At a glance
| Booth | K2029 |
| Country | DE |
| Website | www.precitec-optronik.com |
Company profile
Precitec Optronik GmbH is a German manufacturer of sensors and optical probes for contact-free measurement. Its CHRocodile© product line is used for contact-free thickness and distance measurements in semiconductor, consumer-electronics, machine-tool, glass, and other industrial applications. Precitec states that its products support inline and offline measurement with high precision and ultra-fast measuring speeds across different materials and measurement ranges from micro-scale to centimeters. Precitec was founded in 1971 and describes decades of experience in optical sensor and measuring technology. The company reports more than 35,000 systems in the field and describes its industrial 3D optical sensors in terms of precision, robustness, and customization for specific user requirements. Its 3D metrology portfolio covers distance, thickness, and optical-image sensing through line sensors, multipoint sensors, point sensors, 2D cameras, medical eye-tracking devices, and OEM sensor supply. Integration of Enovasense expands Precitec's optical 3D measurement portfolio with laser-based, non-contact coating-thickness measurement for point and area measurements, including opaque or extremely thin coatings in the nanometer range.
Exhibits
For semiconductor metrology, Precitec provides non-destructive optical measurement technology for ultra-precise measurement and analysis of semiconductor wafers, using high-resolution 3D data to examine circuit topography in detail. The CHRomatic confocal line sensor CHRocodile CLS measures up to 192 closely spaced points so the optical probe can cover a larger area in a given time than a conventional point sensor. The CHRocodile 2 IT series performs high-speed thickness measurements of wafers, glues, and coatings to support higher semiconductor throughput together with more accurate and repeatable product quality. These high-speed tools can measure endpoint thickness in situ during CMP, back grinding, and spin etching, using optical monitoring to improve semiconductor-process efficiency and reduce material waste. Semiconductor inspection tasks listed by Precitec include total-thickness-variation measurement, die-crack inspection, bump inspection, bow and warp measurement, wafer and photomask alignment, probe-card inspection, dicing, and wafer bonding. For aerospace manufacturing, Precitec states that precision, reliability, and traceability are important because aircraft engines and structural components face extreme thermal, mechanical, and environmental stresses and their coatings and critical variables must be controlled during production. Protective and functional coatings, surface treatments, and complex geometries create measurement and quality-assurance challenges, while sample-based, tactile, or late-stage inspection can reduce process control and increase scrap or rework risk. Precitec 3D Metrology addresses these conditions with optical and photothermal solutions for non-contact, high-precision inspection directly in the production environment. The company states that early process control, reliable thickness inspection, and geometry-independent measurement can support consistent quality while improving efficiency and traceability. The Enovasense Point Sensor (PS) performs early, non-destructive layer-thickness measurement before curing or densification so corrective action can be taken earlier, with the stated effect of reducing rejects, rework, and cycle time. For thermal-spray coatings on aircraft-engine components, Precitec notes that rough and porous microstructures and complex turbine geometries make measurement difficult and can lead conventional inspection toward destructive cross-sections that interrupt production and provide limited insight into the component condition. Across its 3D metrology product range, Precitec supplies Point Sensors, Line Sensors, Multipoint Sensors, Area Scan Sensors, Chromatic Line Scan Cameras, and Medical Eyetracking devices. The Enovasense laser-photothermal technology can detect defects in and under coatings while simultaneously mapping coating thickness, and is described as non-destructive, available as a turn-key system, easy to integrate into existing production lines, and usable with all types of coatings. Precitec also lists a next-generation laser photothermal probe that is lightweight and easy to integrate and works on all types of coatings, together with high-precision and repeatability characteristics. An ultra-fast scanner is described for short cycle times without an additional axis or precision hardware and can measure wafer bow, warp, and TTV in a single scan. The next-generation 3D confocal line sensor is presented for high-speed, high-precision measurement across varied tasks without shadowing. CHRocodile Mini is presented as a compact confocal sensor for non-contact displacement, thickness, and distance measurement across different materials, including curved, uneven, and rough surfaces, with probe options for different measurement needs. Other optical probe characteristics listed in the portfolio include operation on different surfaces and materials, no shadowing effects, suitability for inline measurement, measurement at high angles, ultra-fast operation, and wide measuring ranges. For synchronized measurements, one listed configuration provides two fully synchronized measuring channels for simultaneous testing on both sides and precise measurement of thickness, step height, and multilayer thickness. Another multipoint configuration supports up to 24 simultaneous measuring channels, with flexible selection of point and line probes and scalable multipoint architecture for large-area measurement tasks. The portfolio also includes configurations for simultaneous acquisition of multiple quality parameters, flexible probe positioning, ultra-precise inline quality control, high lateral resolution, and an available 90° version for inline measurement. Together, the semiconductor and broader 3D metrology offerings connect contact-free thickness and distance measurement, micro-to-centimeter measurement ranges, non-contact high-precision production inspection, and non-destructive coating-thickness measurement with inline integration options.
Capabilities and products
- non-contact optical metrology for semiconductor wafers
- Bump inspection
- wafer/photomask alignment metrology
- Probe cards inspection
- wafer bonding inspection
- laser photothermal coating thickness measurement
- 3D confocal line sensor measurement
- Two fully synchronized measuring channels for simultaneous testing on both sides