At a glance
| Booth | N1286 |
| Country | TW |
| Website | industrial.panasonic.com/tw |
Company profile
Panasonic Connect Co., Ltd. is a Panasonic group company supplying back-end semiconductor packaging and assembly equipment. Its APX300-DM plasma dicer performs non-contact, damage-free and particle-free plasma dicing of thin, ultra-thin and brittle wafers, chemically etching exposed dicing streets down to ultra-narrow 20-micrometre widths. Its APX300-S dry etcher provides dry etching of silicon and compound semiconductors with multi-wafer direct cooling and two ICP plasma sources (multi-spiral-coil ICP and beamed-type ICP). Its MD-P300 flip-chip bonder combines flip-chip, thermosonic and thermocompression bonding in one tool, supports 300 mm wafers with placement accuracy around plus or minus 5 micrometres, and targets chip-on-board hybrid assembly, CMOS image sensors, MEMS and power devices, while the MD-P200US2 bonder serves small devices such as SAW filters with ultrasonic monitoring. The company is positioned as a supplier of plasma dicing, dry etching and flip-chip and die bonding equipment for semiconductor packaging.
Capabilities and products
- 20-micrometre ultra-narrow dicing-street etching
- 300 mm wafer bonding with plus or minus 5 micrometre placement accuracy
- APX300-DM plasma dicing for thin, ultra-thin and brittle wafers
- APX300-S dry etching for silicon and compound semiconductors
- MD-P200US2 ultrasonic bonder for SAW filters
- MD-P300 flip-chip, thermosonic and thermocompression bonder
- multi-spiral-coil ICP and beamed-type ICP plasma sources