At a glance
| Booth | S7552 |
| Country | TW |
| Website | mol-solutions.com |
Company profile
MOL Solutions Inc. specializes in optical and laser inspection and measurement technologies for in-line mass production. Its research centers are located in Germany and Japan, with Nurnberg research focused on close-view optical inspection for high-speed image capture and analysis of micro objects and Japanese research focused on advanced laser measurement. The Nurnberg work targets micro-object imaging and analysis that conventional high-speed cameras are described as unable to achieve. MOL Solutions Inc. collaborates with top Japanese universities on high-speed laser measurement technologies for 3D inspection and surface-dimension measurement. Those measurement applications include wafer thickness, post-dicing wafer defects, ABF substrate via-hole defects, complete wafer-surface warpage and roughness, and micro-drilling hole inspection. The company also works in laser bionics engineering, using laser-based biomimicry to create or modify surface micro-geometry and thereby change material properties. The listed property targets include conductivity, bonding, heat transfer, wettability, anti-reflective surfaces, anti-fingerprint coatings, and biocompatibility. Droptical GmbH is a MOL Solutions group company based in Nuremberg that combines precise droplet generation with real-time optical monitoring in compact intelligent dispensing systems for high-precision applications. Droptical specializes in micro-jet dispensers and nano-cam technology designed for plug-and-play integration in both R&D and mass production, with multiple patents and applications across healthcare, electronics, and chemical manufacturing.
Exhibits
ClickJet is a miniature non-contact microdispensing system for picoliter and nanoliter liquid volumes, using drop-on-demand jetting in ClickJet-Pico and ClickJet-Nano models. ClickTube integrates the nozzle and liquid cartridge into a quick-change module so the fluid path can be replaced rapidly, reducing flushing, cleaning, material residue, and cross-contamination risk; the module can be reused or treated as disposable depending on the application. The plug-and-play ClickController uses analog-voltage adjustment for basic dispensing control without software installation or complex configuration and is housed in a compact aluminum-alloy enclosure. ClickJet supports multiple dispensing heads at a 12 mm pitch, and two units can be mounted at an angle to place droplets on adjacent positions or the same target location. The compact size and low power consumption of ClickJet and its controller also allow integration into battery-powered portable equipment for handheld microdispensing applications. When droplet observation is required, an optical dropwatcher such as NanoStrobeX can be integrated as an option; optical metrology is not a built-in ClickJet function and depends on the selected system configuration. ClickJet-Pico is specified for 20 pL to 200 pL droplets, a 0.05 mL cartridge, up to 250 Hz dispensing frequency, and 12 g weight, while ClickJet-Nano is specified for 0.5 nL to 10 nL droplets, a 0.5 mL cartridge, up to 200 Hz, and 14 g. ClickTube is available with multiple nozzle-orifice diameters, a Tube Rack stores up to five ClickTube modules, and a Luer Adapter supports manual or automated cartridge filling plus blowout after use. Semiconductor and advanced-packaging applications include functional-liquid filling for micro-sensors and MEMS, localized micro-spotting for Micro-LEDs, optoelectronic components and microchips, and reagent functionalization for bio-semiconductor sensor chips. Additional applications include wafer-level marking or protective and chemical-reagent coating, quantitative filling of microfluidic channels, microwells and small cavities, and precision jetting of low-viscosity conductive, optical and encapsulation functional fluids. Multi-material parallel dispensing and small-pitch multi-nozzle modules are supported, and the 12 to 14 g jetting heads can be configured at about 12 mm pitch for high-speed XY stages, wafer-processing equipment, or multi-nozzle automation modules. NanoStrobeX uses high-speed stroboscopic imaging for real-time droplet measurement, covering volume, diameter, flight velocity, trajectory, positional deviation, formation stability, and satellite droplets. UltiStrobe adds optical droplet observation and 3D analysis with predicted landing-position assessment, a browser-based Web GUI, and flexible camera and strobe-backlight configurations for laboratory and production dispensing systems. NeoScale performs non-contact optical measurement during droplet ejection and replaces collection, weighing and calculation with imaging, detection, analysis and evaluation for faster dispensing qualification and digital output. MOL high-speed precision laser micromachining uses controlled laser-material interaction with beam shaping, high-speed galvanometer scanning, and precision motion control to place laser energy in the target processing region. Pulse duration, fluence, repetition rate, focal position, energy distribution, and scan trajectory are tuned to increase throughput while retaining dimensional accuracy, process consistency, and microscale feature quality. Synchronized laser-pulse control, machine-vision alignment, and process metrology support microdrilling, precision cutting, selective material removal, and surface microstructuring while reducing heat-affected zones, microcracking, debris, and recast layers. Applicable materials include glass, silicon carbide, ceramics, metals, polyimide, Ajinomoto Build-up Film, and other polymers for advanced packaging, microelectronics, precision components, process development, and high-volume manufacturing. The laser platform integrates laser sources, optical design, beam shaping, precision motion platforms, galvo/scanners, encoders, vision systems, and high-speed synchronized control software across process development, measurement validation, and mass-production equipment integration. MOL reports about 1 μm repeatable positioning accuracy and 1 to 1.5 G acceleration for its high-speed manufacturing platform to reduce move-and-settle time between processing points. For TGV processing, temporal pulse shaping forms initial through-holes in a single pulse at design speeds up to about 20,000 vias per second, followed by uniform chemical etching for throughput, vertical profiles, and thick-glass quality. LSTR laser-interference technology is described for large-area periodic micro- and nano-structure fabrication at speeds up to about 3 m² per minute. Custom beam shaping uses DOEs, Bessel beams, Top-hat beams, Axicons, multi-beam optics, and specialized focusing systems to control spot size, energy uniformity, depth of focus, and interaction zones. Top-hat beams improve energy uniformity, Bessel beams and extended-depth-of-focus optics support thick glass, TGV and high-aspect-ratio structures, and multi-beam or interference methods create multiple sites or periodic structures in parallel. Galvo/scanners, motion stages, encoders, vision systems, and laser-pulse timing are synchronized, while autofocus, beam alignment, and in-line metrology compensate for stage error, material-height variation, and thermal drift during continuous operation. Machine functions include surface modification, microvia drilling, biomimetic surface functionality, high-speed through-hole processing, short inline cycle times, and process optimization with real-time learning and correction. The X and Y motion-stage specifications list 620 mm and 700 mm travel, 1.5 m/s maximum velocity, 1 G maximum acceleration, ±0.5 μm repeatability, ±1 μm accuracy, ±1.5 μm flatness, ±100 nm position stability, and following error no more than 1 μm at 15 mm/s. The Z axis lists 620 mm travel, ±0.5 μm repeatability, ±1.0 μm accuracy, and ±1.5 μm straightness, while the R axis lists 620° travel, 1.5 RPM maximum rotational speed, ±0.5 arc-sec repeatability, and ±1.0 arc-sec accuracy. Process-quality controls cover laser-ablation thresholds, heat-affected zones, micro-cracks, debris and recast layers, hole-wall taper, sidewall roughness, precision depth, selective material removal, and consistent micro- or nano-structure geometry. APEIT, the Advanced Packaging Electrical Integrity Tester, is a modular multi-channel platform for production requirements in CPO, CoPoS, AI/HPC, silicon photonics, glass-core substrates, TGV, ABF, and FOPLP applications. The platform extends reference-grade electrical measurements into scalable automated parallel testing across high-speed signal paths, power-delivery paths, device functionality, and panel-level interconnects. APEIT combines shared control software, a LAN/FPGA control architecture, and a dedicated test bus with measurement modules, I/O test heads, probes, fixtures, and automated handling equipment for measurement, defect classification, and data traceability. Test configurations are selected according to DUT, package type, signal paths, current and voltage ranges, panel dimensions, and throughput requirements, allowing use from reference measurements through multichannel parallel testing. Shared control software manages test conditions, sequences, modules, pass/fail criteria, and results; LAN/FPGA coordinates timing and parallel measurements; the dedicated bus connects TDR, DC-UP500, and functional modules, with BERT listed on the development roadmap. Reusable I/O test-head resources can be configured for different DUTs, while probing, fixturing, and automated loading or unloading can be arranged for wafers, substrates, panels, devices, and modules. Waveform and electrical results can be converted into defect classifications, process comparisons, and SPC information for quality traceability. For high-speed paths, multichannel TDR analyzes impedance, electrical length, and reflection locations to identify opens, shorts, and signal-path anomalies. For power-delivery paths, APEIT measures current, voltage, resistance, I-V characteristics, and leakage while evaluating contact condition and power-rail integrity. Functional testing can combine optical-power measurement, temperature control, power supplies, and I²C/SPI interfaces for optoelectronic devices and modules. Panel-level testing screens RDL, vias, bumps, and full-panel interconnects before singulation and assembly to identify interconnect defects. A standard DC measurement configuration is listed at 16 channels and 512 mA with maximum voltage of 12 V, while final TDR development targets are 8 channels, 40 ps transition time, and 2 ps delay resolution. A FOPLP panel-level development architecture lists 3,072 pins and a 30 MHz target frequency; these development targets are distinguished from production-released capabilities and require confirmation for the selected module and DUT conditions. The wider development platform is described with up to 3,072 I/O pins and up to 384 DUTs concurrently subject to pin allocation, with PE, PG, DPS, and DFM test boards selectable by application and interchangeable probe interfaces for different probe cards and package dimensions. Target uses include panel-level interconnect and RDL continuity testing, known-good-unit screening before singulation, high-pin-count AI, HPC, chiplet and large-SoC devices, and high-mix or new-product production environments. The development configuration lists 48 Ultimate-LSI devices, up to 384 sites with at least 16 pins per site requiring configuration confirmation, test rate up to 30 MHz, pattern memory up to 64 MW, and a timing generator with 80 edges per site in 625 ps increments. Waveform formats include NRZ, RZ, FIX-L/H, and EX-OR; driver and comparator ranges are -1 V to 7 V in 610 μV increments, with 256 W fail memory, one DC-measurement channel per site for VSIM, ISVM, or VM, adjustable 50 Ω ±10 Ω output impedance, and ±5 ns timing accuracy. TDR development stages show transition time progressing from 180 ps to a 40 ps final target and delay resolution from 10 ps to 2 ps, with the final target providing 8 channels and single-ended or differential signal configurations in later stages. The DC measurement modules support synchronized multichannel current, voltage, resistance, and I-V characterization and can combine with optical-power measurement for L-I-V testing or integrate with probe cards, handlers, and MES. The standard configuration lists IS/VM at ±512 mA with +12 V and VS/IM at +12 V with +512 mA; a high-current option under development lists IS/VM at +2 A with +8 V and VS/IM at +8 V with +2 A. The module dimensions are W15 × H133 × D256 mm in a 3U size; standard current ranges include 512 mA, 25.6 mA, 2.56 mA, 256 μA, 25.6 μA, and 2.56 μA, with current accuracy of 0.10% + 0.05% of Imax and voltage accuracy of 0.05% + 3 mV. Advanced-packaging applications include CPO, CoPoS and silicon photonics for high-speed signals and optoelectronic functions; AI/HPC packaging for interconnects, power rails, micro-bumps and high-current paths; and glass-core, TGV and ABF structures for conduction, impedance, electrical length, via-fill quality and micro-crack analysis. FOPLP, RDL and panel-interconnect applications include full-panel conduction, via, bump and Known Good Die area screening before dicing, while VCSEL and laser-diode testing can combine multichannel I-V, leakage, contact and L-I-V measurements with optical-power sensors. Probe cards, connectors, and cables can be inspected for impedance, electrical length, open and short circuits, and high-speed interconnect quality, and APEIT can integrate with probe cards, handlers, automated handling, and MES/SPC workflows. Optical structural inspection applications include PIC and optical-waveguide checks for micro-cracks, localized damage, contamination and discontinuities, plus Fiber Array coupling measurements of height, gap, tilt and position offset with checks for bubbles, delamination and micro-cracks. Glass Bridge and TGV inspection covers sidewalls, internal glass cracks, voids and metal-filling anomalies; hybrid-bonding inspection checks incomplete bonding, interface voids, localized warpage, contamination and cracks; post-reflow inspection covers package warpage, interlayer delamination, solder-height variation, underfill voids and thermal-stress micro-cracks. By cross-referencing iLORA optical structural inspection with APEIT multichannel TDR and electrical testing, the platform is presented as a unified optical, structural, and electrical quality-inspection approach for advanced packaging.
Capabilities and products
- optical and laser inspection for mass production
- high-speed close-view optical inspection for micro objects
- laser measurement for wafer 3D inspection and surface dimensions
- laser biomimetic surface microstructure modification
- pL/nL non-contact microdispensing
- real-time optical droplet measurement and monitoring
- high-speed precision laser microdrilling and cutting
- TGV laser through-hole processing
- multichannel electrical integrity testing for advanced packaging
- multichannel TDR impedance analysis
- panel-level RDL/via/bump interconnect screening
- non-contact optical measurement during droplet ejection
- predicted droplet landing-position assessment
- custom optical design, beam shaping and beam control
- current, voltage, resistance, I-V and leakage measurement
- functional testing of optoelectronic devices and modules
- PIC/optical-waveguide inspection
- Hybrid Bonding interface inspection
- post-reflow inspection