基本資料
| 攤位 | N0376 |
| 國別 | SG |
| 產品分類 | Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Lead Frame Taping Systems · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Molding; Encapsulation; Decapsulation Equipment · Package Handling; Conveying Equipment · Solder Reflow; Soldering & Brazing Equipment · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Equipment, Nanotechnology Tools · Thin Film · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Lead Frames & Headers: Etched; Stamped · Molding; Encapsulation; Potting; Resin Materials · Package Substrates; Laminate; Film based · Packages; Ceramic and Other High Temp Compounds · Packages; Plastic · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Thermal Interface Materials; Heat Sinks · Thin Film; Dielectric Film Materials · Surface protection material; coatings · Materials, Nanotechnology · CMP; Grind; Lap; Polish; Abrasive materials · Deposition/Target Materials · Plasma; Ion Sources · Plating Materials · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · solar cell substrates; crystalline silicon (c-Si); thin film · Substrate Materials · Thin & Thick film substrates for MEMS · Bearings; Shaft Collars · Chucks for Wafer and other Substrates · Static; ESD Control · Deposition Service · Micro Machining services (small hole drilling and milling) · Plating; Electro Polishing; Coating; Surface Treatment · Equipment; Hardware; Product Design, Integration and Manufacturing · Static; ESD Testing & Control Services |
| 網站 | www.nti-nanofilm.com |
公司簡介
NTI Nanofilm 成立於 1999 年，總部位於新加坡，是奈米技術解決方案的全球領導者，專精於先進鍍膜、薄膜設備、奈米製造及氫燃料電池創新。憑藉專有技術，公司在電子、汽車、醫療及工業應用等各產業中提升產品的性能、耐久性與永續性。NTI Nanofilm 擁有強大的國際布局，於新加坡、越南、中國、日本、印度及德國設有辦事處與廠房，以尖端的材料科學與精密工程解決方案服務全球客戶。NTI Nanofilm 自 2020 年起於新加坡交易所掛牌上市，致力於推動高性能鍍膜與先進材料領域的創新與永續發展。
能力與產品項目
- Die Bonding 與貼附設備
- Die Sorter、Pick & Place 與 Flip Chip Placement Systems
- 先進鍍膜
- 切割、鋸切、劃線與分離設備
- 奈米製造
- 薄膜設備
- 高性能鍍膜與先進材料