At a glance
| Booth | J2734 |
| Country | TW |
| Website | www.rorze.com/en/products_category/wafer-transfer-system |
Company profile
Rorze Technology, Inc. develops, manufactures, sells and maintains automation systems in the Taiwan market, with wafer handling systems explicitly included in its stated scope. Within the RORZE network, Rorze Technology, Inc. is listed as the Taiwan base and as a direct 100% group stake, and the Taiwan operation is identified with ISO 9001 Quality Management System certification. Rorze Technology, Inc. operates within a global network intended to support domestic and international customers, with RORZE bases and group companies covering the U.S.A., Vietnam, Taiwan, Korea, Singapore, China, Germany, France and Japan. The RORZE group corporate profile states that RORZE CORPORATION was established on March 30, 1985, is listed on the Tokyo Stock Exchange Prime Market under securities code 6323 and has capital of 982 million Japanese Yen. For the year ended February 2026, the group profile lists net sales of 69,754 million Japanese Yen and consolidated net sales of 128,794 million Japanese Yen, while the employee count at the end of February 2026 is listed as 362 and 4,551 on a consolidated basis. The RORZE group business outline covers development, design, manufacturing and sales of automation systems for semiconductor and FPD production, with semiconductor automation identified as the main business accounting for more than half of sales. The semiconductor automation systems are described as combining low particle generation, high throughput and high reliability to support semiconductor manufacturing lines, while FPD automation applies technologies cultivated in semiconductor automation to achieve high throughput and reliability. The group also develops analysis devices that automatically analyze metal impurities in Si wafers using ICP-MS, life-science automation using incubators and software for cell-culture operations, and compact, high-reliability, high-functionality motion controllers that support semiconductor and FPD products. Its Japanese domestic base structure includes the Head Office, Yokohama Office and Kyushu Factory, with ISO 9001, ISO 14001 and ISO/IEC 27001 listed in the domestic and overseas base information. Across overseas operations, the U.S.A. base handles automation-system development, manufacturing, sales and maintenance; the Vietnam base handles motor-control devices, semiconductor-production robots and robot machinery parts; Korea handles automation-system development, manufacturing, sales and maintenance; Singapore handles sales and maintenance; China handles design, manufacturing, sales and maintenance; and Germany handles import, sales, maintenance and broking of equipment and parts for the European market. The Vietnam base lists ISO 9001, ISO 14001, ISO/IEC 27001 and ISO 10002, the Korea base lists ISO 9001 and ISO 14001, and the Germany base lists ISO 9001, showing how quality and management certifications appear across the group's service network. A June 2026 Taiwan description further presents Rorze Technology, Inc. as the Taiwan company associated with Japan based RORZE, focused on semiconductor wafer handling and automation with standardized processes, traceable maintenance, structured training, rapid assessment of production issues and local Taiwan service.
Exhibits
The wafer-handling offering includes the Wafer Handling System and the RR481/boomerang arm vacuum robot in a double-arm configuration, with high positioning repeatability and highly reliable vacuum partition performance. RR481 is identified as the flagship vacuum robot in the MUSASHI Series and is intended for high-vacuum processes, thin-film deposition including CVD and PVD, Etching, EUV, measurement and front-end processes. The RR481 description combines low contamination probability, high-precision transfer and a small rotation radius with a steel-belt arm, a high-rigidity drive structure and a vacuum-compatible motor. Its automatic wafer-position compensation function can correct offsets accumulated over multiple process steps, with the stated purpose of improving transfer stability and yield. The RR481L200 double-arm boomerang robot uses DDM, identified as a vacuum direct drive motor, in its drive section to achieve high positioning repeatability and reliable vacuum partition performance, while the steel-belt-driven arm mechanism permits a long end-effector within a small rotation area. RR481L200 supports a long end-effector for long reach, a narrow gate opening size of 15mm, high accuracy, ultrahigh-vacuum operation, high throughput and the AWC wafer-position-compensation option. The product supports substrates up to 300mm wafers, has a capacity of 3.0kg/10 Nm at the wrist attachment section including the end-effector, and gives a substrate-center transfer distance of 715mm for a 300mm wafer. Its Z-axis stroke is 70mm/140mm, rotation is not limited, rotation diameter is 530mm, transfer accuracy in X and Y is ±0.1mm and mass is 100kg. The listed vacuum-proof level is 10E-6 Pa, the helium leakage rate is 5x10E-9 Pa.m3/sec He at a base vacuum of 5x10E-4 Pa, and the operating temperature is 80℃ or less. Materials used in vacuum are listed as Aluminum, Stainless steel, AM350 (Bellows), Ni-plated Magnet and Fluorine-based O-ring, matching the materials identified for the RR481 series. The motor specification is a vacuum direct drive motor with a servo motor on the Z-axis, the encoder specification is ABS, utilities are 48V DC for motor drive and 24V DC for communication, and communication uses TCP/IP. Available options listed for RR481L200 include a teaching pendant and a power unit with 200 V AC input, completing the robot's integration options for wafer-transfer equipment.
Capabilities and products
- semiconductor automation system development, manufacturing and maintenance
- wafer handling system
- double-arm vacuum wafer-transfer robot