At a glance
| Booth | I2430 |
| Country | JP |
| Website | www.napson.co.jp |
Company profile
Napson Corporation describes itself as a cosmopolitan precision-measurement company that develops, manufactures, and sells measurement systems and software for silicon wafers and ingots and for FPD process production. Its stated product range includes resistivity measurement for silicon wafers and thickness measurement for silicon wafers, covering two fundamental wafer-measurement categories. The company also provides sheet-resistance measurement for semiconductor thin films and sheet-resistance measurement for compound semiconductors, extending its electrical measurement work beyond bulk silicon wafers. For flat-panel processes, Napson Corporation lists sheet-resistance and thickness measurement for flat-panel thin films among its measurement products. Additional products named by the company include PN type checkers, lifetime measurement systems, and four-point probe heads, broadening the portfolio beyond resistivity and sheet-resistance systems alone. Napson Corporation was founded in 1984 and has since developed and manufactured resistivity and sheet-resistance measurement equipment for semiconductor wafers and thin films as a specialist manufacturer in this measurement field. The company states that development, design, manufacturing, and assembly are carried out in Japan at its Chiba factory, tying its measurement-equipment business to a domestic development and production base. Its sales record spans 20 countries, with deployment across Japan and multiple overseas bases, giving Napson Corporation both domestic and international reach for its measurement products. Napson Corporation offers a broad lineup from manual systems to fully automated equipment and nonstop inline configurations, and it also provides detailed customization for customer measurement requirements. The company supports semiconductor-wafer and thin-film research and development and process evaluation with resistance measurement instruments and related products, linking its measurement technology with both R&D and manufacturing-process assessment. Napson Corporation also describes itself as a leading company in resistivity and sheet-resistance measurement, consistent with its specialist focus on semiconductor-wafer and thin-film electrical measurement since 1984.
Exhibits
Napson Corporation designs and manufactures contact and non-contact resistance-measurement instruments and related products for semiconductor-wafer and thin-film R&D and process evaluation. For resistivity and sheet-resistance measurement, the company develops, manufactures, and sells both contact and non-contact methods and states that Napson is the only company in the world that fully develops, manufactures, and sells both approaches. The contact lineup includes WS-8800, a fully automatic wafer sorting system with a wafer-transfer robot using the four-point probe method. RG-2000AL and RG-3000AL are contact-type resistivity and sheet-resistance measurement systems with cassette stations using the four-point probe method, while RT-3000/RS-1300 is a fully automatic four-point-probe measurement system for the flat-panel field. The non-contact lineup includes NC-6800 and NC-2000FLA, both described as fully automatic belt-conveyance wafer sorting systems using the eddy-current method. NC-600MAP is a non-contact eddy-current resistivity and sheet-resistance measurement system with a cassette station, providing a cassette-based non-contact configuration. Cresbox is a contact-type semi-automatic integrated tester and stage for resistivity and sheet-resistance measurement using the four-point probe method, while RT-3000/RG-2000 and RG-3000 are semi-automatic four-point-probe instruments covering a wide resistance range. RG-200PV is a contact-type semi-automatic resistivity and sheet-resistance instrument for solar cells using the four-point probe method, adding photovoltaic measurement to the contact portfolio. NC-80MAP is a non-contact eddy-current semi-automatic instrument for a wide sheet-resistance and resistivity range, while CRN-100 uses a non-contact corona-discharge method for an ultra-high-resistance sheet-resistance range. RT-70V series is a manual four-point-probe resistivity and sheet-resistance instrument, and TCR-600 is a contact four-point-probe resistivity instrument with temperature-control functionality for high-temperature measurement. DUORES supports both four-point-probe and non-destructive eddy-current probes in a handheld sheet-resistance instrument, bringing contact and non-contact probes together in one named product. EC-80 is a simple non-contact eddy-current resistivity and sheet-resistance instrument, and EC-80P (Portable) is a handheld non-destructive eddy-current resistivity and sheet-resistance instrument. PVE-80 is a non-contact sheet-resistance instrument for an ultra-low-resistance range using a pulsed-voltage excitation method, adding another non-contact measurement principle to Napson Corporation's lineup. Beyond resistivity and sheet resistance, the company's related products include a wafer-flatness measurement system, lifetime measurement equipment, a two-probe spreading-resistance instrument, a PN checker, four-point probe heads, and resistivity reference wafers. The broader product scope also includes silicon-wafer thickness measurement, semiconductor thin-film sheet-resistance measurement, flat-panel thin-film sheet-resistance and thickness measurement, and compound-semiconductor sheet-resistance measurement. Across manual, semi-automatic, fully automatic, portable, and inline-oriented formats, Napson Corporation's offering combines multiple contact and non-contact principles with instruments for research, process evaluation, wafer handling, and production measurement.
Capabilities and products
- silicon-wafer resistivity measurement
- silicon-wafer thickness measurement
- semiconductor thin-film sheet-resistance measurement
- flat-panel thin-film sheet-resistance and thickness measurement
- compound-semiconductor sheet-resistance measurement
- PN-type checking
- carrier-lifetime measurement
- four-point probe heads