At a glance
| Booth | M0856 |
| Country | DE |
| Product categories | Spacer Materials · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Prime; Polished; Mirrored Wafers · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · Substrate Materials · Thin & Thick film substrates for MEMS · Chucks for Wafer and other Substrates · Windows · Pumps, for Fluids · Micro Machining services (small hole drilling and milling) · Sawing; Lapping; Grinding; Polishing Service · Wafer Handling · Device; Wafer; Display Panel Handling Products · Other |
| Website | www.planoptik.com |
Company profile
PLANOPTIK AG, a public company from Germany produces wafers from glass, quartz and glass-silicon-compounds. Main products are wafers and process carriers from glass, fused silica and glass-silicon compounds for MEMS, wafer level packaging and semiconductor applications. PLANOPTIK 's wafers are machined to very tight thickness tolerance and total thickness variation. Sub-nanometer roughness and materials with adapted coefficient of thermal expansion to semiconductor materials are the main features of these substrates and carriers. All wafers are clean room packed. Diameters from 50 to 300 mm, typical thickness from 100 to 3000 micron. PLANOPTIK has set the standard in respect to high end substrates for the MEMS and semiconductor industry.
Capabilities and products
- 50 to 300 mm cleanroom-packed wafers
- glass and fused-silica process carriers for MEMS and WLP
- glass, quartz and glass-silicon wafers
- sub-nanometer roughness MEMS and semiconductor substrates
- wafers machined to tight thickness tolerance and TTV