At a glance
| Booth | N0492 |
| Country | SG |
| Website | rokkogroup.com |
Company profile
ROKKO Systems Pte Ltd is a precision engineering group principally engaged in providing automated equipment and precision engineering services to customers in the semiconductor and electronics industries. The company designs and manufactures proprietary semiconductor assembly equipment and precision tooling for use in the semiconductor industry. Its stated semiconductor manufacturing scope also includes lead frames, so the company's own description covers semiconductor assembly equipment, lead frames and precision tooling as designed and manufactured product areas. In 2011, Rokko Leadframes Pte Ltd was incorporated as a new business unit to expand the business and services offered to customers. That lead-frame business unit provides Stamping, Chemical Milling, Plating, Taping, Cut Downset and other lead-frame-related services, adding multiple manufacturing and finishing operations around the lead-frame offering. The group's principal business description therefore combines automated production equipment with precision engineering services, while its product description identifies company-designed assembly equipment, lead frames and precision tooling as concrete semiconductor manufacturing deliverables. ROKKO Systems Pte Ltd presents the lead-frame business unit as an expansion of what it can offer customers rather than as a separate market, linking lead-frame fabrication and finishing services back to the semiconductor and electronics customers served by the precision-engineering group.
Exhibits
In 2008, ROKKO Systems Pte Ltd launched Twin-Track Auto Sawing and Sorting and a Ball Mount for the semiconductor market as part of its assembly-equipment offering. The RS8000 Series Twin Track System is described as improving UPH output by 20% to 100% compared with the conventional single-track format. For package singulation, the company states that the RS8000 Series can deliver an average 30% COO improvement in conjunction with its competitive pricing. The FX300+ is a BGA/CSP ball mount designed to handle large-width substrates in semiconductor production. ROKKO Systems Pte Ltd describes the FX300+ as the fastest UPH ball mount available in the market and states that it can handle solder balls as fine as 0.2mm. The FX300+ is designed for the needs of demanding production environments, combining its large-substrate handling capability with fine solder-ball handling and high-UPH positioning in the company's product description. Together, the Twin-Track Auto Sawing and Sorting system, RS8000 Series performance claims and FX300+ BGA/CSP ball-mount capability address semiconductor assembly operations that involve singulation, sorting and ball mounting. The 2008 product introduction explicitly pairs Twin-Track Auto Sawing and Sorting with the Ball Mount offering, and the subsequent performance details distinguish the RS8000 Series by its twin-track UPH improvement and the FX300+ by substrate width, fine solder-ball size and production-environment capability.
Capabilities and products
- semiconductor assembly equipment design and manufacturing
- semiconductor precision tooling design and manufacturing
- twin-track automatic sawing and sorting equipment
- BGA/CSP ball mount equipment
- leadframe stamping
- leadframe chemical milling
- leadframe plating
- leadframe taping
- leadframe cut downset services