At a glance
| Booth | J2940 |
| Country | JP |
| Website | www.namics.co.jp |
Company profile
Namics Corporation is a global company that develops electronic-component materials supporting advanced electronics technologies. Its Small but Global management guideline emphasizes developing technologies distinctive to Namics and operating internationally in the electronics field rather than pursuing scale alone. The company describes three turning points in its history, each based on decisions of selection and concentration made alongside changes in society and industry as it developed into a technology-development-oriented enterprise. Namics materials are used in electronic components such as boards and semiconductors found in televisions, PCs, smartphones, cameras, LED lighting, solar cells and automobiles. The company has sales locations in the United States, Europe, Singapore, Korea, China and Taiwan, production locations in China and Taiwan, and a development location in the United States; in 2017, overseas sales exceeded 80% of total sales. Its SEEDS development concept addresses five electronics growth fields: Semiconductor, Environment, Energy, Device and System, with advanced materials developed for those fields. Namics continues to refine the material technologies accumulated since its founding and uses them to develop products intended to lead future change and create new technical value. The company also applies manufacturing technologies to agriculture as a new activity intended to contribute to its region and the future. To support a more workable employment environment, Namics operates the えびがせ保育園アミック workplace nursery, which opened in 2016 and is available to both employees and local residents.
Exhibits
Namics combines core material technologies for insulation and conductivity with process technologies for formulation and dispersion, and applies simulation technologies for material and structural analysis across the five SEEDS growth fields. Based on material, process and evaluation technologies, the company develops conductive materials, insulating materials and film materials for customers in electronic components, semiconductors, devices, energy and environmental fields. For semiconductor packages, the portfolio includes encapsulating materials and electromagnetic-wave shielding materials, with product categories such as High Thermal-conductivity Underfills, Corner / Edge Bonding Pastes, Chip-on-Film Underfills, Flip Chip Underfills, Dam-and-Fill Encapsulants and CSP/BGA Board Level Underfills. CHIPCOAT is a high-purity insulating material used to seal semiconductor ICs, and the broader product listings also include Camera Module Adhesives and Low-temperature Curing Adhesives for optical modules. Flip Chip Underfill is an insulating material for mounting technologies with direct electrical connections; it flows by capillary action into the gap between a conductive-bump IC chip circuit and the mounting board. Namics offers a broad flip-chip underfill lineup for applications including CPU, LSI and Graphic Devices, and custom-formulated materials are available for user-specific applications. U8443-14 is described as low viscosity for tight spaces, with viscosity 10 Pa･s, Tg 135℃, modulus of elasticity 6.5 GPa and C.T.E at or below Tg of 42 ppm. U8410-73C is for Low-K, Pb-free bumps and tight spaces, with viscosity 50 Pa･s, Tg 88℃, modulus 11.5 GPa and C.T.E 31 ppm; U8410-73CF3 adds Cu-pillar support with viscosity 33 Pa･s, Tg 88℃, modulus 8.8 GPa and C.T.E 31 ppm. U8410-99 is for Low-K and Pb-free bumps, with viscosity 50 Pa･s, Tg 100℃ and C.T.E 29 ppm. U8410-302 is for Low-K, Cu-pillar and Pb-free bumps, with viscosity 55 Pa･s, Tg 95℃, modulus 12 GPa and C.T.E 22 ppm. U8410-377 is a low-viscosity product for tight spaces, with viscosity 15 Pa･s, Tg 128℃, modulus 8.6 GPa and C.T.E 30 ppm. U8439-1 is for Low-K and large ICs, with viscosity 60 Pa･s, Tg 70℃, modulus 8 GPa and C.T.E 36 ppm; U8439-105 adds tight-space use with viscosity 55 Pa･s, Tg 70℃, modulus 8.5 GPa and C.T.E 34 ppm. Related flip-chip package materials include High Thermal-conductivity Underfills, Corner / Edge Bonding Pastes, Chip-on-Film Underfills, Dam-and-Fill Encapsulants and CSP/BGA Board Level Underfills.
Capabilities and products
- semiconductor-package encapsulating materials
- electromagnetic-wave shielding materials for semiconductor packages
- high-thermal-conductivity underfills
- corner/edge bonding pastes
- Chip-on-Film underfills
- flip-chip underfills
- CSP/BGA board-level underfills
- Dam-and-Fill encapsulants
- camera-module adhesives
- low-temperature curing adhesives