At a glance
| Booth | M0848 |
| Country | TW |
| Website | www.pskinc.com/producttech/dry_strip.php |
Company profile
PSK Asia Inc. is the Taiwan presence associated with PSK Group, a semiconductor process-equipment company. PSK states that its core technologies and product applications include semiconductor equipment process technologies together with source, hardware and software technologies. Its product categories include dry strip, dry cleaning, new hard mask strip and bevel etch. PSK describes its dry-strip equipment as holding the largest market share worldwide and top-tier technology, and says models are selectively developed and advanced through careful vetting. The group states that continuing research and development is intended to maintain technological competitiveness, including development of new dry-cleaning and strip technologies.
Exhibits
The SUPRA product line is stated to have the greatest market share worldwide and to enable stable dry-strip processing through proven performance. SUPRA was designed with the smallest footprint to provide higher T/P and lower CoO than conventional products, and named models include SUPRA Vplus, SUPRA N, SUPRA Nm and SUPRA XP. PSK also presents plasma oxide cleaning, POC, as a dry-cleaning process that removes unnecessary oxide films such as natural oxides from the Si surface before deposition. POC is described as scalable to oxide recess etch-back processing, and the dry-cleaning product line includes INTEGER plus and INTEGER XP. OMNIS is new hard mask strip equipment that selectively removes films and uses high selectivity for highly etching-resistant films and lower films such as oxides and nitrides. The new hard-mask strip process is described as providing no plasma damage and higher selectivity, while continuing research targets higher facility productivity through improved strip rate. For bevel etch, the PRECIA product is associated with high throughput, better uniformity and low CoO. The edge-clean process removes dielectric, metallic or organic films from the wafer edge, and PSK states that edge yield can be improved through process changes at the wafer edge and removal of particle contaminants. Together, the portfolio addresses photoresist stripping, dry cleaning, hard-mask stripping and wafer-edge cleaning through plasma and etch process equipment. PSK states that its dry-cleaning equipment played an important role in entering the 10nm-class DRAM semiconductor era and describes continued research and development as necessary to maintain its technological advantage. For existing equipment, the company links continuous R&D investment with maintaining existing equipment performance at a level intended for full customer satisfaction over time.
Capabilities and products
- Dry strip
- plasma oxide cleaning process
- oxide recess etch back process
- New hard mask(NHM) strip
- Bevel etch