At a glance
| Booth | S7552 |
| Country | TW |
| Website | mol-solutions.com |
Company profile
MOL Solutions: Advanced Optical and Laser Measurement Solutions MOL Solutions is a company specialized in innovative optical and laser inspection and measurement technologies for in-line mass production. MOL Solutions research centers are located in Germany and Japan. In Nurnberg Germany, MOL Solutions engages in the research and development of close-view optical inspection for high-speed image capturing and analysis for micro objects, which cannot be achieved by conventional high-speed cameras. MOL Solutions also collaborates with top Japanese universities on the research and development of advanced high-speed laser measurement technologies focused on 3D inspection and surface dimension measurement such as wafer thickness, post-dicing wafer defects, ABF substrate via-hole defects, complete wafer surface warpage/roughness, and micro-drilling hole inspections. MOL Solutions is also active in laser bionics engineering—a laser-based biomimicry approach that creates or modifies micro-geometry on surfaces to change material properties. This includes improving conductivity, bonding, heat transfer, wettability, anti-reflective surfaces, anti-fingerprint coatings, biocompatibility, and more. MOL’s bionic laser technology represents a major advancement beyond conventional surface modification. Droptical GmbH, a MOL Solutions group company, is on a mission to revolutionize liquid handling with compact, intelligent dispensing systems. Based in Nuremberg, Germany, Droptical combines precise droplet generation with real-time optical monitoring to ensure perfect dispensing conditions for high-precision applications. Specializing in micro-jet dispensers and nano-cam technology, Droptical’s solutions are designed for easy plug-and-play integration in both R&D and mass production. With multiple patents in the field, their innovations are applied across healthcare, electronics, and chemical manufacturing—empowering efficient, data-driven, and cost-effective workflows.
Capabilities and products
- ABF substrate via-hole defect inspection
- close-view optical inspection for high-speed imaging of micro objects
- complete wafer surface warpage and roughness measurement
- high-speed laser measurement for 3D inspection and surface dimension measurement
- laser bionics surface micro-geometry modification
- micro-jet dispensers with real-time optical monitoring
- nano-cam technology for high-precision dispensing applications
- optical and laser inspection and measurement for in-line mass production
- post-dicing wafer defect inspection
- wafer thickness measurement
Related product topics
- Precision Fluid Dispensing Systems
- Chemical Dispensing Systems
- Optical Inspection and Testing Solutions
- Advanced Packaging Substrate Inspection
- Wafer Surface Defect Inspection
- Wafer Defect Inspection Systems
- TGV and Via 3D Inspection
- Optical Measurement Equipment
- Film Thickness Metrology
- Non-Contact & Non-Destructive Metrology
- Surface, Thickness and Resistance Metrology
- Wafer Thickness and Resistivity Metrology
- Wafer Warpage and Roughness Metrology