基本資料
| 攤位 | M1058 |
| 國別 | TW |
| 產品分類 | PV: Cells · Solar Thermal · Backgrind; Slicing; Lapping; Polishing Equipment · Cleaning; Washing Equipment for Assembly & Packaging · Dicing; Sawing; Scribing; Separation Equipment · Solder Reflow; Soldering & Brazing Equipment · Wafer Mount; Taping Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Thin Film · Wafers · Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Etching; Stripping; Ashing - Dry and Wet Equipment · Test Contactor Cleaning; Conditioning Systems · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Scribe Tools; Saw or Dicing Blades and Accessories · Cleaning Chemicals; Solvents; Strippers · Surface protection material; coatings · CMP; Grind; Lap; Polish; Abrasive materials · Chucks for Wafer and other Substrates · Sawing; Lapping; Grinding; Polishing Service · IT; Data Processing Services · Sales; Manufacturers Representation or Distributors |
| 網站 | www.nds-tw.com |
公司簡介
NDS Taiwan 成立於 2009 年，是半導體產業中值得信賴的尖端切割（dicing）解決方案全球供應商。憑藉策略性布局於日本、台灣與中國的專責技術團隊，我們提供完整的產品組合，包括高精度切割刀（dicing blade）、先進切割膠帶（dicing tape）、必要耗材、輔助設備及環保冷卻解決方案。秉持對創新、品質與客戶滿意度的承諾，NDS Taiwan 以卓越的精密度、提升的製程效率，以及在各個生產階段的可靠支援，賦能全球的半導體製造商。
能力與產品項目
- 先進 dicing tapes
- 切割耗材
- 切割製程用環保冷卻解決方案
- 切割輔助設備
- 半導體產業切割解決方案
- 高精密切割刀片