At a glance
| Booth | H0031, S8343 |
| Country | TW |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Solder; Solder Balls and other Soldering Materials · Tape Automated Bonding (TAB) Accessories · Thin Film; Dielectric Film Materials |
| Website | www.sekisui.co.jp |
Company profile
Sekisui has been offering highly competitive products to IT fields: LCD, semiconductor, etc. Sekisui believes its products have contributed to the progress of IT industries. Moreover, our constant improvement of the products is leading to accumulation of the technology and creation of further new products. The products like SOL, DAF, DAP prove it. Sekisui successfully joined the past exhibitions in Japan, Singapore, etc. We will give you interesting 'SURPRISE' in Taiwan, too. Please come to our booth and touch Sekisui technology!
Capabilities and products
- adhesives for semiconductor and LCD fields
- conductive and non-conductive bonding materials
- die attach compounds
- epoxies
- interconnect materials including wire, ribbon, tape, capillaries, and tools
- solder, solder balls, and soldering materials
- underfill materials