At a glance
| Booth | X0031 |
| Country | JP |
| Website | www.neg.co.jp |
Company profile
Nippon Electric Glass Co., Ltd. provides high-precision glass materials for semiconductor support and packaging, covering glass from low to high thermal expansion and glass that can be tailored to a requested coefficient of thermal expansion. Its semiconductor-oriented portfolio includes carrier glass wafers, glass core substrates for fine-pitch TGVs, nanoscale-roughened surfaces for Cu adhesion, and an extreme-environment battery for semiconductor manufacturing. The company also supplies micro glass prisms for optical communication, medical, and sensing applications and micro lens arrays for optical communication and other uses, with high dimensional accuracy obtained by precision glass molding. For Wafer Level Chip Size Package CMOS image sensors, Nippon Electric Glass Co., Ltd. offers low-expansion, alkali-free, polishing-free glass wafers used as cover glass. The support-glass lineup includes glass codes ABC-G, A58, A66S, A69, A75, and A91S, while the CSP wafer information identifies ABC-1. Across these products, the company documents material properties including thermal expansion, Young’s modulus, dielectric characteristics, volume resistivity, refractive index, and optical transmittance to support material selection for electronic and semiconductor uses.
Exhibits
Glass Wafer for Supporting Semiconductors is a high-precision carrier substrate that supports chips and other components in the semiconductor packaging process, rather than a substrate that merely carries a general glass label. The support-glass range extends from low to high expansion, and glass with other coefficients of thermal expansion can also be provided upon request. For the listed support wafers, TTV below 1 μm is possible at Φ12 inch, and T7 code compatibility is also stated. The glass codes ABC-G, A58, A66S, A69, A75, and A91S have listed coefficients of thermal expansion spanning 3.6 to 8.7 ppm/℃ at 20-220℃ and 3.7 to 8.8 ppm/℃ at 20-260℃. The same property table lists Young’s modulus values from 70 to 77 GPa, dielectric constants from 5.3 to 7.7 at 1MHz and 25℃, tan δ values from 0.001 to <0.03, and volume-resistivity data at 150℃ and 250℃. Documented applications for the support glass include support substrates for advanced packages, compound semiconductors, and precision polishing. A nanoscale-roughened surface is provided for Cu adhesion with negligible impact on transmission loss, specified as ≤0.01 dB/cm at 60 GHz. The Extreme-Environment Battery for Semiconductor Manufacturing is described as providing reliable operation even above 200℃. The glass core substrate for semiconductor packages is designed for fine-pitch TGVs and offers greater flatness, smoothness, and rigidity than organic material-based substrates such as glass epoxy substrates, supporting larger sizes. Micro Glass Prisms address optical communication, medical, and sensing applications, while Micro Lens Arrays address optical communication and other uses with high dimensional accuracy from precision glass molding. Glass Wafer for CSP is a low-expansion, alkali-free, polishing-free wafer used for the cover glass of Wafer Level Chip Size Package CMOS image sensors. The CSP wafer is described as As- and Sb-free, having excellent surface quality, and supporting various thin-film coatings. For glass code ABC-1, the listed properties include a thermal-expansion coefficient of 37 ×10-7/K at 30～380℃, density of 2.52 ×103kg/m3, Young's modulus of 78 GPa, and Poisson's ratio of 0.2. ABC-1 also lists volume resistivity Log ρ of 13.0 at 350℃, dielectric constant 5.6 and tan δ 0.001 at 1MHz and RT, refractive index 1.53 at 587.6nm, and transmittance of 92% at λ=550nm. Related support-glass information also names Zero CTE Glass: ZERO™, Neoceram N-0 and N-11, and Negative Thermal Expansion Ceramic Substrate: CERSAT™.
Capabilities and products
- glass wafers for supporting semiconductors
- glass tailored to requested thermal-expansion coefficient
- nanoscale-roughened glass surface for Cu adhesion
- extreme-environment battery for semiconductor manufacturing
- glass-core substrates for semiconductor packages with fine-pitch TGVs
- micro glass prisms for optical communication, medical and sensing
- micro lens arrays for optical communication
- cover glass wafers for WLCSP CMOS image sensors