz sampling for semiconductor measurement. SinceVision Through-Beam Edge Measurement Sensor uses optical technology for edge and width detection and combines high-speed response with strong anti-interference for stable semiconductor and industrial measurement. The semiconductor-application scope also includes BGA inspection, wafer-flatness measurement, chip-defect inspection and thickness measurement, complementing the dimensional measurements performed by the laser and confocal sensors. The wider imaging and sensing portfolio includes high-speed imaging systems, high-sensitivity cameras, high-speed cameras, sCMOS cameras and 3D cameras for applications that extend beyond semiconductor measurement into industrial automation and research. Together, the 3D laser profile, laser displacement, spectral confocal displacement and through-beam edge measurement products provide non-contact profile, point-cloud, height, thickness, edge and width measurement functions with stated semiconductor applications.
Capabilities and products
- laser-triangulation 3D profile and height measurement
- 2 μm-accuracy non-contact laser displacement measurement
- spectral-confocal non-contact height, thickness and profile measurement
- through-beam edge and width measurement