At a glance
| Booth | N1086 |
| Country | TW |
| Website | www.mingkun-tech.com |
Company profile
Mingkun Technologies Co., Ltd. was established in 2007, began its business with tape, and has developed mature knowledge and experience in tape manufacturing. The company also makes tapes according to customized process needs, combining its tape-manufacturing experience with customer-specific process requirements. Mingkun Technologies Co., Ltd. has continuously engaged in the R&D and manufacturing of semiconductor tapes since its establishment, with ongoing efforts to improve and advance its technology. In 2018, the company entered the Central Taiwan Science Park and established a laboratory, after which it states that it began devoting 100% of its effort to independent R&D of semiconductor-specific tapes and semiconductor-related materials. The company identifies ASE, AUO and SPIL among its long-term partners in the Taiwan semiconductor industry chain. Its quality and environmental certifications include ISO 9001, ISO 14001 obtained in 2022, and ISO 50001, ISO 14067 and ISO 14064 obtained in 2023. Mingkun Technologies Co., Ltd. states that ESG sustainable development is both a goal and a guideline for action, alongside its stated commitment to environmental protection.
Exhibits
The product portfolio includes UV tapes for dicing and grinding, PI tapes used as mask or carrier tapes for sputter, PVD, spray coating and QFN processes, heat sinks for IC drivers, thermal release tape, Laser Debond materials and DAF film. Its grinding tape is designed to protect wafer-surface circuitry from damage or contamination during backside grinding, and both UV and non-UV grinding-tape types are offered. For grinding applications, the company describes an exclusive cushioning intermediate-layer design for large-diameter solder-ball wafers, intended to provide coverage while reducing surface dents or warpage, and it also emphasizes easy removal after processing with low probability of solder-ball damage and adhesive residue. Named grinding-tape products include UV440, UV595 and UV170, and the same product information also presents customizable tape specifications covering adhesive thickness, base film, extra processing and adhesion strength. Dicing tape is used in the dicing process to hold dies in place and prevent die flying, with both UV and non-UV versions available. The dicing tape is described as having stable adhesion and high extensibility so that chip displacement or die flying does not occur, making it suitable for film-expansion products, while easy release supports die-pickup efficiency. Dicing-tape product information lists PET base film at 50~100 um or PO base film at 80~150 um, adhesive thickness at 8~20 um, and adhesive strength before UV on SUS in the listed ranges. The high-temperature Polyimide Tape uses polyimide film as its base material and is widely applied in semiconductor and other high-temperature industrial processes. This PI tape is described as offering temperature resistance, voltage resistance and solvent resistance, and it can be made to customer requirements as single-sided, double-sided or antistatic tape with customized adhesion and thickness. Its listed PI tape specifications include base-film thickness of 12.5~150 um and adhesive thickness of 8~120 um, with acrylic and silicone adhesive-strength ranges also provided. For high-temperature applications where conventional PI tape may be difficult to release from thin, small or fragile attached objects, Mingkun Technologies Co., Ltd. developed a heat-resistant UV tape for semiconductor and other high-temperature processes. The heat-resistant UV tape is specified for 220~260 degrees and is described as leaving no adhesive residue after high-temperature exposure on wafer, glass and SUS substrates. Its listed appearance is transparent and flat, its thickness without liner is 60 um, and adhesion-strength data are provided for 25 degrees C, 220 degrees C for 30 min and 260 degrees C for 5 min, with the data identified as before UV and after UV. Across the customization tables, the company lists PI Tape, UV Tape and Thermal release tape options with selectable material structures and extra processes such as punch, split and ESD, while the non-tape heterogeneous-integration section lists DAF and Laser Debond material. DAF is listed at 10~120 um and marked under development, while Laser Debond material is listed at 10~50 um / 0.5~1.5 um in film or liquid form.
Capabilities and products
- UV wafer dicing tape
- wafer grinding tape
- semiconductor PI mask/carrier tape
- heat sinks for IC drivers
- thermal release tape
- Laser Debond materials
- DAF film