At a glance
| Booth | H0031, S8343 |
| Country | TW |
| Website | www.sekisui.co.jp |
Company profile
SEKISUI CHEMICAL CO., LTD has supplied products to IT fields including LCD and semiconductors and states that continuous product improvement accumulates technology and creates new products, with SOL, DAF, and DAP cited as examples. The company organizes its global business around three strategic fields: Electronics, Mobility, and Industrial. SEKISUI CHEMICAL CO., LTD also states that it has participated in past exhibitions in Japan and Singapore. SEKISUI CHEMICAL CO., LTD says it believes these products have contributed to the progress of IT industries.
Exhibits
In Electronics, SEKISUI CHEMICAL CO., LTD supplies materials for various displays, electrical and communications equipment, substrates, and semiconductors; in Mobility it supplies automotive materials including interlayer films for laminated glass and aircraft components; and in Industrial it supplies adhesive tapes, adhesives, and plastic containers for a range of industries. SELFA is a semiconductor-process tape that combines high adhesion with easy release: UV irradiation generates gas between the tape and adherend, reducing adhesion to zero for easy peeling, and the process is described as allowing work on thinly ground wafers without damage. SELFA is mainly used in semiconductor wafer and chip manufacturing, with three product types for packaging production, wafer support, and plating processes, and proposals can be configured for single-sided or double-sided use. Its core functions include heat resistance specified at 260°C, gas-generation release for damage-free peeling, and Pre UV technology for low residue and a wide process window. In its two-stage UV process, Pre UV cures the adhesive layer to greatly reduce adhesion, limit adhesion increases during heat treatment, and reduce residue; subsequent UV treatment generates nitrogen gas between SELFA and the glass carrier until the gas area expands across the interface, after which the carrier glass can be removed with almost no force. The double-sided heat-resistant SELFA HW Series is listed for back-grinding through dicing, with heat and chemical resistance, gas-generation damage-free release, and tape-style glass support for improved handling; the single-sided heat-resistant SELFA HS Series protects devices during heat and chemical processes, suppresses warpage during heat treatment, and combines strong adhesion with low residue; and the single-sided self-releasing SELFA MP Series protects devices during plating and uses UV self-release for easier post-plating peeling. Application examples list CMOS image sensors with double-sided heat-resistant SELFA HW, stacked memory with SELFA HW and single-sided heat-resistant SELFA HS, communication modules (SiP) with SELFA HS, application processors (FOWLP) with SELFA HW and HS, embedded-component substrates with SELFA HW, HS, and MP, and power semiconductors with SELFA MP. For process automation, the company states that partnerships with equipment manufacturers can support fully automated lines for productivity improvement and environmental-load reduction, and it names Takatori WSM-200B wafer bonding equipment and Takatori WSR-200 wafer debonding equipment. For reuse, SELFA is described as avoiding dents in carrier glass and enabling more than 20 reuse cycles compared with more than 10 for liquid materials; its stripping method uses a UV lamp, reuse mainly uses solvent cleaning, and the stated effect is reduced damage through UV release compared with laser-release damage associated with liquid materials. The SELFA performance table lists heat-resistance entries of 260°C / Reflow, 250°C / Reflow, 80°C / 30min., 220°C / 2hr, and 220°C / 2hr; under wafer-side adhesion strength from initial to Pre UV it lists SUS: 10.5 → 0.01, SUS: 3.83 → 0.08, SUS: 17.5 → 0, Si: 0.08 → 0.02, Si: 0.06 → 0.02, Si: 16.1 → 0, -, Cu: 4.51 → 0.10, and Au: 13.5 → 0, while under the carrier side it lists Glass: 0.06 → <0.01, -, and -.
Capabilities and products
- UV-release tape for semiconductor processes
- 260°C heat-resistant process tape
- UV gas-release removal of glass carriers
- self-releasing protective tape for plating processes