At a glance
| Booth | Q6343 |
| Country | KR |
| Website | www.seceng.co.kr |
Company profile
SEC CO., LTD. designs and manufactures industrial X-ray inspection systems used by manufacturers in semiconductor, automotive, SMT and battery industries worldwide. Founded in 1991, the company is headquartered in Suwon, Korea and states that it has more than 30 years of expertise in inspection technology. That experience includes more than 20 years in X-ray system design. SEC also states that it has spent more than 15 years developing Korea's only in-house X-ray tube. The company maintains global offices in the U.S., Europe, China and Vietnam to support customers across multiple regions. Its X-eye Series includes off-line 2D and 3D CT inspection systems for semiconductor packages, SMT, die-casting and automotive components. The off-line X-ray product families named by SEC include the 5000N, SF160, PCT and Nano-CT series. For automated production inspection, SEC offers high-speed in-line AXI systems for Industry 4.0 Smart Factory environments using a deep-learning AI algorithm. The in-line AXI models listed by the company include 6100AXI, 6200AXI, 6300AXI and the NF120A/AW series. Its nano-focus X-ray systems use a 200nm focal spot for wafer-level package, TSV, micro-bump and Cu-pillar inspection. SEC's Semi-Scan-SW is an inline X-ray inspection system developed for HBM production. The Semi-Scan-SW detects defects in the 3–5µm range during HBM stacking processes. The same system supports TGV process inspection for glass substrates and bonding inspection between chips and interposers in wafer-level packaging. SEC's proprietary Damage-Free Technology uses patented collimator and filter designs to enable damage-free inspection of advanced memory devices. Key components including X-ray tubes, LINAC systems and tabletop SEMs are developed and manufactured in-house. Through those regional offices, SEC delivers its X-ray inspection solutions to customers across the globe.
Exhibits
The X-eye NF120AW is an automatic X-ray inspection system optimized for wafers and semiconductor packages. It uses nano-scale focal-spot technology for defect detection in TSV, Micro Bump and Solder Bump structures. For TSV, Micro Bump and Solder Bump inspection, the listed defect categories are Void, Short, Bridge, Big ball and Missing. For Bump Via inspection, the listed checks are Via Distance and Extra Via. The NF120AW uses an open X-ray tube specified at Max 120kV / 200uA / 24W. Its detector is a 12-inch FPXD with 9M resolution and 14bit grayscale. The listed table size is 300×300mm. The motion specifications include a T-axis of 70° and an R-axis of 360°. These NF120AW specifications complement SEC's broader 200nm nano-focus inspection capability for wafer-level packages, TSV, micro-bumps and Cu pillars.
Capabilities and products
- design and manufacturing of industrial X-ray inspection systems
- offline 2D/3D CT X-ray inspection
- deep-learning AI inline AXI inspection
- 200 nm nano-focus X-ray inspection
- 3–5 µm inline X-ray defect inspection for HBM
- TGV process inspection for glass substrates
- chip-to-interposer bonding inspection
- damage-free X-ray inspection of advanced memory devices
- in-house X-ray tube development and manufacturing
- in-house LINAC system development and manufacturing
- in-house tabletop SEM development and manufacturing