At a glance
| Booth | N0492 |
| Country | SG |
| Product categories | Ball Placement; Attach Systems · Device Handling; Feeding Systems · Dicing; Sawing; Scribing; Separation Equipment · Marking; Imprinting; Labeling Equipment · Lead Frames & Headers: Etched; Stamped · Machine Shop; Fabrication Service · Micro Machining services (small hole drilling and milling) |
| Website | www.rokkogroup.com |
Company profile
We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary assembly equipment and precision tooling for use in the semicon arena. In 2008, Rokko launched and offered the latest cutting-edge technology Twin-Track Auto Sawing and Sorting and the fastest Ball Mount to the semicon market. RS8000 Series, the Twin Track System has showed to improve UPH output from 20% up to 100% from current conventional single track format. With competitive pricing, you are able to achieve on average 30% COO improvements on your package singulation. FX300+, a BGA/CSP ball mount, is capable of handling large width substrate. It is the fastest UPH ball mount available in the market handling solder ball as fine as 0.2mm. It is designed to cater for the need of the most demanding environment of today’s production. In 2011 a new BU, Rokko Leadframes Pte Ltd, was incorporated and it is to expand the business and services Rokko offers to the customers. The services provided by the BU include Stamping, Chemical Milling, Plating, Taping and Cut Downset and other LF-related services.
Capabilities and products
- 0.2mm solder-ball handling for ball mount
- FX300+ BGA/CSP ball mount
- RS8000 Series Twin-Track Auto Sawing and Sorting
- leadframe chemical milling, plating, taping and cut downset
- leadframe stamping
- package singulation sawing and sorting
- precision tooling for semiconductor assembly
- proprietary semiconductor assembly equipment