At a glance
| Booth | N0184 |
| Country | TW |
| Website | www.reciftech.com |
Company profile
RECIF Technologies Taiwan Co., Ltd. works in robotic handling equipment for semiconductor manufacturing and draws on over 40 years of semiconductor-industry experience as a wafer-handling specialist. In the south west of France, RECIF Technologies designs, manufactures, and distributes fully automated atmospheric handling equipment, including wafer sorters and Equipment Front End Modules (EFEMs). To stay close to worldwide customers, the company is established in major electronic-industry regions including the USA and Asia, with headquarters in France. RECIF Technologies participates actively in collaborative R&D programs to contribute to semiconductor-industry innovation and improve the performance and cleanliness levels of its products. Its handling scope extends from standard 300mm silicon wafers to advanced packaging substrates for 3D-IC, TSV, and FO-WLP, supporting chip manufacturing at advanced nodes. The COMPACT and SMART equipment families are designed to meet SEMI standards and customer requirements with robust robotics and clean handling. RECIF Technologies is part of the Accuron Group. RECIF's product page identifies HQ Aussonne, France, Hsinchu City, Taiwan, and Wappingers Falls, U.S.A. among its operating locations. The company describes its expertise as wafer-handling equipment for sensitive environments, with a focus on customer satisfaction, precision performance, and handling work in those sensitive semiconductor environments.
Exhibits
RECIF Technologies Taiwan Co., Ltd. offers small products for handling 75 to 300mm wafers, including table-top equipment, vacuum handling systems (VHS), and open metal cassettes for thermal processes. Its legacy table-top equipment is designed for 75 to 200mm wafer handling and includes transfer tools, aligners, and elevators. Through a technology license agreement with European partner EMU Technologies, RECIF delivers updated table-top designs while retaining decades of field performance. One system uses a Cognex 1741 Camera to read Lasermarks or Datamatrix Tags on both the active and rear faces of a wafer. Wafers are mapped before alignment and reading, with checks for wafer presence, cross slots, and double slots. The machine cycle time for reading a batch of 25 wafers is 2 minutes, including cassette mapping, batch alignment, and reading every wafer in the lot. The VBT-A (Vertical Batch Transfer and Alignment machine) is a single-stage automated tool with ESD protection that transfers wafer batches between semi-standard cassettes and aligns them by notch or flat, with transfer also available between semi-standard cassettes and Quartz Boats. RECIF's broader substrate-handling portfolio accommodates standard silicon wafers of 6”, 8”, 12”, or 18” diameter. The same portfolio also handles specialized substrates including 3D ICs, TSV wafers, and warped wafers. RECIF covers handling functions for IC manufacturing across both manual handling lines and highly automated Giga Fabs. Its automated-handling product categories include COMPACT sorters, SMART Sorters, and EFEMs. Its small-product categories include 150/200mm table-top handlers, vacuum handling systems, and metal cassettes. Named products in the portfolio include COMPACT Wafer Sorter, SMART Sorter, SMART EFEM, Tabletops, Vacuum Handling Systems, and Metal Cassettes.
Capabilities and products
- fully automated wafer sorters
- Equipment Front End Modules (EFEMs)
- 75–300 mm wafer-handling equipment
- wafer vacuum handling systems (VHS)
- open metal cassettes for thermal processes
- 75–200 mm wafer transfer, alignment, and elevator equipment
- wafer LaserMark / DataMatrix reading
- automated wafer-batch transfer
- wafer-batch notch / flat alignment
- 3D IC / TSV / warped-wafer handling