At a glance
| Booth | M1058 |
| Country | TW |
| Website | www.nds-tw.com |
Company profile
NDS (TAIWAN) CO., LTD. was established in 2009 and describes itself as a global provider of dicing solutions for the semiconductor industry. Dedicated technical teams are located in Japan, Taiwan, and China, supporting semiconductor manufacturers worldwide across production stages. Its portfolio spans high-precision dicing blades, advanced dicing tapes, consumables, auxiliary equipment, and eco-friendly cooling solutions, with an emphasis on precision, process efficiency, and reliable support.
Exhibits
The dicing-blade lineup includes a New Metal Bond Blade for system-in-package (SiP) dicing together with Resin Bond, Electroformed Bond, Vitrified Bond, and Metal Bond blades. The Electroformed Bond Blade uses an electro-formed nickel bond and is described as ultra-thin, high-strength, stiff, and highly rigid, with high endurance and a very low blade-wearing rate during cutting. Its features include sophisticated electro-forming, multiple bond choices for different workpieces, and exclusive development and customization for applications such as EMC LED, Chip LED, WLCSP, compound materials, silicon, magnetics, ceramics, and work requiring an ultra-thin blade. A listed electroformed specification is 600-AA with 56D OD, 0.1T thickness, 40H ID, 1w slit width, 2d slit depth, and 16N slits. The electroformed range lists OD sizes of 49~115 mm, thicknesses of 0.025~0.25 mm, and ID selections including 25.4, 30, 39, 40, 50.8, 83, and 88.9 mm with H6/H7 references. Available electroformed grit specifications run from #5000 through #325 across thickness bands from 0.025~0.03 mm up to 0.101~0.20 mm, while slit options include 8N, 16N, 32N, and 64N configurations. The Metal Bond Blade is sintered and mold-pressed under high temperature and pressure, giving it high rigidity, higher wear resistance, a balanced wearing profile, higher stiffness, and long blade life. NDS states that the metal-bond construction can reduce defects such as slant cut and PKG size or profile issues, and lists uses for sapphire, BGA-family packages including BGA, LGA, CSP, SiP, MCP, EMMC and uSD card, CIS and optical glass, quartz, MLCC, and ceramics. One metal-bond specification is SD600-25-MH with 56D OD, 0.15T thickness, and 40H ID. The metal-bond dimensional range lists 50.8~125 mm OD, 0.10~0.35 mm thickness, and 40/55/75/88.9 mm ID with H6, while concentration is shown from 15 ~ 125. Its standard grit table spans #3000 through #200 across blade thicknesses from about 0.10 mm to 0.35 mm, with SD and CBN grit types and several bond choices including MH, V, MS, M43, and M18. The Vitrified Bond Blade combines high rigidity and cutting capability to maintain entry and exit straightness and work-dimension precision under high loading, targeting hard materials such as crystals and sapphires. Its listed features are a conductive vitrified bond and porous material structure, with applications in hard and brittle materials including crystal, sapphire, and ceramic. For vitrified blades, NDS lists SD and CBN grit types, hardness grades G~S, bond codes N01~N10, and concentration values of 25~125. The vitrified dimensional table shows 49~125 mm OD, 0.07~0.6 mm thickness, and 25.4/40/88.9 mm ID with H7. Its slit choices include 8N, 16N, 32N, and 64N, and the standard grit table covers #3000 through #170 over thickness bands from 0.07~0.10 mm to 0.41~0.60 mm. The Resin Bond Blade is free-cutting and self-sharpening, and is designed to improve cutting quality and efficiency on ductile or gummy materials such as QFNs and copper as well as hard and brittle materials such as glass and ceramics. NDS highlights reduced copper burr and smear on ductile materials, improved chipping, feed rate, and blade life on hard brittle materials, and an ultra-thin blade above 50um for applications including QFN, CIS and optical glass, ceramics, quartz for optical-fiber communication, splitters, and IR-Cut Filter. A listed resin-blade specification is SD600-25BA with 56D OD, 0.1T thickness, and 40H ID. The resin dimensional table lists 52~76.2 mm OD, 0.05~0.60 mm thickness, and 40 mm ID with H7, while SD, SDC, and CBN grit types are paired with BA, BB, BQ, and BS bonds at concentrations of 25 ~ 100. The resin standard grit range runs from #3000 through #170 across thickness bands from 0.05~0.10 mm to 0.40~0.60 mm. The Hub Blade is used for silicon-wafer and compound-semiconductor-wafer cutting, using micrometer electroformed technology for higher process quality. Its process features include precise control of diamond distribution and ultra-high-speed separation that filters diamond grain with high precision, while an even surface distribution is intended to reduce backside chipping. Hub-blade applications include silicon wafers, IC and LED packages, CSP and BGA, compound semiconductors, and optical glass. A listed hub-blade code is 0206-SX E60/T20/70, and grit-size choices run from 0003 through 0408, corresponding to ranges from 0/3 µm through 4/8 µm. Bond choices HH, HS, HL, and HX cover hard, medium, soft, special, and long-life or low-concentration behavior, while concentration bands run from 130-110 down to 50-30 and standard thickness categories extend from E3 to E10. The NANO 321 Automatic Dicing Saw supports in-line dressing during dicing to eliminate operating time, reduce dicing cost, and increase productivity. It handles workpieces up to Max.φ12" or Max. 320 mm square, with 320 mm X-axis cutting range and 0.1~600 mm/s maximum cutting-speed range, plus a 320 mm Y-axis range and 0.00005 mm index step. The NANO 321 lists a 32.2 mm Z-axis stroke, 0.00005 mm Z-axis resolution, 0.001 mm repeatability, a maximum Φ60 mm blade, and a 360-degree theta-axis rotation. Its spindle is rated at 1.8 kW at 60,000 min-1 with 0.35 N·m rated torque and a 6,000~60,000 min-1 revolution-speed range, while machine dimensions are 1290 x 1180 x 1800 mm and weight is approximately 1,200 kg. Environmental guidance specifies room-temperature fluctuation within ±1 °C at a 20 - 25°C set value, cutting water 2 °C above room temperature within ±1 °C, spindle cooling water at 20 - 25 °C within ±1°C, and clean oil-free air with dew point of -15 °C or less. For sapphire wafers, NDS offers a special vitrified-bond grinding wheel that can continue grinding without dressing during processing, unlike the traditional process that requires dressing for every wafer. The SD 270VT and SD 325 VT wheels are stated to feed at 200um/min, reducing processing time through high wheel sharpness. With its special bond recipe, NDS reports the grinding ratio of SD270VT and SD325VT is reduced by 10%, with improved wear resistance intended to lower machine idling time and grinding-process cost. Because sapphire grinding generally requires high spindle torque and equipment rigidity, NDS recommends selecting the bond for each machine and offers 3w, 4w, 5w, and long-chip types to improve wear resistance. A general sapphire condition lists coarse grinding with Vitrified #325 at 200um/min feed and fine grinding with Vitrified #2000 at 30um/min feed. The NANO 150G Automatic Dicing Saw features an innovative vacuum system, shortened cutter-setup execution time, a user-friendly HMI, and improved operability. It supports workpieces up to Max. Φ 6" or □ 6", with a static-air-bearing spindle rated to 60000 rpm and 1.2 kW maximum output. The NANO 150G lists a 160 mm X-axis cutting range with 0.1 ~ 500 mm/s speed, a 160 mm Y-axis range with 0.000125 mm resolution, and a 25 mm Z-axis stroke with 0.00025 mm resolution and 0.001 mm repeatability. Its system uses a 15-inch color LCD with Chinese and English language support; outline dimensions are W650 x D860 x H1580 mm, weight is 320 kg, and power is 1Φ AC220V 50/60 Hz. Dicing-tape options include HUV-D1000 double-sided UV-cured tape, HUV-S3000 PET-base single-sided UV-cured tape, HUV-S4000 special-polyolefin-base single-sided UV-cured tape, HUV-S5000 PVC-film single-sided UV-cured tape, and HDC-S6000 PVC-base non-UV-cured tape. HUV-D1000 uses PET 25µm liners on both sides, 10µm adhesive layers, and PET base film in 50/75/100 µm options. For the single-sided tape series, listed base-film choices include PET 100/125/188 µm, PO 80/100/150 µm, and PVC 80/100 µm, with adhesive thicknesses of 10/20/25/30 µm, 10/20/30 µm, or 10 µm depending on series. Across its product pages, NDS also lists dielectric cooling fluids, an immersion cooling system, and an energy-saving configuration identified as PUE<1.1 alongside dicing saws, blades, tapes, grinding wheels, accessories, and auxiliary machines.
Capabilities and products
- electroformed nickel-bond dicing blades
- metal-bond package dicing blades
- vitrified-bond dicing blades for hard and brittle materials
- resin-bond dicing blades
- hub dicing blades for silicon and compound semiconductor wafers
- dicing blade customization
- automatic wafer dicing saws
- in-line blade dressing during wafer dicing
- vitrified-bond grinding wheels for sapphire wafers
- silicon wafer grinding wheels
- SiC wafer grinding wheels
- UV-curable dicing tapes
- non-UV-curable dicing tapes
- heat-resistant tapes
- thermal-release tapes
- polyimide tapes
- wafer dicing chuck tables
- dicing blade dressing boards
- CO2 bubblers
- wafer mounting machines
- curing systems
- wafer cleaning machines
- dielectric cooling fluids
- immersion cooling systems
- polishing pads
- polishing templates