At a glance
| Booth | Q6343 |
| Country | KR |
| Product categories | Package Inspection; Lead Scanners · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · X-ray; XRF; 3-D X-Ray; LEXES Systems · Measurement; Inspection Service |
| Website | www.seceng.co.kr |
Company profile
SEC Co., Ltd. designs and manufactures industrial X-ray inspection systems trusted by leading manufacturers in semiconductor, automotive, SMT, and battery industries worldwide. Founded in 1991 and headquartered in Suwon, Korea, SEC has over 30 years of expertise in inspection technology, including 20+ years in X-ray system design and 15+ years developing Korea's only in-house X-ray tube. With global offices in the U.S., Europe, China, and Vietnam, SEC delivers world-class solutions to customers across the globe. X-ray Inspection (X-eye Series) Off-line X-ray: 2D/3D CT systems for semiconductor PKG, SMT, die-casting, and automotive components (5000N, SF160, PCT, Nano-CT series) In-line AXI: High-speed automated inspection for Industry 4.0 Smart Factory with deep learning AI algorithm (6100/6200/6300AXI, NF120A/AW series) Nano-focus X-ray: 200nm focal spot size for wafer-level PKG, TSV, micro-bump, and Cu pillar inspection HBM Inspection (Semi-Scan-SW) SEC recently developed the Semi-Scan-SW, an inline X-ray inspection system for HBM production. The system detects defects in the 3–5µm range during HBM stacking processes and supports TGV process inspection for glass substrates, as well as bonding inspection between chips and interposers in wafer-level packaging. SEC's proprietary Damage-Free Technology, based on patented collimator and filter designs, enables damage-free inspection of advanced memory devices. Key components including X-ray tubes, LINAC systems, and tabletop SEMs are developed and manufactured in-house.
Capabilities and products
- Damage-Free Technology for advanced memory inspection
- HBM stacking defect detection in the 3–5µm range
- Semi-Scan-SW inline X-ray inspection system for HBM production
- TGV process inspection for glass substrates
- chip-to-interposer bonding inspection in wafer-level packaging
- deep learning AI algorithm for AXI inspection
- in-house X-ray tubes, LINAC systems, and tabletop SEMs
- in-line AXI high-speed automated inspection
- industrial X-ray inspection systems
- nano-focus X-ray with 200nm focal spot for TSV and micro-bump inspection
- off-line 2D/3D CT X-ray systems for semiconductor PKG
Related product topics
- Semiconductor Inspection Equipment
- Defect & Particle Inspection Systems
- Semiconductor Packaging Inspection Systems
- AI-Powered Inspection
- Industrial X-Ray Inspection Systems
- X-Ray CT Inspection Equipment
- Advanced Packaging Substrate Inspection
- Automated Optical Inspection Systems
- AI Visual Inspection Systems
- TGV and Via 3D Inspection
- Industrial CT and X-Ray Metrology Systems
- Nano X-Ray Microscopy and Mapping