At a glance
| Booth | K2882 |
| Country | CN |
| Website | www.powertechsemi.com |
Company profile
PowerTech Co., Ltd. was founded in December 1998 and focuses on the research and development, manufacture and sales of semiconductor assembly, back-end packaging and test equipment, with more than 20 years of activity in semiconductor packaging and testing. The company develops total solutions for IC and discrete-device testing to address multi-level requirements and extended applications in production, supported by a tester R&D team that includes experienced test engineers, specialists from China's aerospace science and technology industry and senior engineers with master's degrees. Its main businesses include semiconductor automated test systems, laser-marking equipment and other electromechanical integrated equipment, alongside handlers, probers and supporting test modules within the broader product portfolio. The equipment is used for functional and performance testing of power-management chips and modules in electric vehicles, photovoltaics, wind power, energy storage, new-energy applications and data centers. PowerTech Co., Ltd. is identified as a national high-tech enterprise, a Guangdong strategic emerging-industry cultivation enterprise and a national specialized and innovative 'little giant' enterprise, and it operates the Guangdong Semiconductor Integrated Circuit Packaging and Testing Equipment Engineering Technology Research and Development Center. The company reports more than 200 R&D personnel and maintains independently developed production and manufacturing capabilities for semiconductor test technology. Its automated IC test systems have been recognized and used by ON Semiconductor, Amkor, JCET, Tongfu Microelectronics and Huatian Technology, and the company reports exports of semiconductor IC manufacturing equipment for use by multinational semiconductor companies in the United States, Japan and Europe. On September 22, 2022, the company was listed on the ChiNext market of the Shenzhen Stock Exchange under stock code 301369, with raised funds directed toward semiconductor packaging-and-test equipment R&D and capacity expansion, higher-power and third-generation-semiconductor testing, and integrated-circuit test technology. Its development history includes the first laser-marking machine in 2001, the QT-4000 series discrete-device tester in 2003, a dual-head laser-marking machine in 2006, Guangdong high-tech-enterprise recognition in 2007 and national high-tech-enterprise recognition in 2008. In 2009, it received Guangdong software-enterprise recognition, established a semiconductor packaging-and-test equipment engineering technology R&D center in Foshan, passed ISO9001:2008 quality-system certification and launched the QT-6000 series high-speed discrete-device test system. Further milestones include an electromechanical visual-recognition system in 2010, its first independently developed laser and the QT-8100 series mixed-signal IC test system in 2012, a comprehensive RG, avalanche, thermal-resistance, DC, TRR and QRR test platform plus the QT-8200 Direct Mount system in 2013, and a fully automatic laser-marking system in 2014. The company added the Guangdong provincial semiconductor IC packaging-and-test equipment engineering technology research center and an LCR test module in 2016, followed in 2017 by 300A, 3KV and TRR test modules, the QT-9200 very-large-scale integrated-circuit test system and the QT-9100 digital IC test system. Its 2018 developments included the QT-7200 series IC test system, QT-8100EX high-power enhanced mixed-signal IC test system, IGBT/SiC double-pulse testing, QG, TRR and an RF module; later milestones include an RGCG module in 2019, a 2000A/6KV module in 2020, PIM and the QT-8400 series in 2021, and GaN plus power-device CP/FT IPM test solutions in 2022. The company states that it serves more than 500 customers and supports them through sales and service centers in East China, Southwest China and South China, together with an overseas sales and service center in Malaysia that supports other overseas regions.
Exhibits
PowerTech Co., Ltd. develops and sells semiconductor back-end packaging and test equipment including QT-3000, QT-4000, QT-6000 and QT-8400 series power-device test systems, QT-8000 series digital/analog mixed-signal IC test systems, QT-9000 VLSI test systems and RF test-module options. Its automated equipment also includes fully automatic marking systems and high-temperature gravity tube-to-tube test and sorting systems for marking and electrical testing of QFN, SOP, SOT and TO series lead-frame packages, using modular configurations and automatic package switching for front-end and back-end production needs. For semiconductor laser marking, the company reports development of more than one hundred industrial laser-marking machine models, follows a customized-equipment route and supplies equipment used on domestic and overseas semiconductor packaging-and-test production lines. Its prober family includes the QP2000 series for 6-inch and 8-inch wafers and the QP3000 series for 8-inch and 12-inch wafers, supporting semiconductor wafer testing. PowerTech Co., Ltd. combines its probers with self-developed high-performance power testers as a one-stop power-device wafer-testing solution intended for power-semiconductor manufacturing scenarios and backed by customized service for test-process optimization. The company also provides after-sales support and develops new semiconductor test and marking solutions in response to customer requirements through its domestic and Malaysian service network. The current semiconductor-test portfolio lists IC test systems QT-9800EXA, QT-8100 Cable-Mount, QT-8200 Pro Hard-Docking and QT-8600RF; power-module and device systems QT-8400D, QT-8400GaN, QT-8409PIM and QT-8409IPM; the QT-6000 high-speed discrete-device system; and power-device products including QT-4100, KGD, QT-DRM101000, QT-3108, QT-3101, QT-3102, QT-3107 and QT-3105TRR. The QT-9800EXA SOC test system covers DC parameters, high-speed AC signals, AI-core computation, logic functions and memory interfaces for GPU, DPU, NPU and AI SoC devices, high-performance processors and FPGA/ASIC devices, and it also supports liquid-cooling-related thermal-characteristic and heat-dissipation validation from chip R&D and wafer testing through finished-device mass production for automotive and industrial requirements. QT-9800EXA uses liquid-cooled temperature control for high-load testing, supports multi-channel parallel operation, and provides a common DUT interface and software environment intended to adapt to different device architectures and mainstream platforms. Its digital resources reach MAX 6912CH at 800Mbps with 512M/pin vector depth, while the LHead provides MAX 27 slots. A DPU256 digital board provides 256 channels with -1.5 to 6.5V levels, ±12mA load current, ±175ps edge accuracy and 20ps resolution; a DPS256 power board provides 256 channels at -3 to 10V and 2.0A V/I with ±2A current range and up to 512A per board in gang mode. The QT-9800EXA resource set also lists DPU256 at -1.5 to 6.5V and ±60mA with 256 channels and 800M maximum rate, DPS256 at -3 to 10V and 2.0A V/I with 256 channels, and AVI32 at -40V to +80V and ±200mA with 32 channels plus AWG and Digitizer capability; its development environment uses a standard Pattern file format and its DUT interface is compatible with mainstream Load Boards. The QT-8400 platform consists of a test host and selectable Test Kit, with Power Device Test Kit for MOSFET/SiC, diode and transistor CP testing and GaN Test Kit for gallium-nitride test requirements. Its cabinet includes recommended keyboard heights of 105cm for standing and 75cm for sitting, with an ergonomic guidance design intended for design companies, laboratories and packaging-and-test plants. QT-8400 supports 2, 4, 8 or 16 Site parallel testing and provides 20A/100A and 1KV/2KV multi-site configurations, with high-voltage and DC expansion to 8KV and 2000A plus avalanche, RGCG and dynamic RDson test modules for third-generation-semiconductor testing. QT-8400 GaN is dedicated to dynamic and static electrical-parameter testing of GaN, while QT-8400 D targets CP testing of MOSFET/SiC, diodes, transistors and IGBT; listed floating V/I source ranges include 1KV/2KV at 20A/100A for GaN and 1KV/2KV/3KV at 20A/100A/200A for the power-device configuration. The GaN and Power Device Test Kits use precision measurement circuits for nA-level and mΩ-level measurement, while the host uses a pluggable board architecture, four-quadrant V/I sources, AWG and oscilloscope resources for I-V and other scanning tests; the QT-8400 PTS OS is optimized for test development, production, debugging and calibration workflows. The QT-4100 power-device test system is used for electrical-parameter testing of SiC and Si MOSFET, IGBT, diodes, transistors, thyristors, solid-state discharge tubes, three-terminal regulators and optocouplers, with DC, EAS, RGCG, thermal resistance, SW switching, short-circuit, TRR and QG dynamic and static test functions and multi-station data merging. QT-4100 functions include one-button calibration, lot-start self-check, Low RDON measurement down to 0.2mR, voltage and current limiting, form-based process setup, expansion for EAS, LCR, thermal resistance, SW, TRR and QG, PAT capability and a SECS/GEM standard interface. Its stated specifications include a 2kV 200A DC configuration expandable to 8kV 2kA, a 1500V 600A AC configuration with 3000A short-circuit capability, stray inductance Ls<30nH and protection under 300ns, together with support for a complete SiC MOS/IGBT parameter-test flow and 100% online QA. The QT-8600RF mixed-signal RF test system uses an RF12G test module for high-power output, harmonic, switching-time, insertion-loss, isolation, S11, Ron, Coff, same-port loop, IP3, spurious, modulation/demodulation, MIPI, P0.1dB and P1dB testing. QT-8600RF provides 12GHz RF measurement with digital MIPI testing below 100MHz, vector and scalar testing in an integrated DC, digital and RF platform, power capability stated as 8.5GHz and 37dBm, two-station RF parallel and multi-station combined testing, and self-developed algorithm communication with throughput up to 12K per hour for devices including RF switches, LNA, TUNER, filters, PA/FEM and Wifi6, wifi6e and wifi7 products. The QT-3101 UIL avalanche tester is intended for MOSFET, IGBT and diode avalanche-parameter testing and includes support for dual DIE, rapid charging, failure-waveform storage and clamping functions. QT-3101 supports VDD ON and VDD OFF energy-test modes, can share one computer with QT-4100B for unified program and data management, supports single-pulse, multi-pulse and dual-MOSFET testing, monitors IDMAX and Energy in real time, includes an oscilloscope, supports RPF, wafer-test protection, measured energy display, PVDROOP and PVCOLLAPSE testing, and offers a QT-UILM module with ID output up to 400A and BVDSS voltage measurement to 5KV. The QT-6000 high-speed discrete-device test system serves small- and medium-power diodes, transistors and MOS devices, with optional internal capacitance DC+CAP, EAS, Vc and pA modules plus external LCR and Scanbox expansion for wafer, FT mass-production or laboratory testing. QT-6000 uses four-quadrant circuitry, a floating power supply and a symmetrical structure, supports handler operation above UPH56K and test throughput above UPH40K, can run one-to-two 100% FT+QA parallel testing, combines CAP+DC and DC+UIS at the same station, measures capacitance down to 100fF with LCR, and offers optional 1200V/600V and 30A/10A/3A voltage/current ranges. The QT-8100 digital/analog mixed-signal IC test system in Cable-Mount configuration supports conventional DC and AC parameter testing and functional testing of mixed-signal and analog ICs, with application areas including power-management devices, digital-consumer devices, motor drivers, audio amplifiers and operational amplifiers. QT-8100 features a floating source, 25.6MHz digital frequency, 64M vector depth, 18 bit high-precision sampling, more than 600 mixed-signal test channels, multiple 1000V/20A high-voltage and high-current channels, multi-channel high-precision timing measurement at ns level and RF-module expansion. The QT-8409PIM high-power dynamic and static integrated test system is designed for IGBT and SiC power modules, supports four DC/AC stations and lists test functions including SW, TRR, ISC, QG and RBSOA for production or manual operation. QT-8409PIM specifications include stray inductance LS<30nH, AC operation at 4000A and 2000V with ISC 16000, DC operation at 3000A and 2KV/3KV, short-circuit protection under 1uS, and test targets including PIM IGBT modules, SiC modules, DBC and three-level products.
Capabilities and products
- Liquid-cooled temperature-controlled test systems for SoC and high-compute AI chips
- Digital–analog mixed-signal IC test systems
- 12 GHz mixed-signal RF test systems and modules
- Power-device static, dynamic and multisite parallel test systems
- GaN static and dynamic electrical test systems
- GaN dynamic on-resistance test equipment
- IGBT/SiC dynamic test equipment
- Intelligent power module test systems
- Known-good-die (KGD) test solutions
- Semiconductor device thermal resistance testers
- LCR and RG/CG test equipment
- Diode reverse-recovery test equipment
- Avalanche test equipment for MOSFETs, IGBTs and diodes
- High-speed wafer and final test systems for discrete devices
- IGBT/SiC power-module static and dynamic test systems
- 6/8/12-inch wafer probers
- High-temperature gravity-fed tube-to-tube test handlers
- Customized semiconductor laser marking equipment