At a glance
| Booth | J3240 |
| Country | TW |
| Website | semtekcorp.com/en/home |
Company profile
Semtek Corporation was established in July 2004 and specializes in the design and manufacturing of automation equipment. Its research and development team has semiconductor-process experience and continues working on research and innovation for equipment intended to improve manufacturing processes. The company designs and manufactures dedicated process-improvement machines, positioning custom equipment development as a way to address specific semiconductor production problems. A customer-oriented operating model starts from solving customer problems, and equipment can be customized and planned according to individual customer requirements rather than only offered in a fixed configuration. Semtek Corporation states that it aims to provide equipment and services at competitive cost and in a short delivery period while maintaining the quality required by the customer. Its internal facilities include a cleanroom and various test machines that are planned to meet customer needs and support testing during equipment development and validation. The combination of automation-equipment specialization, semiconductor process experience, customization, internal testing capability, and process-improvement machine design defines the company’s engineering and service model.
Exhibits
The named equipment range includes Metal Lift Off, Flux Cleaner (Wafer Form), and Wet Etcher systems for semiconductor and wet-process applications. The Foup Cleaner is applicable to cleaning multiple carrier types and uses deionized water, or DIW, throughout the complete cleaning process. High-pressure nozzles and software-controlled operation allow the system to adjust nozzle angle and orientation for directional cleaning, enabling targeted cleaning of specific areas. That directed cleaning is intended to remove residual photoresist and adhesive contaminants, with the product information also highlighting particle removal and reduction of process contamination. The Foup Cleaner information lists a 30% space-saving benefit and identifies safety improvement as another product characteristic. Compatible carrier types include FOUP, FOSB, Frame Cassette, and Boat Jig, giving the cleaner a stated range of carrier formats rather than a single dedicated carrier type. The standard configuration includes a lid-opening function, electrostatic fan, safety detection, E84 communication, RFID reading, SECS/GEM protocol, DIW heating, DIW cleaning and drying, N₂ purge, and wafer mapping. For requirements outside standard equipment, Semtek Corporation can plan customized machines according to customer needs and use its cleanroom and test machines to support customer testing and process-improvement development. Safety detection, electrostatic control, identification, host communication, DIW thermal control, purge, and wafer-mapping functions are therefore built into the stated standard Foup Cleaner configuration.
Capabilities and products
- automation equipment design and manufacturing
- Metal Lift Off equipment
- wafer-form flux cleaner
- wet etcher
- FOUP and multi-carrier cleaning equipment