At a glance
| Booth | L0728 |
| Country | US |
| Product categories | Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Line Width; Critical Dimension (CD) Measurement · Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Inspection and Metrology · FPD Test; Measurement; Repair Equipment · Probe Card Maintenance and Analysis Systems · Yield Mgmt; Process Control Software |
| Website | ontoinnovation.com |
Company profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: un-patterned wafer quality; 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain help our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster, and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.
Capabilities and products
- 3D metrology from nanometer-scale transistors to die interconnects
- lithography for advanced semiconductor packaging
- macro defect inspection of wafers and packages
- metal interconnect composition metrology
- un-patterned wafer quality process control