At a glance
| Booth | L0728 |
| Country | US |
| Website | ontoinnovation.com |
Company profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio that includes unpatterned wafer quality, 3D metrology spanning chip features from nanometer-scale transistors to micron-level die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging. The company's offerings span the semiconductor value chain and are used to address difficult yield, device-performance, quality, and reliability issues, with a connected approach that reaches from bare silicon wafers through wafer fabrication to final back-end packaging. Onto Innovation's software adds an understanding of how individual processes affect the overall product, supporting improvements in product quality and reliability across connected manufacturing operations. Its mission is to deliver comprehensive process solutions to the world's most advanced manufacturers through collaboration and innovation, while Customer Success is identified as the company's guiding principle. The company's stated core values are Passion, Integrity, Collaboration and Results, which are presented as a common framework for directing the team's work toward customers. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers through a worldwide sales and service organization, providing a global commercial and support structure for its process-control portfolio. Onto Innovation also describes a global team with offices in every major semiconductor region, extending its presence across the principal geographic areas in which semiconductor manufacturing operates. Its Milpitas, California; Wilmington, Massachusetts; Bloomington, Minnesota; Budd Lake, New Jersey; Snoqualmie, Washington; and Tucson, Arizona locations are certified to ISO 9001:2015 as part of the company's quality and continuous-improvement program. Across its technology themes, Onto Innovation connects process control with advanced logic and memory for artificial intelligence, semiconductor solutions for green energy, electric vehicles and power efficiency, advanced wafer materials for next-generation communications, and AI, MEMS, analog and compound-semiconductor technologies for autonomous systems.
Exhibits
Onto Innovation provides process solutions across the semiconductor value chain in inspection, metrology, lithography and software, combining physical process-control tools with data analysis for wafer, panel and advanced-packaging manufacturing. Its inspection offering provides automated, high-speed inspection and actionable data analysis for both unpatterned and patterned wafers and panels. Advanced Optical Critical Dimension (OCD) and Film metrology products are intended to support measurement accuracy and repeatability for semiconductor manufacturers worldwide. Advanced-packaging steppers are designed to address manufacturing challenges by maximizing throughput while maintaining high resolution and precise overlay. The Packaging Applications Center of Excellence is dedicated to panel-level packaging innovations for 2.5D, FOPLP, 3D chiplet architectures and AI packages on both glass and organic substrates (CCL). Onto Innovation also offers tailored hardware and software solutions for operational or technical problems, extending process-control value beyond the substrate and linking equipment information with manufacturing data. Its Process Control & Analytics Software connects information on a tool, within a factory, or across an entire global supply chain, using feature-rich applications, artificial intelligence and scalable data solutions to support fully automated, semi-automated and on-the-spot analysis. Discover® Defect Software is an integrated defect-management system that works with Onto tools and enterprise data, while Discover® FDC Software is positioned to improve tool efficiency, reduce downtime and support quality results. Discover® Patterns Software is used to reveal signals hidden in routine noise, Discover® AI Software provides actionable predictions and insights across semiconductor process areas, and Discover® Review Software serves as a human classification interface for smart-factory workflows. Discover® RMS Software supports factory control through recipe management, Discover® Run-to-Run Software automates process control, and Discover® Yield Software integrates enterprise data for yield analysis, loss prevention and deeper understanding of process needs. StepFAST® Software is a feed-forward lithography solution for fan-out panel-level packaging that corrects die-placement errors through external measurements, predictive analytics and adaptive shot control to enhance yield and throughput. TrueADC® Software provides automated defect classification with deep learning, real defect modeling and integration with Onto AOI tools, while Yield Optimizer™ Software applies machine learning designed for semiconductor manufacturing. AutoShell® Software is designed to integrate equipment with factory 4.0+ systems, and ControlWORKS® Software provides a SEMI-compliant foundation for process-equipment operation and material movement. Service programs provide customer support, and technical training uses expert-led, hands-on instruction to help customers develop tool knowledge and enhance operating skills. Across these offerings, Onto Innovation addresses wafer and panel manufacturing, CMOS technologies, specialty devices, advanced packaging and industrial applications, while its process-control portfolio also supports AI, connectivity, sustainability and autonomous-system technology development.
Capabilities and products
- automated high-speed wafer/panel inspection and data analysis
- Optical Critical Dimension (OCD) metrology
- film metrology
- advanced-packaging stepper lithography
- high-resolution precision-overlay packaging lithography
- 2.5D/FOPLP/3D chiplet panel-level packaging
- process control and analytics software
- macro-defect inspection of wafers and packages
- chip-scale 3D metrology
- semiconductor factory analytics