At a glance
| Booth | I3428 |
| Country | KR |
| Website | nnsys.co.kr |
Company profile
NANOSYS CO., LTD. specializes in developing and manufacturing high-precision test pins and test sockets using proprietary technology for the evolving testing needs of the semiconductor industry. The company combines product development with customization and states that its testing solutions are engineered for reliability and a stable testing environment so customers can pursue accuracy and efficiency in final test operations. Its main semiconductor testing products include test sockets for semiconductor IC packages, test fixtures for camera modules, and test pins, covering package-level test, camera-module test fixtures, and contact components. NANOSYS CO., LTD. describes proprietary technology as a basis for innovative test designs and offers custom-manufactured products that are tailored to specific customer requirements. Beyond semiconductor test pins and sockets, NANOSYS CO., LTD. describes itself as an IT service company operating across PCB electrical testing, LASER precision machining, CAM Editing, Film Plotting, fixture manufacturing, electronic-product development, EMS for SMT and LED, and ESS energy-storage systems. The company states an establishment date of 1998. 05 and identifies its domestic operating network as including its Cheongju headquarters together with factories in Ansan, Daejeon, and Daegu. Its overseas corporate network includes factories in Bac Ninh and Vinh Phuc, Vietnam, giving NANOSYS CO., LTD. both domestic Korean and Vietnamese manufacturing locations in the footprint it describes. The company's listed business fields include PCB Electrical Testing Service, semiconductor-component test socket manufacturing, semiconductor PCB and N/W PCB fixture manufacturing, and ultra-precision CNC and Laser machining services. It also lists electronic-product manufacturing and EMS as a business field and includes renewable-energy construction such as solar power and ESS within its broader operating scope. Across these activities, NANOSYS CO., LTD. connects semiconductor test hardware with PCB test services, fixture production, precision machining, EMS, and energy-related work rather than presenting the company as a single-product test-socket manufacturer.
Exhibits
NANOSYS CO., LTD. develops proprietary test pins and test sockets for more precise and stable testing as demand for high-performance GPU/CPU devices and advanced memory-semiconductor technology increases, and it supplies these products to the global semiconductor market. Its test sockets are produced through in-house socket design, machining, assembly, and other process steps, which the company links with high-quality test-socket production. The V-Pin integrates silicone with a Pogo Pin to minimize unstable resistance values, and the company also states that it minimizes Solder Ball Damage to establish a stable testing environment. Its Pogo Pin offering can be configured in different ways for customer product families, providing a configurable contact-pin option within the semiconductor materials and components business. For laser processing, NANOSYS CO., LTD. uses Program Data to perform optimized Laser outline and hole machining that converts a product Working Panel into the final product size and shape requested by the customer. The LASER business lists LASER CUTTING and film-plotting equipment, including calibr8tor 2000&2500, RG-8500, RP750+SXT, and RP825+SXT for Film output, together with Laser Cutting equipment for FPCB and subsidiary-material cutting. The same equipment list includes an automatic cutting machine for subsidiary materials and an optical digital microscope for measuring machining tolerances, adding inspection support to the laser and plotting workflow. The semiconductor materials and components division states that it develops and manufactures test pins with proprietary technology and uses them to provide creative and diverse testing options in the existing test-socket field. Its test pins and sockets can be custom manufactured to customer needs, and the company states that it will continue new-product development and innovation in step with advances in semiconductor technology. The 3930 FBGA test socket has a 1.00 mm pitch, 3,930 pins, FBGA package type, 4.35 mm pin height, 0.20 mm top stroke, 0.15 mm bottom stroke, Cres below 100 mΩ, force below 30 gf, 3.15 A current rating, 36.0 GHz bandwidth at -1 dB, and -50 to 150 ℃ operating temperature. For the 3930 FBGA configuration, the socket is a Floating guide Type using Ceramic Peek / Meldin socket material and a Rotary lid, providing a detailed example of the company's socket construction options. The 529 TFBGA test socket has a 0.80 mm pitch, 529 pins, FBGA package type, 0.90 mm pin height, 0.20 mm top stroke, 0.05 mm bottom stroke, Cres below 30 mΩ, force below 40 gf, 3 A current rating, 36.0 GHz bandwidth at -1 dB, and -50 to 150 ℃ operating temperature. The 225 BGA test socket uses a 0.80 mm pitch and 225 pins with a 5.50 mm pin height, Cres below 100 mΩ, 3 A current rating, 22.1 GHz bandwidth at -1 dB, a Floating guide Type structure, Torlon socket material, and Rotary / Clamshell lid options. The 39L WLCSP configuration is listed with a 0.35 mm pitch, 156 pins, WLCSP package type, 4.98 mm pin height, Cres below 150 mΩ, force below 20 gf, 1.0 A current rating, 18.6 GHz bandwidth at -1 dB, and -50 to 150 ℃ operating temperature. Other listed socket families include 48 QFN with a 0.40 mm pitch and 57 pins, 100 LQFP with a 0.50 mm pitch and 100 pins, 6 SOT with a 1.00 mm pitch and 6 pins, and PLCC Image Sensor with a 1.00 mm pitch and 141/300 pins. NANOSYS CO., LTD. states that its V-Pin production can support both small and large quantities and is strong in High ball count BGA and high-frequency product testing. The V-Pin product is described as having a simple manufacturing process and price competitiveness, while a Hybrid type based on proprietary technology is positioned for test stability and product operation. The V-Pin uses a Pogo Plunger for long product life and supports various tips; silicone is used at the bottom for price competitiveness, while a metal pin at the top allows use on production lines in the same manner as an existing Pogo pin. For Pogo Pins, NANOSYS CO., LTD. uses high-precision machining technology and accumulated know-how to supply varied specifications and considers Tip shape, Stroke, Force, test target, and usage environment when providing optimized solutions and technical support. The Pogo Pin design emphasizes reliable contact performance, durability in repeated-test environments, and customized solutions, with top and bottom plungers made from BeCu, SK-4 or Pd Alloy, a Phosphor Bronze barrel, and a spring made from SWP, SUS, or BeCu with the listed Au or PdCo plating combinations. The listed equipment makers include Ucamco of Belgium, SCREEN of Japan, EIE of Switzerland, Inatech of Korea, CuTex of Korea, and Hyyision of Korea across film-output, laser-cutting, automatic-cutting, and optical-digital-microscope equipment. The 529 TFBGA configuration uses a Non Floating guide Type, Ultem / Pi socket material, and a Rotary lid in addition to its listed electrical and mechanical specifications. The 225 BGA configuration also lists a 0.35 mm top stroke, 0.15 mm bottom stroke, force below 40 gf, and an operating temperature of -50 to 150 ℃. The 39L WLCSP configuration further uses a 0.15 mm top stroke, 0.15 mm bottom stroke, a Non Floating guide Type structure, and Torlon socket material. The 48 QFN configuration has a QFN package type, 5.45 mm pin height, 0.30 mm top stroke, 0.15 mm bottom stroke, Cres below 100 mΩ, force below 40 gf, 1.5 A current rating, 17.8 GHz bandwidth at -1 dB, -50 to 150 ℃ operating temperature, a Floating guide Type structure, Torlon material, and a Clamshell lid. The 100 LQFP configuration has a 3.70 mm pin height, 0.20 mm top stroke, 0.15 mm bottom stroke, Cres below 100 mΩ, force below 40 gf, 1.5 A current rating, 20.1 GHz bandwidth at -1 dB, -50 to 150 ℃ operating temperature, a Floating guide Type structure, Torlon material, and a Rotary Lid. The 6 SOT configuration has a SOT package type, 5.45 mm pin height, 0.30 mm top stroke, 0.15 mm bottom stroke, Cres below 100 mΩ, force below 40 gf, 1.5 A current rating, 17.8 GHz bandwidth at -1 dB, -50 to 150 ℃ operating temperature, a Floating guide Type structure, and Torlon material. The PLCC Image Sensor configuration uses an LGA package type with a 4.45 mm pin height, 0.20 mm top stroke, 0.15 mm bottom stroke, Cres below 100 mΩ, force below 30 gf, 1.5 A current rating, 17.8 GHz bandwidth at -1 dB, -50 to 150 ℃ operating temperature, a Floating guide Type structure, Torlon material, and a Clamshell lid.
Capabilities and products
- custom manufacturing of semiconductor IC test sockets
- custom Pogo Pin test probe supply
- test probes integrating silicone and Pogo Pin
- camera module test fixtures
- semiconductor and network PCB test fixture manufacturing
- PCB electrical testing services
- laser profiling and hole machining
- FPCB laser cutting
- ultra-precision CNC machining
- PCB CAM editing
- high-resolution film plotting
- SMT/LED electronics manufacturing services
- solar photovoltaic system construction
- ESS energy storage system construction