At a glance
| Booth | K3276 |
| Country | TW |
| Website | www.nidec.com/en/nidec-advancetechnology/news/2026/products/260826_semicontaiwan_2026 |
Company profile
NIDEC ADVANCE TECHNOLOGY TAIWAN CORPORATION manufactures, sells and maintains inspection systems and inspection fixtures as the Taiwan entity within the NIDEC ADVANCE TECHNOLOGY network. The wider NIDEC ADVANCE TECHNOLOGY CORPORATION is a comprehensive manufacturer of measuring and inspection equipment whose mission is to contribute to manufacturing through measurement and inspection technology. NIDEC ADVANCE TECHNOLOGY CORPORATION was founded on Nov. 25th, 1991 and had 303 employees on a standalone basis and 2,027 employees on a consolidated basis as of March 31, 2026. Its Japan operations include a head office and factory in Muko city and sales offices in Tokyo and Nagoya. The parent company's business covers semiconductor package inspection systems, printed circuit board inspection systems, inspection fixtures, optical vision inspection systems, flat panel display inspection systems, automatic measurement equipment and special inspection machines, together with development, design, manufacturing and sales of related software and hardware. Its products were developed for high-speed, high-accuracy measurement and inspection of fast-evolving electronic components, combining high-performance integrated circuits and software, hardware capable of submicron control, fixtures for processing and assembling multi-pin and narrow-pitch components, two- and three-dimensional optical imaging and three-dimensional process technology. These measurement and inspection technologies are used on production lines around the world, with the company's technical strength centered on integrating a broad range of elemental technologies. In Japan, affiliated companies develop, manufacture and sell microtube products and MEMS spring probes, and other affiliates develop, manufacture, sell, maintain and repair probe cards. Outside Japan, the network includes entities for manufacturing, sales, development, maintenance and repair of inspection systems, fixtures, optical vision inspection systems and probe cards across Taiwan, Korea, Zhejiang, Thailand, Canada, Malaysia, Vietnam, India, Singapore, the United States and Suzhou. NIDEC ADVANCE TECHNOLOGY TAIWAN CORPORATION's own role in that network is specifically the manufacturing, sales and maintenance of inspection systems and fixtures.
Exhibits
For increasingly dense, multi-pin and fine-pitch semiconductor package substrates and printed circuit boards, NIDEC ADVANCE TECHNOLOGY provides measurement and inspection technologies that can detect and analyze failure modes that conventional inspection conditions could not measure. The inspection and measuring lineup includes automatic electrical inspection equipment, inspection jigs, automated optical inspection systems, automotive measuring instruments for EVs and automotive-parts inspection equipment. Automatic electrical inspection products include Semiconductor Package Inspection System, Printed Circuit Board Inspection System, Touch screen panel and FPC Inspection System and electrical inspection testers. Inspection-jig products include 4-wire Inspection Fixture, MEMS Spring Probe, Electroforming barrel (Microtube) and MEMS Spring, while optical inspection products include AOI System for Semiconductor Wafers and AOI System for Package Substrates & PCBs. The broader measuring range also includes EV traction-motor test benches, inverter test benches, contract testing service and Power Semiconductor Module Inspection System. The GATS (Grid Array Testing System) series performs open/leak circuit testing on semiconductor package substrates including MCM, CSP and BGA, while related systems perform open/leak testing on motherboards and other printed circuit boards. Open/leak inspection systems are also available for touch screen panels and LCD or FPD products from singulated to multi-faced sizes, using a mix of contact and non-contact technologies. Electrical testers support continuity inspection across broad voltage and resistance ranges, from low to high voltage and from low to high resistance. Inspection fixtures probe conductors and electrode pads with high precision, and specialized software supports test-point selection and inspection-log analysis. Optical inspection systems locate conductor-pattern open/leak defects in photomasks and inner or outer layers and use optical technology to measure solder-bump and via-hole shapes and find scratches and stains. Probe cards are provided for advanced wafer-test challenges. Mechatronics technology combines tester performance with high-precision positioning, high-speed feeding, safe compact machine design and in-line engineering with upstream and downstream inspection processes for mass-production inspection. Fixture technology combines CAD/CAM, probing and precision machining to contact inspection points accurately on ultra-fine-pitch circuit patterns, with this expertise supplied worldwide. MEMS process technology uses three-dimensional processing from electroforming through exposure, development and fine-pattern etching to address finer semiconductor manufacturing processes and precision inspection. Vision-inspection technology combines light sources, optical systems and inspection algorithms for non-contact judgment and high-speed, high-resolution detection of subtle defects that electrical measurement or visual inspection may not capture. The AURCA Series is an AI-powered 2D automated optical inspection system for semiconductor package substrates and printed circuit boards that combines high-speed full-color scanning with high-precision AI analysis. Full-color imaging increases the amount of information compared with monochrome images, enabling AI detection algorithms to identify defects that were difficult for the human eye while reducing false calls and missed defects. AURCA's AI analysis evaluates the shape and root cause of detected defects and feeds back why defects occurred to support upstream-process review and recurrence-prevention measures. Repeated use of this feedback cycle supports higher yield, lower manufacturing cost and quality improvement. The AURCA Series detects defects in traces, vias and surfaces and supports JEDEC-standard substrates, high-density package substrates, high-layer-count HDI boards, MSAP substrates and PLP, with system designs tailored to production-line configuration and required precision. Specific semiconductor-focused offerings include a 2D MEMS probe card for CIS/Memory, GATS®-7886 for high-precision conduction inspection of FOPLP/RDL and the AURCA Series as a next-generation AI visual inspection system adaptable to optical modules and large substrates.
Capabilities and products
- semiconductor package electrical inspection systems
- printed circuit board electrical inspection systems
- touch-panel and FPC electrical inspection
- AOI systems for semiconductor wafers
- AOI systems for package substrates and PCBs
- MEMS spring probes
- 2D MEMS probe card for CIS/Memory
- high-precision conduction inspection for FOPLP/RDL
- AI visual inspection system
- Power Semiconductor Module inspection system
- 4-wire inspection fixture
- electroformed Microtube inspection-fixture component
- EV traction-motor performance test bench
- Back-to-Back inverter test bench for PHEV/HEV drives
- contract testing service
- OPEN/LEAK testing for MCM/CSP/BGA packages