At a glance
| Booth | K3260 |
| Country | TW |
| Product categories | Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating · Repair; Rework Equipment · Space simulation; Vacuum chambers · Vacuum drying & out gassing Systems · Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Weight measurement; precision scales · Inspection and Metrology · Wafers · Crystal Growing & Machining Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Transfer Systems for Wafer; Reticles or FPD's · Consumables · Ingots, Wafers · Ingots · Plasma; Ion Sources · Polysilicon or granular polycrystalline silicon; Crystal growing Material · Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN) · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · Bearings; Shaft Collars · Flow Control Components - Valves; Meters; Gauges; Regulators; MFC's · Gaskets; Seals; O rings; Elastomers; Resins · Heating elements; coils; insulation; vestibule blocks and other Furnace components · Plasma Sources; Controls; Monitoring; Diagnosis · Pumps, Vacuum · Machine Shop; Fabrication Service · Micro Machining services (small hole drilling and milling) · Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts · Assembly |
| Website | www.pvatepla.com |
Company profile
PVA Taiwan Ltd. provides ultrasonic inspection technologies for wafers, SiC ingots and flip chips. Its capabilities include pulse-echo testing, A-scan thickness and feature analysis, phased-array inspection with electronic beam steering, MACROVUE solar panel inspection and scanning for delamination, voids, cracks and bond failures.
Exhibits
Engineering, quality, and procurement teams evaluating inspection technology face a central challenge: few methods can reliably reveal subsurface defects in complex materials, metals, alloys, and multilayer assemblies. Optical tools cannot penetrate opaque structures, and X‑ray often lacks contrast for polymer‑to‑metal or metal‑to‑ceramic interfaces. Ultrasonic scanning delivers the necessary acoustic contrast to detect delamination, voids, cracks, and bond failures that directly impact performance and field reliability. The ultrasonic inspection process begins with selecting an appropriate transducer frequency and applying a couplant to ensure efficient acoustic transmission into the component. During pulse‑echo testing, the transducer emits high‑frequency sound waves that travel through the material and interact with internal boundaries defined by differences in acoustic impedance. At these boundaries, such as interfaces, inclusions, voids, or backwall surfaces, the sound waves are partially reflected and return to the transducer as measurable echoes. The system records these echoes as time‑dependent amplitude signals (A‑scans), which are calibrated to determine both wave velocity and material thickness. By interpreting the arrival times and amplitudes of the reflected waves, inspectors can pinpoint the location, size, and nature of internal features. Proper calibration and coupling ensure stable conditions for signal transmission, allowing for consistent, high‑resolution detection regardless of internal hollowness or complex geometries. Through this structured evaluation of ultrasonic responses, UT provides a precise and repeatable method for internal material inspection. Standards such as ASTM E317 and AMS 2360 govern this technology. Phased Array Technology (Electronic Beam Steering) Custom‑engineered for solar panel inspection, MACROVUE accommodates panels of all sizes and enables reliable detection of layer disbonds and bus‑bar bonding integrity. Ultrasonic Non‑Destructive Testing for metals, alloys, and composites with both simple and complex geometries. Enables the detection of small defects and provides precise planar and depth‑coordinate information. Our systems provide non-destructive structural mapping to detect defects and connection errors in semiconductor production, supporting applications from front end to back end. Typical checks include wafers, SiC and Si ingots, MEMS, die structures, microprocessors, LEDs, flip chips, power electronics, bonded interfaces, CMOS sensors, molded and passive components, and packaging.
Capabilities and products
- A-scan ultrasonic thickness and feature analysis
- MACROVUE solar panel inspection
- phased-array ultrasonic inspection with electronic beam steering
- pulse-echo ultrasonic testing
- scanning acoustic microscopy for semiconductor wafers
- ultrasonic inspection for wafers SiC ingots and flip chips
- ultrasonic scanning for delamination void crack and bond-failure detection