At a glance
| Booth | T9309 |
| Country | JP |
| Website | www.nakajima-chem.com |
Company profile
Nakajima Chemicals Co.,Ltd. is a Japanese company with a history of more than 130 years and operates businesses that include electronic materials, micro materials and chemical products. Its company profile records the founding date as March 15, Meiji 25, the corporate establishment date as April 18, Showa 22, and capital of 20 million yen. The company operates a head office and chemical-products and specialty-products functions in Nagoya, sales offices in Tokyo, Osaka and Nagano, a healthcare factory in Nagoya, and an electronic-materials and micro-materials factory in Nagano. The company history records its start as Nakajima Yokichi Shoten in Handa, Aichi, followed by incorporation and a move into its current Nagoya base in Showa 22. Its history also records the opening of the Tokyo sales office in Showa 39, the Osaka sales office in Showa 44, and the change to the current company name in Showa 48. Capital was recorded at 195,000 yen when the business was reorganized as a corporation in Showa 22, followed by increases to 1 million yen in Showa 24, 5 million yen in Showa 30, 10 million yen in Showa 41 and 20 million yen in Showa 52. Later milestones include the opening of the Nagasuka factory in Heisei 6, the Nagano sales office in Heisei 19 and the Nagano factory in Heisei 20. Within the Electronic Materials and Micro Materials Division, Nakajima Chemicals Co.,Ltd. sells various resin-board materials and provides processing for semiconductor-related products using high-accuracy thickness-processing equipment. The trading lineup includes thermosetting resin laminated boards, insulating boards, round bars, pipes and thermoplastic resin plates such as acrylic, POM, PEEK and MC nylon. The processing organization performs plastic forming and high-precision thickness processing with a thickness dimensional tolerance of ±0.01 mm. Nakajima combines its information network with collaboration among specialized trading-company functions and processing operations to provide integrated proposals from material sourcing through processing. The company also produces exclusive products including special boards for inspection jigs and high-precision processed products with a thickness dimensional tolerance of ±0.01 mm. Its chemical-products division focuses on new energy, biotechnology and environmental-measures fields while working to provide customers with timely and useful information and to improve customer satisfaction as a specialized trading company.
Exhibits
The inorganic-chemical portfolio includes soda products such as caustic soda, soda ash, liquid chlorine and hydrochloric acid, together with secondary soda products including sodium bicarbonate, calcium chloride, sodium chlorate, sodium hypochlorite, sodium sulfide, sodium sulfate, sodium sulfite, sodium silicate, sodium cyanide and bleaching powder. It also includes ammonia-system products such as ammonia, urea, thiourea and nitric acid, plus inorganic chemicals such as hydrogen peroxide, sulfuric acid, hydrofluoric acid and phosphoric acid. Additional inorganic-chemical groups cover compounds of aluminum, zinc, sulfur, potassium, silver, silicon, bromine, carbon, titanium, iron, copper, nickel, barium, fluorine, boric acid, magnesium, manganese and phosphorus, as well as lime, diatomaceous earth and zeolite. Ceramic raw materials include magnesium oxide, zirconia, alumina, silicon nitride and silicon carbide. In electronic materials, the company sells resin-board materials and processes them with high-precision thickness-processing machines, NC processing machines and panel saws. The processing work includes cutting backing boards for printed-circuit-board drilling, external-profile machining and high-precision thickness processing to a thickness dimensional tolerance of ±0.01 mm. Nakajima is the distributor for Futamura Chemical paper phenolic laminate, commonly called Bakelite, and also acts as an agent for Sumitomo Bakelite and Ryoden Kasei while combining trading and processing capabilities from material sourcing through fabrication. The product lineup includes high-precision thickness-processed products, phenolic resin laminated boards, epoxy resin laminated boards and other resin products. For thermosetting and thermoplastic resin boards, the company states that it can perform high-precision thickness processing at ±0.01 mm, compared with a conventional processing limit of ±0.03 mm. Plastic processing services include cutting and machining of thermosetting plastics, thermoplastic plastic sheets and other plastics, together with fine precision machining and cutting. Phenolic resin laminated boards are used as insulating and structural materials for electronic components and electrical machinery, while epoxy resin laminated boards use glass cloth and are described with insulation, high-frequency, mechanical, heat-resistance, moisture-resistance, dimensional-stability and chemical-resistance properties, including strong alkali resistance. Polyester glass-mat laminated boards are described with insulation, mechanical strength, dimensional stability, chemical resistance and moisture resistance, and thinner material can be punched. Acrylic resin sheets are described as thermoplastic, electrically insulating, chemically and weather resistant, lightweight, tough, easy to process and with light transmittance greater than glass; polycarbonate resin sheets are described with heat and cold resistance across a wide temperature range, low weight, impact resistance and transparency. The lineup also includes drilling laminates for printed-circuit-board entry and backup boards, asbestos-free heat-insulating boards, engineering plastics, super engineering plastics, and round bars and pipes made from paper- or cloth-base phenolic resin and glass-base epoxy resin for insulating and structural applications. For printed-circuit-board drilling, the laminate lineup includes hard backing-board types for larger holes and more flexible types for very small holes. The asbestos-free heat-insulating boards are described with thermal insulation, mechanical strength, dimensional stability, safety, electrical insulation and machinability, while engineering plastics emphasize strength, impact resistance and heat resistance and super engineering plastics add higher heat resistance, strength and dimensional stability. Round bars and pipes are formed from paper- or cloth-base phenolic resin and glass-base epoxy resin and are used as insulating and structural materials for electrical machinery and related applications. For dedicated high-precision thickness processing, Nakajima developed resin-board cutting equipment that reaches ±0.01 mm, beyond the ±0.02 to ±0.03 mm limit stated for general milling machines, NC routers and machining centers. The processed surface is described as free from cutter marks and color unevenness and sufficiently smooth that two processed surfaces can adhere when placed together. The supported thickness range is 0.1mmt to 50mmt, the maximum size is 1030mm×1300mm, and dimensional tolerance can be adjusted to customer requirements down to ±0.01mm. Applications listed for the high-precision processed boards include IC-package electrical-test jigs, checker boards, mother-glass jigs, glass-polishing auxiliary materials, carrier pallets, solder-flow and reflow pallets, sub-tables for printed-circuit-board drilling and routing, parts for medical machines and chemical-analysis equipment, heat-insulating boards for precision injection-molding machines and molds, and resin boards for precision micro-machining.
Capabilities and products
- resin-board high-precision thickness processing to ±0.01 mm
- PCB drilling backing-board cutting and profile machining
- paper phenolic laminate sales
- phenolic and epoxy resin laminate supply
- fine precision plastic machining
- ceramic raw-material supply (MgO/ZrO2/Al2O3/Si3N4/SiC)