At a glance
| Booth | M0856 |
| Country | DE |
| Website | www.planoptik.com |
Company profile
PLANOPTIK AG is a public company from Germany that produces wafers from glass, quartz, and glass-silicon compounds; its main products include wafers and process carriers made from glass, fused silica, and glass-silicon compounds for MEMS, wafer-level packaging, and semiconductor applications. Its wafers are machined to very tight thickness tolerances and total thickness variation, with sub-nanometer roughness and materials whose coefficients of thermal expansion are adapted to semiconductor materials; all wafers are clean-room packed in diameters from 50 to 300 mm and typical thicknesses from 100 to 3000 micron. PLANOPTIK AG states that it has set the standard for high-end substrates for the MEMS and semiconductor industry. PLANOPTIK AG applies glass-based technologies to next-generation microsystems engineering, including products for integrating state-of-the-art chips and processors into small spaces, high-performance sensors, and glass-based microfluidics for modern medicine and pharmaceuticals. With roots in optics, the company polishes glass to surface dimensions in the sub-nanometer range, imprints millions of functional microstructures onto glass, and enhances it with materials such as silicon or copper to create microcomponents and parts. Wafer- and panel-based manufacturing supports high production volumes for customers and partners in more than 40 countries, and PLANOPTIK AG develops products jointly with customers, integrates its technologies into their products, and supports continued production of wafers, micro-parts, and components for many years. The company works with customers to develop electronic, mechanical, optical, chemical, and biological microcomponents using materials including glass, silicon, and copper, and it manufactures jointly developed microcomponents and elements in high volumes with wafer-based processes. PLANOPTIK AG is certified to ISO 9001 and describes itself as a recognized supplier to OEMs. Its environmental management meets ISO 14001 requirements, with measures spanning goods receipt, production, storage, and shipping to minimize environmental impact; the company also describes itself as a medium-sized high-tech company with worldwide sales activities that supplies international corporations directly for production.
Exhibits
PLANOPTIK AG offers wafer- and panel-level technologies for developing and manufacturing products, with glass or quartz wafers up to 300 mm in diameter, high-precision surface quality, application-specific structuring, and complex material combinations; its processes also cover panels and microfluidic devices. Glass structuring creates functional features and precise geometries using technologies selected for feature size, geometry, depth, and surface quality, including sandblasting for larger structures and cavities, laser processing for flexible and precise material modification, chemical etching for smooth and accurate microstructures, and laser etching for precise complex three-dimensional features. Products include glass core substrates for advanced packaging and glass substrates with through-glass vias and metallization for 3-D integration. PLANOPTIK AG supplies wafers for wafer-level packaging and customized wafers and panels for MEMS and sensor encapsulation. The portfolio includes carrier wafers, adapters, and tools, including tools adapted to individual production processes. Component offerings include nozzles, antennas, and induction coils, as well as microstructured parts for diagnostics, biotechnology, medical technology, and pharmaceutical applications. PLANOPTIK AG also supplies microfluidic systems for flow chemistry, including glass microreactors, micromixers, and microdosing pumps for chemical and pharmaceutical processes, together with standard or customized wafers made of glass, quartz, and silicon.
Capabilities and products
- produces wafers from glass, quartz and glass-silicon-compounds
- process carriers from glass, fused silica and glass-silicon compounds
- Glass Core Substrates for advanced packaging
- Glass substrates with through-glass-vias and metallization for 3-D integration
- Wafers for wafer-level packaging
- Customized wafers and panels for MEMS and sensor encapsulation
- Microfluidic systems for flow chemistry