At a glance
| Booth | L0300 |
| Country | TW |
| Website | www.nemstek.com.tw |
Company profile
Nano Electronics and Micro System Technologies, Inc. (NEMS Tech.) mainly provides plasma technologies and advanced technical services, with a research group supporting the development of these technologies and services. Since 1999, NEMS Tech. has developed advanced electrodes based on Inductively Coupling Plasma (ICP) technology, making ICP-based electrode development part of its stated technical history. The company has also developed patents based on Inductively Coupling Plasma (ICP) technology and has successively produced different kinds of plasma equipment as its technology portfolio has evolved. Its production activities further include coating techniques, so its stated capabilities span ICP-based electrodes and patents, plasma equipment, coating technology, and advanced technical services rather than a single plasma product category. NEMS Tech. applies its products and technologies in PCB and Packaging fields, linking its plasma work to electronics manufacturing and packaging applications described by the company. The same product and technology base is also applied in Semiconductor, Optoelectronics, and 3C electronics fields, extending the company's stated application coverage across several electronics sectors. Beyond those named electronics fields, the company states that its products and technologies are also applied in other industries and in the bio-medical industry, giving its plasma and coating activities a broader application range. NEMS Tech. also describes itself as a global leading plasma-technology expert with multiple core patents and states that developing various advanced plasma technologies is a central purpose of its technical work.
Exhibits
Built on its core plasma technology, NEMS Tech. works with leading companies in advanced industries and with research institutions through long-term partnerships focused on technical cooperation. Its cooperation model includes joint R&D, process validation, customized project development, and process-as-a-service, giving customers several ways to work with the company on plasma-related process needs. The company states that these cooperation modes are used to help customers address process bottlenecks and to create solutions for next-generation technologies together with its partners. Over the years, NEMS Tech. has worked with multiple international first-tier manufacturers and with leading PCB and IC-substrate companies in Japan, Europe, and the United States, adding a specific record of cooperation to its broader partnership model. Its stated implementation record includes ABF modification, which is one of the plasma-related process technologies that the company says it has successfully introduced with industry partners. The implementation record also includes Hybrid Bonding pretreatment, placing plasma pretreatment in an advanced-bonding context identified by the company. NEMS Tech. further lists a roll-to-roll plasma platform among its implemented technologies, adding a continuous-format plasma platform to the applications it describes. Another listed implementation is plasma poling for fingerprint-recognition chips, showing an application of its plasma technology to a specifically identified chip-related process. The company says it has accumulated extensive international certification experience through these activities, alongside the technical implementations and customer collaborations it describes. Its stated future focus includes advanced packaging, third-generation semiconductors, new energy, and ESG green processes, with plans to deepen upstream and downstream cooperation and build cross-domain technology alliances. NEMS Tech. presents those alliances as a way to accelerate the implementation of innovative applications and strengthen global supply-chain resilience while continuing to develop advanced plasma technologies.
Capabilities and products
- ICP plasma electrode development
- plasma equipment manufacturing
- plasma coating technology
- ABF plasma modification
- plasma pretreatment for Hybrid Bonding
- roll-to-roll plasma platform
- plasma poling for fingerprint-recognition chips