At a glance
| Booth | K3260 |
| Country | TW |
| Website | www.pvatepla.com |
Company profile
PVA Taiwan Ltd. provides ultrasonic inspection technologies for wafers, SiC ingots, and flip chips. Its capabilities include pulse-echo testing, A-scan thickness and feature analysis, phased-array inspection with electronic beam steering, MACROVUE solar-panel inspection, and scanning for delamination, voids, cracks, and bond failures. PVA TePla provides systems and measurement solutions across key industrial sectors worldwide, with over 1,000 employees and locations in Europe, America, and Asia through the Metrology and Material Solutions business divisions. The group combines advanced technologies with a focus on international customer needs and operates as a publicly listed company with global operations and German roots. Its portfolio covers two main technology fields and an Innovation Hub for developing system solutions and technologies, while tailored solutions and expert advice support customer requirements and a global presence supports customers across regions. PVA TePla's company history began in 1991 and developed from a specialist in vacuum metallurgy into an international provider of high-tech solutions in Metrology and Material Solutions. Its innovation activities use the Technology Hub and product development to address materials, processes, and metrology, with faster time-to-market, reduced risk, and tailored technology solutions presented as business benefits. PVA TePla integrates environmental, social, and governance principles into its business, develops solutions for markets with high precision, quality, and resource-use requirements, and pursues decarbonization through avoiding, reducing, and offsetting greenhouse-gas emissions. The company identifies appreciation, reliability, innovation, and sustainability as core values and maintains subsidiaries and locations across America, Asia, and Europe. Its compliance system is designed to uphold laws, guidelines, and ethical standards worldwide, with transparency, accountability, fair business practices, responsible management, and equal opportunity included in its governance and culture commitments.
Exhibits
PVA TePla is presented as a globally recognized leader in high-tech solutions for advanced manufacturing and develops and manufactures customized systems for high-precision material production, refinement, and processing, together with equipment for inspecting and analyzing materials and components by acoustic, chemical, and optical methods. Its metrology systems support quality assurance and process optimization through measurement and inspection of material properties and production processes, with non-destructive testing and modern data analysis supporting consistent product quality, standards, and regulatory requirements. Wafer-inspection capabilities include acoustic, chemical, and optical inspection and characterization of stress fields, defects, thicknesses, and layer information; power-device inspection uses ultrasound to detect delamination, voids, and cracks; advanced-packaging inspection detects defects and TSVs in 3D structures; and volume inspection provides high-precision non-destructive defect detection of volume materials. Material Solutions support high-purity materials and complex material combinations and cover crystal growth for leading-edge semiconductor materials, controlled chemical vapor deposition and infiltration for high-purity coatings and tailored microstructures, diffusion bonding without a liquid phase for strong and corrosion-resistant joints, dewaxing of green bodies followed by sintering under controlled gas atmospheres from vacuum to highly pressurized gas up to 100 bar, flux-free brazing of similar or dissimilar materials under high vacuum with precise temperature control, graphite and CFC-parts purification under vacuum using reactive and non-reactive gases for exceptional purity, and plasma cleaning and surface treatment for wafer-level and industrial materials. Ultrasonic scanning provides acoustic contrast for detecting subsurface delamination, voids, cracks, and bond failures in complex materials, metals, alloys, and multilayer assemblies where optical tools cannot penetrate opaque structures and X-ray can lack contrast at polymer-to-metal or metal-to-ceramic interfaces. The inspection process selects an appropriate transducer frequency and applies a couplant, while pulse-echo testing sends high-frequency sound waves through the material and measures reflections from interfaces, inclusions, voids, and backwall surfaces. The system records time-dependent amplitude signals as A-scans and calibrates them for wave velocity and material thickness, allowing inspectors to determine the location, size, and nature of internal features from echo timing and amplitude; proper calibration and coupling support stable transmission, high-resolution detection, and repeatable internal inspection across internal hollowness and complex geometries. Conventional ultrasonic testing covers metals, forgings, domes, and thickness measurement under standards including ASTM E317 and AMS 2360, while phased-array technology provides electronic beam steering with high coverage, complex-geometry, and structural-inspection capabilities defined under ASTM E2700. MACROVUE is custom-engineered for solar-panel inspection, accommodates panels of all sizes, and detects layer disbonds and bus-bar bonding integrity. For automotive applications, ultrasonic NDT covers metals, alloys, and composites with simple and complex geometries, detecting small defects and providing precise planar and depth-coordinate information. For semiconductor production, the systems provide non-destructive structural mapping to detect defects and connection errors from front end to back end, with typical checks including wafers, SiC and Si ingots, MEMS, die structures, microprocessors, LEDs, flip chips, power electronics, bonded interfaces, CMOS sensors, molded and passive components, and packaging. In medical applications, ultrasonic NDT checks implants, surgical instruments, precision-machined components, polymer tubing, welded joints, and additive-manufactured parts for internal defects such as cracks, porosity, and weak bonds, supporting safety and quality requirements without damaging the component. For aerospace and defense, ultrasonic NDT supports failure analysis of high-performance alloys and composites by detecting failure modes, defects, and early-stage cracks. PVA TePla ultrasonic metrology platforms use high-frequency transducers from 1 to 230+ MHz, stable multi-axis motion control, pulser-receiver and digitizer hardware, and A-scan, B-scan, C-scan, through-transmission, and time-of-flight mapping for samples including small coupons, large panels, complex shapes, ingots, and pucks. Acquisition and processing software supports analysis, location mapping, material characterization, and defect detection, while robust hardware, scalable R&D-to-production configurations, industry-proven reliability, and global support are used for supplier validation, process optimization, production-ready inspection workflows, and internal quality assurance. Ultrasonic NDT supports multi-parameter assessment of samples with varying size, geometry, and structural complexity, including manufacturing variations such as warpage, non-uniform bonding, and density irregularities, while SAM systems provide high-resolution acoustic imaging of multiple interfaces in layered structures. Advanced platforms with multi-axis motion, rotators, turntables, and gimbal mechanisms can follow complex scanning paths for large, curved, cylindrical, tapered, angled, or other non-standard geometries. The Multi-Axis Industrial UT NDT System combines configurable multi-axis motion, advanced pulser-receiver instrumentation, multiple scanning modes, and time- and frequency-domain measurements for internal-defect and thickness-variation detection in contour-following, billet, large, and irregular components. The VUE series uses next-generation acoustic microscopy for high-resolution non-destructive inspection of simple and complex materials and layers, detecting hidden voids, delaminations, cracks, and bonding issues with exceptional clarity.
Capabilities and products
- acoustic, chemical, and optical inspection of wafers
- ultrasonic inspection for delamination, voids, and cracks in power devices
- ultrasonic inspection of 3D structures and TSVs in advanced packaging
- High-precision and non-destructive defect detection of volume materials.
- Advanced solutions for the growth of leading edge semiconductor materials.
- Diffusion Bonding
- Plasma systems for cleaning and surface treatment on wafer level and industrial materials.
- Ultrasonic Non-Destructive Testing (NDT)
- Piezoelectric Ultrasonic Testing (Conventional UT)