At a glance
| Booth | R7724 |
| Country | DE |
| Website | www.notion-systems.com/about-us/trade-fairs-conferences.html |
Company profile
Notion Systems GmbH is a One Stop Solution Provider with decades of expertise in photolithography, wet processing, and inkjet printing of functional materials, covering the steps required to scale processes from laboratory work to industrial production. The company builds photolithography processing systems, wet processing systems, and industrial inkjet platforms, and offers integrated solutions for semiconductor, MEMS, and advanced display manufacturing. Its n.jet platform is used for electronic displays, printed circuit boards, semiconductor components, and high-precision optical 3D parts, while its semiconductor processing range covers wafer handling, coating, cleaning, etching, and bonding. Notion Systems GmbH is headquartered in Schwetzingen near Heidelberg, has a manufacturing site in Singen, and works with sales and service organizations worldwide with a focus on Asia, Europe, and North America. Since June 2024, the company has been based at a new Schwetzingen location with 3,600 m² of space, including a larger application laboratory plus expanded warehouse and assembly areas for work preparation. It also operates an R&D and application centre in Singen and the Notion Advanced Application Center in Schwetzingen, and it offers platform engineering. Its development work brings together expertise in process development, software, and engineering to create tailor-made systems and stable processes. Notion Systems GmbH is a member of the LAB14 Group, whose companies combine complementary products and services for nano- and microfabrication and surface-analysis applications. LAB14 supports the growth of its individual companies and promotes technical and commercial synergies among them; LAB14 is a subsidiary of RSBG SE and is wholly owned by the RAG foundation. In July 2025, Notion Systems GmbH merged with Osiris International GmbH, combining Osiris automation and photolithographic process systems with Notion Systems industrial inkjet printing technology. The combined company is integrating Osiris automation plus pre- and post-processing capabilities into Notion Systems modular inkjet platforms to provide an end-to-end manufacturing ecosystem.
Exhibits
The photolithography and wet-processing portfolio includes systems up to 150 mm, including n.amr semi-automated processing systems and n.amc fully automated processing systems, as well as 200 to 300 mm systems such as n.unixx semi-automatic laboratory systems, n.varixx automatic combined cluster systems, n.chemixx wet-processing systems, and n.maxx systems for large substrates. The broader product range also includes automated lithography and PV lab cluster tools, inkjet printing systems, and industrial solutions for display, electronics, and semiconductor manufacturing. For semiconductor manufacturing, the n.jet semicon series supports frontend and backend processes and combines integrated edge handling for any substrate type or wafer size with MES integration such as SECS-GEM and pre- and post-processing modules. The n.jet semicon platform can also be combined with high-precision dispensing units, extending the range of processable materials on the same platform. Nozzle-replacement strategies and full process control are used to improve yield and process stability. Its high-precision inkjet capability provides drop-placement accuracy better than 5 micron, high uniformity, as many as 8 different fluids in one print, and support for printheads from all major manufacturers. Inkjet is used as a non-contact digital printing process for structures of 30 microns and below, enabling wet-on-wet processing without masks or screens and replacing established subtractive process sequences while reducing waste and energy consumption. The printing process can reach up to 100,000 droplets per second per nozzle and is highly parallel, typically using more than 10,000 nozzles per print unit at a pitch of 20 to 200 micrometres. Print strategies are designed to increase platform usability and process yield by minimizing manual intervention and manual mechanical alignment of printheads. The printhead maintenance system avoids direct contact with the nozzle plate to support jetting stability and printhead lifetime, while automated nozzle calibration and advanced nozzle-replacement strategies provide process control and reliable results. Optional wafer handling can cover various substrate sizes, with robot handling to and from cassettes including wafer mapping and prealignment; additional stations can include plasma cleaning, hotplates, UV curing, and other pre- or post-processing steps. For laboratory applications, the n-unixx-SERIES can combine spin and spray coating, developer, temperature, and smartEBR modules in stand-alone or bench-mounted configurations, using a base frame that permits different process-module configurations. The n-unixx platform supports round wafers up to Ø300 mm (Ø12 inch) and square substrates up to 230 x 230 mm (9 x 9 inch). Its listed process applications include spin coating with a Covered Chuck Processor or open bowl, spray coating for varied topographies and shapes, softbake, hardbake, HMDS vapor priming, vacuum drying, coolplates, developing, cleaning, and drying. The processing range also includes bonding and debonding for glass, Saphire, Silicon, Ceramic, and other materials on request, together with high-precision inkjet printing for any substrate type or wafer size.
Capabilities and products
- photolithography processing systems
- wet processing systems
- inkjet printing systems for semiconductor manufacturing
- high precision inkjet printing
- wafer mapping and prealignment
- spin and spray coater
- substrate bonding and debonding processes