At a glance
| Booth | N1187 |
| Country | KR |
| Website | www.nextinsol.com |
Company profile
NEXTIN, Inc. is a semiconductor equipment technology company that manufactures and sells wafer inspection systems for detecting defects and particles generated during semiconductor circuit fabrication, with the inspection task specifically situated in the front-end line where those circuit-fabrication defects and particles occur. It also manufactures electrostatic charge removal systems that remove static electricity to increase the yield of EUV processes. Based on its own 2D imaging technology, NEXTIN, Inc. states that it developed the world's first wafer inspection systems for 1*nm semiconductor-device manufacturing processes. The same 2D imaging technology also underpins 3D wafer inspection equipment suited to related semiconductor manufacturing processes. NEXTIN, Inc. supplies equipment to cutting-edge memory-device producers including Hynix, CXMT and YMTC and to global foundry companies including Samsung Electronics, SK Key Foundry and SMIC, giving its stated customer base both advanced memory-device producers and foundry manufacturers. The company describes itself as growing day by day together with its customers through this equipment supply to advanced semiconductor manufacturing companies and producers.
Exhibits
NEXTIN, Inc. presents inspection solutions for semiconductor manufacturing that include a laser-based patterned-wafer defect inspection tool and a defect-inspection solution for 3D device processes. The AEGIS series is a high-performance wafer inspection system based on NEXTIN's 2D imaging technology for complex semiconductor manufacturing processes at 1x nm nodes and above, and it is designed to find diverse defects with fast, high-sensitivity inspection so it can respond to customer efforts toward early process stabilization and yield improvement; NEXTIN also characterizes the equipment as cost-effective. AEGIS supports simultaneous Bright field and Dark field inspection, while NEXTIN's patented dual-mirror focal-plane assembly technology is stated to enable high-sensitivity defect inspection at the fastest inspection speed. The AEGIS wafer inspection system supports both 200mm and 300mm wafers so it can address different customer requirements. Across film, patterning, planarization, ion-implantation and cleaning processes, AEGIS is described as effectively detecting diverse pattern defects such as Bridge, Thinning, Projection and Foot as well as non-pattern defects such as Scratch and Particle. Listed AEGIS applications include STI, poly, contact and gate etch, metal and via/trench etch, Cu CMP, Micro ADI/photo cell monitor, Tool monitor, Films and Post-CMP films.
Capabilities and products
- front-end wafer defect and particle inspection system manufacturing
- EUV-process electrostatic charge removal system manufacturing
- 3D wafer inspection equipment
- laser-based patterned-wafer defect inspection
- defect inspection for 3D device processes