At a glance
| Booth | M0338 |
| Country | TW |
| Website | www.scientech.com.tw |
Company profile
Scientech Corporation supplies equipment and Wafer Reclaim Service to the semiconductor and FPD industries, with market coverage spanning SEMI Front-End, Advanced Packaging, Compound SEMI, MEMS, LED, FPD, Mini-LED, Micro-LED, and Analytical Instruments. Established in Taipei, Taiwan in 1979 as a representative for the semiconductor industry, Scientech Corporation expanded into Wet Process Equipment manufacturing, Temporary Wafer Bonding/De-Bonding Equipment, and 300mm Wafer Reclaim Services for Silicon and SiC customers. The company was registered on Taiwan's Emerging Stock Market on April 23, 2012 and publicly listed in Taiwan on March 12, 2013. Its development history includes a Hsinchu office opened in 1990 to serve Hsinchu Science Park customers, a Tainan office in 1999 for localized support in southern Taiwan, a Taipei Neihu office in 2001, completion of its Hsinchu plant and office building in 2003, and establishment of its Hukou factory in 2004 for R&D, production, and sales of semiconductor and optoelectronic process equipment. In 2005 it invested in SCIENTECH (Shanghai) Trading Co., Ltd. and SCIENTECH ENGINEERING USA CORP, in 2009 it secured domestic semiconductor customer orders and produced 12" self-developed equipment, in 2014 it developed 8" & 12" single-wafer wet etching and cleaning equipment and a 300mm glass carrier wafer reclamation process, and in 2016 it developed 300mm glass carrier wafer debonding equipment. A 12-inch Glass Coater (Spin Coater) obtained SEMI S2 certification in 2015, and the company states that its product lines are ISO certified while listing ISO 56005:2020, ISO 9001:2015 at Taipei, Hsinchu, and Hukou sites, ISO 14001:2015 and ISO 45001:2018 at Hukou, ISO 22301:2019 and ISO 27001:2022 compliance audits at Hsinchu and Hukou, and ISO 50001:2018 at Hukou. Scientech Corporation also lists a Bronze Medal under the Talent Development Quality Management System (Enterprise Edition) and recognition as a 7th Mid-Sized Enterprise with High Potential. Its timeline records Dun & Bradstreet certification in 2021, 2022, and 2023; a Ministry of Economic Affairs Industrial Upgrade and Innovation Program Subsidy for a Thematic R&D Project in 2023; TIPS-AA 2016 certification in 2019 and 2022, with documentation-review approval in 2021; and Taiwan Intellectual Property Management System certification under the 2016 edition in 2017 and the 2007 edition in 2016. The timeline also records the Health Promotion Mark in 2018 and 2021 and the Health Promotion Administration's Outstanding Healthy Workplace certification and Dynamic Vitality Award in 2014. Scientech Corporation identifies global service and affiliates in China, the USA, and Europe. Scientech Corporation also records ISO 27001:2013 certification at its Hsinchu and Hukou sites in 2021.
Exhibits
Since 2015, Scientech Corporation has developed and manufactured Release Layer Coaters for glass release-layer coating in Wafer Thinning, BGBM (Backside Grinding & Backside Metallization), and advanced semiconductor packaging, with the equipment described as widely adopted and recognized by domestic foundry and packaging and test companies. For Chiplet heterogeneous integration and HBM vertical stacking yield challenges, Scientech Corporation developed the Post-Dicing Wafer IR inspection system DSI-3000T, a non-contact, high-performance internal-defect inspection solution designed to inspect through dicing tape where traditional AOI cannot. Its wafer-reclaim offering lists Copper (Cu) and Aluminum (Al) process lines and states a capacity of 220,000 wafers per month (160k WPM). The Vertabake Series is a wafer batch baking solution for advanced semiconductor packaging that handles one batch of 25 wafers per bake, supports vertical or horizontal baking, uses a tilt-angle wafer cassette clamp to prevent wafers from falling or colliding with the cassette holder during handling, and is applied to pre-molding baking and pre-underfill baking. The WSE Panel Series is batch panel-level wet process equipment that can process multiple panels in one batch with multiple tanks for different chemicals, supports hardware and software customization and panel-size customization, and is used for panel-level advanced packaging including FOPLP, FoCoS (Fan Out Chip on Substrate), and PiFO (Pillar integration FO), with PR/PI strip and polymer removal, Metal Etch, and Wafer reclaim processes. The Pyxis Series Debonding and Cleaning Equipment provides customized hardware and software and high-efficiency production for glass and wafer cleaning after debonding in semiconductor wafer thinning and advanced packaging, with applications covering semiconductor wafer thinning, BGBM, compound semiconductor wafer thinning using SiC/GaN, advanced semiconductor packaging, and Glass cleaning. Developed with 3M, the Pyxis FDB and TDB Series includes Frame Debonding Equipment and Taiko Debonding Equipment for glass debonding in wafer thinning and BGBM, and lists high-efficiency production, lower consumables cost (Low CoO), no wafer cleaning required after debonding, applications in semiconductor wafer thinning, BGBM and SiC/GaN compound semiconductor wafer thinning, and Frame debonding and Taiko debonding processes. Developed with 3M, the Pyxis RL Series Glass Releasing Layer Coating Equipment supports wafer thinning, BGBM, advanced semiconductor packaging, and SiC/GaN compound semiconductor wafer thinning, and lists high-efficiency production, excellent releasing-layer uniformity, a dispense-nozzle-tip auto-clean function, a cup auto-clean function, and Glass release layer coating as its applicable process. The Pyxis Panel Series is single-panel release-layer coating equipment for panel-level packaging, with release-layer uniformity, high-efficiency production, leading-edge technologies, and panel-size customization, and it supports FOPLP, FoCoS, and PiFO applications with Releasing layer coating as the primary process. The Polar Panel Series is single-panel wet process equipment for panel-level packaging, with hardware and software customization, particle-removal performance, etching uniformity, leading-edge technologies, and panel-size customization, and it supports FOPLP, FoCoS, and PiFO applications with PR strip, UBM Etch, and Metal Etch processes. The Polar Series is a single-wafer surface-treatment system for advanced clean and etch processes, offering high throughput and a compact footprint together with customized hardware and software, chemical recycling, high-warpage wafer transfer, multi-layer metal etch in the same chamber, and etch-rate and uniformity performance; its fields include semiconductor FEoL, advanced packaging, SiC/GaN/GaAs/InP compound semiconductors, MEMS, LED, Mini LED, and Micro LED, with PR Strip, Wafer Clean, UBM Etch and Metal Etch, Flux Clean, Final Clean, Mask Clean, Frame Clean, and Spin Etch with Immersion Function processes. Developed with 3M, the Pyxis TB Series Temporary Bonding Equipment provides glass bonding for wafer thinning and BGBM and is also applicable to advanced semiconductor packaging, with high-efficiency production, lower consumables cost (Low CoO), no wafer cleaning required after debonding, applications in semiconductor wafer thinning, BGBM, SiC/GaN compound semiconductor thinning and advanced packaging, and Temporary bonding as its applicable process. The WS (Wet Station) Series is batch wafer wet process equipment that processes up to 50 wafers per batch with multiple tanks for different chemistries and supports pre-film clean, etch, post-etch clean and photoresist stripping, with a smaller footprint, productivity and cleaning-performance features, customized hardware and software, Cassette-less, Cassette-type and Boat-type transfer options, multi-functional dryers, particle removal and etching uniformity; its fields include semiconductor FEoL, advanced packaging, SiC/GaN/GaAs/InP compound semiconductors, MEMS, LED, Mini LED and Micro LED, and its processes include Metal/Oxide/Nitride etch, PR/PI strip and polymer removal, Pre-clean/Post clean/Flux clean, and electroless Zn/Ni/Pd/Au plating.
Capabilities and products
- glass release-layer coating equipment
- temporary wafer bonding equipment
- wafer debonding equipment
- batch panel-level wet process equipment
- post-dicing wafer IR defect inspection
- 300mm silicon and SiC wafer reclaim service