At a glance
| Booth | S7630 |
| Country | TW |
| Website | www.ch-okuno.com/product/process/process_for_ic_substrate.html |
Company profile
Okuno Taiwan Co.,Ltd. is presented within OKUNO's research-based business approach, which uses advanced technology to address social issues and provides products and services across metal finishing, surface finishing, inorganic materials, and food-related fields. OKUNO states that it marked the 120th anniversary of its founding in 2025 and continues its corporate philosophy of making products that are genuinely loved while advancing as a technology-development company serving the needs of cutting-edge industries. The company describes its accumulated technologies and expertise in surface treatment, inorganic materials, and food as a foundation for contributing to a richer and cleaner future. Its business structure covers surface treatment, advanced materials, food and life solutions, and machine engineering, with the stated objective of contributing to society through products, services, and business activities. OKUNO describes domestic bases that include a comprehensive technical research institute, Tokyo and Nagoya branches, factories, and logistics centers. Its global network description includes overseas bases or agents in China, Taiwan, Korea, Thailand, India, and the United States. OKUNO states that it formulated Mission, Vision, and Value statements as it entered its 120th year and describes its long-developed corporate DNA as being passed to the next generation while the company continues to challenge new technologies and businesses as times change.
Exhibits
OKUNO supplies a wide variety of plating chemicals through an integrated total-process offering for the rapid development of IC substrates, plastic semiconductor substrates, and plastic interposers used with CPU, GPU, and other semiconductor devices. For semiconductor package substrates, the company explains manufacturing by the semi additive process (SAP) and associates its products with multiple stages from through-hole preparation through build-up processing and final surface treatment. In the through-hole stage, multilayer printed wiring boards such as 4-layer or 6-layer boards can serve as the substrate core; the process includes roughening the copper-electroplated surface, filling through holes with thermosetting inks, drying and removing ink residues, and fully curing the inks. If through holes are fully filled by copper electroplating, the plug-in through electroless-copper-plating steps can be omitted, and the company notes that electroplating fill can also increase thermal conductivity. For full filling of through holes by electroplating, OKUNO lists TOP LUCINA LTF and related products. For de-smear and electroless copper plating, it lists OPC-1000 PROCESS DS, OPC PROCESS, and OPC H-TEC PROCESS, used in steps that remove resin debris, roughen ink-filled areas, catalyze the surface, and conduct electroless plating. For copper electroplating and pattern plating, OKUNO lists the TOP LUCINA series; pattern plating simultaneously plates via holes and circuit patterns, and via holes can use conformal plating or full-filling plating. The process description notes the use of Via on Via, or stacked vias, for high-density interconnection and small-pitch mounting, making full filling important together with macro-throwing power and via-filling performance in acid copper plating additives. Dry film resist processing includes PWB pre-treatment, DFR lamination, exposure, development with sodium carbonate solution, and stripping with alkaline solution; OKUNO lists OPC PERSORRY series and BUBBRAT R-2 for DFR stripping. After insulating-layer lamination creates a build-up layer, laser drilling forms via holes, and OKUNO lists OPC FLET PROCESS and related products for subsequent de-smear and electroless copper plating. The semi additive process also includes flash etching, surface roughening, and palladium-residue removal, for which OKUNO lists OPC PALLADELETE S and related products; removing palladium can support high-level insulation properties and help avoid deposition between patterns in later electroless Ni/Au or other steps. For solder resist, the process can apply PSR by screen printing or static printing, while film-type solder resist can be applied with a vacuum laminating machine before exposure, development with alkaline solution, and post-curing. For final surface treatment, OKUNO lists TOP ICP PROCESS and SUBSTAR SN series and describes electroless nickel/(palladium)/gold plating, electroless tin plating, and solder leveling treatment for surface mounting. Beyond the detailed package-substrate flow, the surface-treatment business provides chemicals and proposes processes and equipment for applications including semiconductor wafers, semiconductor package substrates, printed wiring boards, aluminum products, and plastics, with offerings such as anodizing, corrosion-resistant plating, and high-function plating chemicals. The surface-treatment portfolio specifically includes chemicals for plastic plating, chemicals for electroless nickel plating, and electroless copper processes for semiconductor package substrates, while the company also states that it is developing more environmentally considerate products. The advanced-materials business applies expertise developed in glass to materials for automotive and electronic components, including glass materials for electronic components and silica-based coatings that can provide water resistance and insulation to metal materials and magnetic powders. The machine-engineering business uses technology and experience developed through chemical and food-additive manufacturing and volume-production support to design equipment and facilities starting from the product, especially in fields such as semiconductors. Its customer support in machine engineering extends from process certification through realization of volume production and stable operation, linking process chemistry with equipment implementation and production support. The surface-treatment business states that its products have accumulated extensive worldwide application experience in smartphones, earphones, cameras, automobiles, and home appliances. In advanced materials, OKUNO's GLASS COLOR, a glass enamel for firing, is used for glass bottles, cups, automobiles, and other applications; the company states that it has the highest market share for beverage bottles and that its automotive products are adopted in many vehicle models. The advanced-materials business also applies glass expertise to glass frit and glass paste for increasingly diverse and high-performance electronic devices, as well as high-performance materials for automotive and electronic components. In the life-solutions business, OKUNO states that it was the first in Japan to industrialize baking powder and that it holds a leading domestic market share in antibacterial agents; it also develops preservatives and quality improvers while pursuing products intended to reduce food waste. The life-solutions business has obtained ISO22000 for its food-safety management system and expanded halal-certified products, which the company links with stronger support for customers entering overseas markets and with more than 120 years of accumulated food-industry technology and know-how.
Capabilities and products
- plating chemicals for semiconductor package substrates
- through-hole full-fill copper electroplating chemicals
- desmear and electroless copper process chemicals
- copper electroplating process chemicals
- DFR stripping chemicals
- pattern plating process chemicals
- flash etching and surface roughening chemicals
- palladium residue removal chemicals
- electroless nickel/palladium/gold surface finishing
- electroless tin plating and solder leveling