Rigaku Corporation

Exhibitor at SEMICON Taiwan 2026 · Booth N0592

Booth N0592Country JP12 product topics
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BoothN0592
CountryJP
Websitewww.rigaku.com/index_world.html
Exhibitor profile

Company profile

Rigaku Corporation was founded in 1951 in Tokyo, Japan and operates as an analytical and industrial instrumentation company with a global presence and more than 2,000 employees worldwide. X-ray and related technologies form the foundation of its business, covering X-ray diffraction (XRD), thin-film analysis with XRF, XRD and XRR, X-ray fluorescence spectrometry with TXRF, EDXRF and WDXRF, small-angle X-ray scattering (SAXS), and protein and small-molecule X-ray crystallography. Its technical scope also includes Raman spectroscopy, X-ray optics, semiconductor metrology using TXRF, XRF, XRD and XRR, X-ray topography imaging, X-ray sources, computed tomography, non-destructive testing and thermal analysis. Rigaku works with customers in industry, academia and government to develop tailored solutions, using collaboration between users and employees to align product development with customer needs and market trends. The company's products and services are used in fields including semiconductor chip design, drug discovery and nanotechnology research, connecting analytical instrumentation with both industrial manufacturing and scientific research. Rigaku also describes more than 70 years of partnership in X-ray analysis and inspection equipment as part of the background to its current product lines.

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Exhibits

For semiconductors and micro-electronics, Rigaku supplies X-ray metrology solutions for in-process R&D and high-volume manufacturing, with WDXRF, XRR, EDXRF & Optical, TXRF, XRD, HRXRD and CDSAXS tools used to measure thickness, composition, density, roughness, surface contamination, crystallite size, stress/strain, CD and shape. Wafer metrology supports IC design and manufacturing by controlling film properties, linewidths and potential defect levels, and the semiconductor metrology tools are described as supporting process development, process control and yield enhancement. The TXRF series is used in semiconductor manufacturing and R&D for high-sensitivity detection of trace-element surface contamination, with integrated Vapor-Phase Decomposition (VPD) used to lower detection limits for quantitative thin-film analysis. The WDXRF series measures material thickness and composition, including light elements, and named semiconductor solutions include AZX 400 and WaferX 310. Hybrid metrology combines XRR, EDXRF, XRD and optical techniques for multilayer samples in BEOL and packaging, as well as ultrathin multilayers and unpatterned or patterned wafers. For semiconductor process measurements, XRD, XRF, XRR and X-ray topography (XRT) tools measure parameters including thin-film thickness, composition, roughness, density, porosity and crystal-structure defects, while process TXRF and VPD-TXRF tools address contamination measurement. Beyond semiconductor metrology, X-ray diffraction is used to identify and refine powder and polycrystalline materials and to study crystalline phases, thin-film structures, crystalline quality and preferred orientation, while SAXS measures the size, shape and arrangement of nanoscale structures. X-ray residual-stress analysis provides a non-destructive method for measuring stress in solid materials, and the XRF portfolio spans WDXRF, EDXRF and TXRF for qualitative and quantitative elemental analysis across different concentration ranges and sample types. Crystallography products include single-crystal X-ray diffraction for determining three-dimensional atomic structures of small molecules and proteins, together with electron diffraction for samples smaller than the practical limit of X-ray diffraction. For imaging and non-destructive testing, X-ray computed tomography analyzes internal structures at micron to submicron resolution without altering the sample, and related platforms can combine PET, SPECT, optical imaging and 2D, 3D or 4D CT for preclinical research. Thermal-analysis instruments include DSC for measuring changes in thermal energy during programmed heating or cooling, STA for simultaneous TG and DSC measurements, and TMA for measuring dimensional change under a non-oscillating compression, tension or bending load. Handheld Raman products include CQL Max-ID with an onboard library covering more than 13,000 items, CQL Narc-ID for presumptive identification of narcotics, precursor chemicals and cutting agents, and Progeny for raw-material identification and verification. Rigaku also supplies X-ray analytical components including microfocus rotating-anode and sealed-tube X-ray sources, EUV and X-ray optics, and high-resolution detectors such as silicon-drift or silicon-strip detectors, gas-filled proportional counters and scintillation detectors. Process-control instruments perform online elemental analysis by EDXRF or X-ray transmission, including elemental analysis of liquid streams and fixed-position web or coil applications and sulfur measurement in crude oil, bunker fuel, fuel oils and other highly viscous hydrocarbons. Automation products include LabLinc Studio for instrument connectivity, standardized measurement and analysis, result return and sample handling, and the Rigaku Automation Interface (RAI), an open Python orchestration interface for integrating Rigaku instruments into autonomous laboratories. The semiconductor metrology offering is backed by global 24/7 service and support for process R&D and high-volume manufacturing, extending the measurement systems with ongoing service for process development and yield improvement.

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