At a glance
| Booth | P6101 |
| Country | MY |
| Website | www.nswautomation.com |
Company profile
NSW Automation Sdn Bhd was founded in 2004 and is headquartered in Penang, Malaysia, specializing in high-performance micro-volume liquid dispensing solutions for advanced electronics manufacturing. The company reports operations and support offices in the USA, Russia, China, Taiwan, South Korea, Southeast Asian countries, Germany, the UK, Switzerland, and other markets. The i-DR S350 is a compact benchtop or desktop precision fluid dispenser designed for flexible relocation and space-constrained engineering environments. NSW positions the i-DR S350 for R&D departments, small-scale manufacturing, high-mix low-volume production, prototype samples, and repair work that benefits from rapid setup and conversion. The S350 includes 3D dispensing, pre-dispense simulation, vision mapping, and calibration functions. Its positioning system combines closed-loop servo drive with precision-ground ball-screw transmission for demanding dispensing applications. In December 2020, NSW recorded the SD1 Series Product Launching Day as a company milestone. In July 2025, NSW announced a collaboration with Scrona AG focused on sub-micron dispensing breakthroughs, followed in September 2025 by a MEMS micro-dispensing solution for precision manufacturing. In November 2025, NSW recorded the signing of an MoU with Kaynes Semiconductor in India. In June 2026, NSW Automation recorded a SOBA 2025 Award as Best Use of Technology Platinum Winner.
Exhibits
NSW Automation's precision fluid dispensing systems can dispense UV glue microdots as small as Ø40 μm and standard Type-6 solder paste microdots and lines as small as Ø80 μm. Its micro-dispensing application range covers fine lines, fine dots, Micro-DAM, micro-bumps, high-standoff Micro-DAM, and micro-cavity filling on uneven surfaces. For semiconductor production, NSW lists microscopic wafer-level dispensing, MEMS-device and micro-component soldering, flip-chip processes, 3D packages, PoP, and SiP. For LED manufacturing, its dispensers handle phosphor processes intended to control emitted color and brightness, while SMT applications include hybrid assembly, 5G optical-communication manufacturing, 008004 SMD soldering, and microscopic component assembly. Other application sectors listed by NSW include biotechnology and medical test kits, EV and automotive tire sensors and ECUs, aerospace electronics and MEMS, industrial assembly, and military-grade cameras, drones, and electronics. The materials list includes solder paste, phosphor, conductive and non-conductive adhesives, UV glue or adhesive, TiO2, silicone gel, silver epoxy, chemicals, epoxies, solvents, general liquids and semisolids from low to very high viscosity, creams, and pastes. Manufacturing-process coverage includes Micro-DAM, wearable-tech assembly, 5G module and device manufacturing, FPCB or PCB dispensing, micro soldering, flip-chip packaging, Micro 3D SiP, 008004, 01005 and 0201 SMD soldering, underfill, MEMS dispensing, VCSEL manufacturing, COB, CMOS assembly, and wafer-level dispensing. Additional processes include die coating, glasses and lens edge coating, EMC, dam and fill, hot melting, LED encapsulation, EV ECU and module assembly, surface-mount adhesive, solder-paste micro-bumping, lid attach, trench or cavity filling, and coating or sealing. NSW states that its microdispensing systems have achieved 40μm liquid dot or line size for UV glue and 80μm for T6 micro solder paste, with these sizes associated with the SD1, W12, S400, and A300 automated fluid-dispenser series. NSW also reports collaboration with indium corporation to optimize solder-paste formulation for its micro-dispensing equipment and improve reliable fine-volume dispensing results. The i-DR A300 Series comprises A301, A302, and A304 automated intelligent fluid-dispensing handler systems for large-scale production, built on a granite base for stable, repeatable dispensing. The series lists primary-head XY-axis accuracy of ±15µm/200mm at 23°C, together with smart volume control, auto fluid compensation and monitoring, and SMEMA and SECS/GEM compliance. The i-DR A301 uses a single-pump architecture for applications including 5G optical devices, MEMS, SMD soldering, SMD components, and micro soldering, with a reinforced granite base and closed-loop linear encoding on the XY gantry. The i-DR A302 is a dual-pump system that runs two dispensing pumps simultaneously and is positioned for mid-to-high-complexity dispensing forms, MEMS, and memory-chip products. The i-DR A304 uses quad-pump technology for simultaneous dispensing of complex z-axis designs, with multi-axis programmability intended to raise throughput, shorten cycle time, reduce material waste, and maintain consistent quality. A smart auto magazine handler uses sensors for automatic loading and unloading and can alert the operator to possible failures or misplacements before system failure. For Industry 4.0 operation, the A300 Series combines smart sensors, algorithms, and machine-learning capabilities to adjust processes in real time for high-volume production. Its self-weighing calibration system measures dispensing volume and weight, while Smart Volume Control repeatedly self-tunes toward the desired dispense volume to compensate for inconsistency and temperature instability. Inline dispensing-volume monitoring can identify defect locations, mark rejected workpieces in a server database, and support defect control during production. The e-mapping function can use an e-map file as a dispensing path, while an integrated line-scan camera can identify the dispensing area and XYZ position of the workpiece. Vision calibration acquires the XY dispensing position and detects misaligned workpieces, while laser height measurement checks workpiece surface height on features such as dense holes, trenches, cavities, reflective metal, and dark surfaces before dispensing. The A300 platform supports linear-motor configurations on i-DR A301L and i-DR A302L for speed and precision, and ball-screw configurations on i-DR A301, i-DR A302, and i-DR A304 for a balance of performance and cost. Additional A300 features include an automatic nozzle-tip cleaner and an Intelligent Ai Heater with programmable workpiece heating for recipe-based temperature control. The i-DR S420 Compact Smart Dispenser is presented as a CE-certified all-in-one platform with an enclosed design intended for safe and ergonomic operation. Its redesigned motion platform uses direct servo-motor drive and closed-loop linear encoding to maintain motion accuracy over long operating hours and enable rapid pump switching. The S420 supports five dispensing-pump technologies: squeezing micro-dispensing, volumetric dispensing, auger dispensing, non-contact jetting, and time-pressure dispensing. For program setup, the platform can import Gerber, DXF, ODB++, and Microsoft Excel formats, and its plug-and-play pump-conversion design is intended to change pumps and valves in minutes. A closed-loop auto-weighting algorithm can compensate for dispensing inaccuracy and can be configured to detect imprecise volume before, during, and after dispensing. The S420 combines a full enclosure and safety interlock with a high-efficiency HEPA filter to limit dust contamination in the dispensing workspace. Its vision system acquires the exact XY dispensing position and detects misaligned workpieces, while the laser-height system measures surface height before dispensing and can be paired with optional confocal sensing. R&D support features include interchangeable pump heads, a larger dispensable space for larger wafers or small-scale manufacturing, clean-room readiness, an automatic nozzle-tip cleaner, and programmable smart heater control. The W12-2020 Wafer Handling Dispenser is a precision mass-production platform for wafer-level underfill, micro-dispensing, and coating, with a granite platform, 12-inch wafer support, SMEMA compliance, automation-cell configurability, AMHS interface, temperature control, and compatibility with multiple dispensing systems. Automatic wafer loading and unloading is used to streamline the dispensing flow, and the platform is described as fully customizable to application requirements. The W12-2020 lists a 600mm x 400mm XY-axis stroke for 12-inch wafer handling together with wafer-map or CAD import. Options and supporting features include an FFU HEPA filter for clean-environment control, SECS/GEM integration and license option, thermal control at the nozzle and work area, and automatic dispensed-weight calibration. The motion system uses a high-accuracy four-axis linear or servo drive for XYZ movement and wafer rotation, with 0.5µm resolution from a linear encoder system. Vision calibration is used for wafer fiducial scanning and XY alignment, while a non-contact confocal chromatic sensor can optimize height calibration on highly reflective and transparent surfaces. The system integrates automatic XYZ offset calibration, nozzle cleaning, closed-loop dynamic dispensed-weight control, optional nozzle enlarged-view monitoring, and configurable stand-alone or multi-cell automation. Its wafer-transfer sequence covers cassette loading and pre-alignment, end-effector insertion, placement on the wafer chuck, dispensing, wafer removal, and pre-alignment before return to the cassette.
Capabilities and products
- desktop 3D precision dispensers
- 40μm UV adhesive microdot dispensing
- 80μm Type-6 solder paste microdot and line dispensing
- multi-pump synchronized precision dispensing systems
- 12-inch wafer-level automatic dispensing systems
- squeezing microdispensing
- volumetric metered dispensing
- auger dispensing
- non-contact jet dispensing
- time-pressure dispensing
- underfill dispensing
- micro-dam and fill dispensing
- trench and cavity filling
- LED phosphor dispensing
- liquid metal microdispensing
- conductive and non-conductive adhesive dispensing
- TiO2 microdispensing
- silver epoxy dispensing
- silicone gel dispensing
- solder paste dispensing for 008004/01005/0201 SMDs
- LED encapsulation dispensing
- die coating and lid-attach dispensing
- glass and lens edge coating
- hot-melt dispensing
- automatic magazine loading/unloading for dispensing
- automatic wafer loading/unloading and pre-alignment for dispensing
- inline dispensing volume monitoring
- dispensing vision alignment calibration
- Gerber/DXF/ODB++ dispensing path import
- wafer map and CAD dispensing path import
- SMEMA/SECS/GEM production-line communication integration for dispensing equipment
- automatic dispensing nozzle cleaning
- temperature control for dispensing nozzles and work stages
- precision dispensing equipment customization
- dispensing weight calibration and closed-loop volume compensation
- laser height measurement before dispensing
- confocal height calibration for reflective and transparent surfaces