At a glance
| Booth | S7930 |
| Country | US |
| Website | www.qnityelectronics.com |
Company profile
Semiconductor fabrication and packaging materials Semiconductor fabrication and packaging Combining full-system engineering, deep material science expertise, and digital innovation, we accelerate impact and drive the future forward. Qnity is helping NASA launch the largest escope ever placed in space. Over 100 times more powerful than Hubble, the Webb escope features many firsts. We solve technical challenges at both the material and process level, using engineering expertise to create high quality, cutting-edge solutions and open new possibilities that shape the future of electronics. From discovery to product development and process improvement, we tackle complex challenges in thermal management, miniaturization, EMI shielding, and beyond. Pushing materials innovation to deliver breakthrough performance – we’re powering tomorrow’s technologies. Artificial intelligence and machine learning solutions Safer, more durable, and higher-performing products Innovations advancing hybrid and electric vehicle technology Qnity’s global network of technical and application centers connects global resources with local partners—driving the speed of innovation for customers and beyond. Our scientists and engineers work side by side with partners to deliver meaningful innovation and real-world impact. Today, more than 2,100 experts collaborate with academia, industry, and government to advance our customers’ technology roadmaps in semiconductor chip manufacturing, smart consumer electronics, high-performance computing, AI and advanced electronics systems. If you love innovating and solving problems, you belong at Qnity, the intersection of every major move in technology. We use our technical expertise and value chain relationships to find efficient and creative solutions to the challenges facing our industry. Meeting the needs of our customers while creating a more sustainable future for our industry is how we will make tomorrow’s technologies possible.
Capabilities and products
- EMI shielding materials solutions
- material and process-level engineering for electronics
- miniaturization materials solutions
- semiconductor fabrication materials
- semiconductor packaging materials
- technical-roadmap support for semiconductor chip manufacturing
- thermal management materials solutions