At a glance
| Booth | N1286 |
| Country | TW |
| Website | connect.panasonic.com/en/products-services_fa/products/device-related |
Company profile
Panasonic Connect Co., Ltd. is a Panasonic group company supplying factory-automation and semiconductor manufacturing equipment. Its factory-automation portfolio includes electronic-component mounting systems, device-related systems, display-related systems and measuring systems, with equipment, software, materials and related solutions for manufacturing operations. For semiconductors, the device-related range covers machines, processes, materials and software for manufacturing from high-precision wafer processing through fine bonding of bare ICs, including bonders, dry etchers, plasma cleaners and plasma dicers. Panasonic Connect Co., Ltd. provides total support from verification through mass production by verifying semiconductor manufacturing processes at its verification centre. The support structure also includes a demonstration centre for dry etching, plasma dicing, plasma cleaning, die bonding and flip-chip bonding, together with verification and demonstration activities. A global service network is described as delivering high-quality, uniform support to customers regardless of time and region, while lifetime product support extends from installation through replacement. Additional customer support includes a membership site for mounting, semiconductor and FPD-system users, a technical centre where customers can manufacture circuit boards with their own components and materials, line tact simulation and mounting-feasibility studies for nozzle selection. Its broader factory-automation solutions address production quality, productivity, automation and manpower saving across mounting, assembly, testing and packing processes, including Manufacturing Operations Management and collaboration with system integrators.
Exhibits
The semiconductor-related system lineup is organised by process, and APX300-DM and APX300-PD are plasma dicing machines capable of high-speed and high-precision processing. APX300 is a batch-type dry etcher for high-speed and high-precision processing, using mass-production process technologies for devices including LEDs, SAW-F and MEMS, while housing multiple devices in one box is described as improving area productivity. The APX300 S option combines the E620 process chamber, which has an extensive track record, with the latest APX300 platform. APX300-DM and APX300-PD use plasma chemical-reaction processing for dicing, with damage- and particle-free processing and reduced dicing width intended to improve processing quality and productivity; Panasonic Connect Co., Ltd. also proposes pre- and post-processing around plasma dicing. APX300-DM uses a single-chamber configuration for applications from research and development to mass production, while APX300-PD is a multi-chamber system with up to 4 chambers for automation and productivity in semiconductor factories. The PSX307 series parallel-plate plasma cleaners are designed for PCB cleaning and surface modification with automatic transfer, supporting adhesion and bonding performance in packaging for communication and automotive devices. PSX307 and PSX307-HSA include a loader and unloader for PCBs, while PSX307A uses a large chamber and allows selection between PCB and wafer processing. The MD-P series bonders support high-precision multi-die bonding, continuous stacked bonding and flip-chip bonding, with the stated goals of device and module miniaturisation, added functionality, high-quality mounting and yield improvement. MD-P300HS is a flip-chip bonder for semiconductor productivity and high-quality, high-precision mounting; MD-P200 supports multiple bonding processes for state-of-the-art device assembly; MD-P300 accepts φ300 mm wafer supply and supports high-speed, high-accuracy flip-chip and COW bonding; and MD-P200US2 is a specialised ultrasonic flip-chip machine using a proprietary US tool. NPM-GP/L is a screen printer that optimises the screen-printing process with automation functions and high-accuracy printing, and it appears both as a related product and within the wider mounting-system lineup. The electronic-component mounting range includes NPM-GW, NPM-GH, NPM-DX, NPM-WX, NPM-D3A, NPM-TT2 and NPM-W2 systems for applications spanning high-speed production, high-mix and variable-volume production, large components and PCBs, with automation and manpower-saving functions. AM100 is positioned as a versatile one-machine solution for different PCBs and production types, while the VM series is a compact high-performance platform able to handle high-speed production, high-mix low-volume work and prototype production. Screen-printing options also include SPV-DC for efficient compact dual-lane production and SPV, which has a stated total printing cycle time of 10 seconds including transfer, recognition and cleaning and can print both sides of a PCB with one machine. Insertion equipment includes NPM-VF for automated odd-form component insertion, AV132 with 0.12 sec/component axial insertion, RG131/RG131-S with 0.25 sec/component large-component insertion and selectable 2-pitch, 3-pitch or 4-pitch specifications, and RL132 and RL133 with 0.14 sec/component radial insertion. Mounting software connects operations across the mounting floor and factory, and Panasonic states that line-wide management of its electronic-component mounting systems is reflected in production planning to maximise OEE. The electronic-materials range includes environmentally friendly, durable mounting materials and low-temperature fast-curing materials intended to maintain quality with new methods or difficult mounting conditions. The Auto Setting Feeder automates parts-supply work in SMT and supports 8~104 mm tape parts in paper or embossed forms, while Offline Camera unit V2 creates parts data without stopping equipment and uses an AI engine for complex and irregular shapes. Display-related systems cover FPD bonding for cellphones, in-vehicle displays, tablets and notebook PCs, with models including FPX305CG, FPX007CG/FP, FPX007CG/FP2, FPX007FG/FF, FPX105FG, FPX105CG, FPX005CG and FPX007AI for combinations of COG, FOG, FOP, COP, FOF and inspection processes. FPX007AI provides high-speed inspection of all pins on flexible OLED panels using high-speed tracking AF and an MBR detection method optimised for plastic panels, while the Ultrahigh Accurate 3-D Profilometer measures aspheric lenses, free-form curved mirrors and molds at a stated maximum accuracy of 0.01 um. Panasonic’s mounting solutions address increasingly diverse PCBs and parts, including thin and large PCBs, small components, high-density mounting and odd-shaped parts, combining equipment and software to target quality and productivity. Automation and manpower-saving solutions for printing and mounting are intended to reduce labour and improve stability and productivity, and the wider automation offer also covers assembly, testing and packing processes. For module and device manufacturing, Panasonic proposes total solutions that include screen printing, mounting and process control for requirements such as 0201 components and high-density mounting with spacing of 50 μm. Industry proposals include smartphone production, automotive manufacturing with NPM-WX for large power components, sensors and smaller communication-module components, and server production that requires efficient manufacture of multiple models as PCBs and components diversify. Support items are organised around productivity improvement, quality improvement and cost reduction for solder printers, mounting machines and mounting processes, including measures for solder defects, mounting defects and mounting reliability. The Manufacturing Operations Management System MOM is described as supporting optimisation of whole-factory operations by incorporating more than 100 years of manufacturing-streamlining know-how. The automation proposal combines Panasonic process-management techniques with collaboration through cooperative system integrators to build high-quality production systems. In passive components, the EZPV-D film-capacitor series has added 1000V and 1100V models for automotive, industrial and infrastructure applications. For automotive Power Inductors, the LE series, LP series and MS series each have one expanded product number. For thermal-management solutions, chip-type NTC thermistors are no longer recommended for new designs. For circuit protection, Varistors, also identified as ZNR surge absorbers, are no longer recommended for new designs except for the SMD-type HF series. The Conductive Polymer Aluminum Electrolytic Capacitor SP-Cap range includes the AX Series for automotive applications.
Capabilities and products
- high-precision plasma dicing equipment
- parallel-plate plasma cleaners
- die and flip-chip bonders
- semiconductor dry etchers
- SMT screen printers
- modular component placement machines
- odd-form component insertion machines
- manufacturing operations management (MOM) systems
- ultra-high-accuracy 3D profilometry
- FPD display bonding equipment
- laser marking machines
- electronic component mounting materials