At a glance
| Booth | I2510 |
| Country | TW |
| Website | www.twyfp.com |
Company profile
New YF Precision Corporation specializes in thin-film and surface-treatment technologies and serves Taiwan's semiconductor industry as an equipment agency and technical service provider, supplying semiconductor-process equipment, materials and technical solutions intended to help customers improve process yield and technical capability. Its experienced and responsive team provides customized equipment retrofits and process upgrades for different industry needs, with technical services spanning wafer processing, optoelectronic modules and advanced packaging and expanding into compound semiconductors and advanced displays. The company has developed ALD technology for TEM sample preparation that it says is widely adopted by 12-inch wafer fabs and third-party laboratories, with a market share exceeding nine-tenths in advanced sample-preparation applications. It also reports results in Mini LED backlight modules and Micro LED, with products adopted by international manufacturers and entering global supply chains. Its technology portfolio further covers GaN, GaAs and SiC compound semiconductors, laser-semiconductor applications, Micro LED, Micro OLED and biomedical materials. To support material surface treatment, New YF Precision Corporation introduces Henniker Plasma equipment covering vacuum-plasma and atmospheric-plasma technologies for surface cleaning, modification, activation and coating. The Henniker Plasma offering is presented as a way to improve product quality and production performance, and a stated model can reach monthly capacity of 70,000 4-inch wafers and to have been adopted by an international LED manufacturer. Through cooperation with Sentech Instruments GmbH, the company has introduced atomic layer etching and real-time thickness monitoring for 2D material integration, nanosheet circuits and GaN HEMT processes. The Sentech-related technology is described as enabling low-damage, smooth-surface and high-precision etching, improving heterogeneous-material integration yield and electrical performance and supporting commercialization of advanced processes. New YF Precision Corporation also supplies Intlvac ion-beam technology for specialized applications including EUV masks, Sic-optics and Diamond waveguides. The company states the operating principles of integrity, professionalism and innovation and positions itself as a technical partner that will continue to focus on semiconductor-process equipment and technology while introducing other advanced application technologies and expanding its product lines and technical services.
Exhibits
The SENresearch 4.0 spectroscopic ellipsometer covers a 190 nm to 3,500 nm spectral range, uses innovative SSA step-scan technology with no moving parts and a fast FTIR ellipsometer design, and is described as capable of precise measurement of thick films up to 200 µm. The SENTECH SI 500 ALE atomic layer etching system extends advanced plasma processing with a stable low-pressure, low-power plasma environment and combines patented planar triple-spiral antenna (PTSA) technology, dynamic stage temperature control and backside helium cooling for digital cyclic etching at ultra-low ion energy. The SENTECH SI 500 ICP-RIE platform uses a PTSA-ICP plasma source for low-damage, high-aspect-ratio and high-rate etching and can be extended to Cryo, DRIE deep-silicon etching and ALE atomic layer etching. The same product listing also identifies compact RIE options including SI 591 and Etchlab within the Sentech etching portfolio. SENTECH SI PEALD is a plasma-enhanced atomic layer deposition system using a true remote plasma source to achieve highly uniform and conformal thin-film deposition below 100°C, making it suitable for sensitive substrates and complex 3D structures. SURAGUS EddyCus® lab 2020 TM is listed as a benchtop non-contact measurement instrument using high-precision eddy-current technology for single-point measurement of conductive-film sheet resistance and metal-layer thickness. Attolight Allalin is presented as a wafer-level Cathodoluminescence (CL) analysis system integrating SEM with a high-efficiency optical module and supporting CW-CL and TR-CL analysis. PTC 574CM is a passive surface-temperature indicator with a 10–260°C measurement range that requires no power and uses a strong magnet and spring clip for rapid temperature confirmation on industrial equipment, piping and laboratory environments. The product range also includes Theris NanoShell nanoparticle shell-coating modules and Theris ultra-high-vacuum nanoparticle deposition PVD equipment. Theris TAS-RF atomic-source modules are listed for ion-free oxide and nitride deposition, adding an ultra-high-vacuum nanoparticle-deposition module to the portfolio. Theris NanoStream uses a modified DC sputter source to generate vapor from a metal target such as a copper disk, and controlled source pressure, plasma temperature and gas-mixture flow are described as causing the vapor to condense into nanoparticles. New YF Precision Corporation also provides outsourced plasma surface-treatment services for surface cleaning, modification, activation and coating processes. Its broader listed product structure spans components, process equipment and measurement equipment, including Memetis microfluidic control valves and modules, Sentech process equipment, Korvus three-in-one modular PVD, UniTemp high-vacuum thermal processing, used Picosun ALD equipment, Henniker Plasma low-damage surface treatment, Suragus and Attolight measurement products and Film Sense multi-band ellipsometry.
Capabilities and products
- custom equipment retrofit and process upgrade
- ALD technology for TEM sample preparation
- outsourced plasma surface cleaning/modification/activation/coating
- supply of vacuum/atmospheric plasma surface-treatment equipment
- supply of spectroscopic ellipsometry equipment
- supply of ALE atomic layer etching equipment
- supply of ICP-RIE plasma etching equipment
- supply of PEALD plasma-enhanced atomic layer deposition equipment
- supply of conductive-film sheet-resistance and metal-thickness measurement equipment
- supply of wafer-level cathodoluminescence (CL) analysis system
- supply of ultra-high-vacuum nanoparticle PVD equipment
- supply of microfluidic control valves and modules
- supply of 3-in-1 modular PVD equipment
- supply of used ALD atomic layer deposition equipment
- real-time thickness monitoring technology
- ion-beam technology supply for EUV masks, Sic-optics and Diamond waveguides
- supply of nanoparticle shell-coating modules
- supply of ion-free oxide/nitride deposition atomic-source modules
- supply of ultra-high-vacuum nanoparticle deposition modules
- supply of high-vacuum thermal-processing equipment