At a glance
| Booth | S7736 |
| Country | SG |
| Website | mindoxtechno.com |
Company profile
Mindox Techno Pte. Ltd. designs and develops advanced chip-manufacturing equipment and operates as a semiconductor-equipment company supplying next-generation manufacturing equipment. The company serves semiconductor markets that require customized equipment configurations rather than only catalog products, with both standard and custom solution approaches described across its business. Its customer scope includes front-end, back-end and advanced-packaging semiconductor customers for whom it designs, develops, builds and supports advanced products. Mindox Techno Pte. Ltd. organizes its activities around platform solutions, process equipment, advanced materials and automation solutions, linking equipment development with supporting engineering and production services. Supporting services include software, manufacturing subcontracting and legacy-tool conversion, extending the company's role beyond delivery of individual process tools.
Exhibits
The Process Equipment lineup is presented for semiconductor manufacturing through precision, automation and smart integration. Within that lineup, Mindox Techno Pte. Ltd. offers a fully integrated system for thinned wafers on tape frames that automates coating, baking and cleaning in a cleanroom environment. A separate fully automated copper passivation system is intended for high-efficiency semiconductor manufacturing, is SEMI-compliant and is described as hybrid bonding ready. The Newtrox 3C is a fully automated system for both single and batch coating, curing and cleaning, adding a named process-equipment platform to the company's coating and cleaning range. Standard and custom wafer-handling solutions are part of the broader equipment offering, addressing substrate movement requirements alongside the company's process-equipment platforms. The offering also includes metrology and inspection solutions, placing measurement and inspection functions alongside wafer handling and process equipment. Thin-film coating solutions form another product area, consistent with the automated coating functions described for the integrated thinned-wafer system and the Newtrox 3C. Automation solutions are presented as a business area in their own right, while software support provides an additional layer for equipment and platform deployment. Manufacturing subcontracting is offered as a supporting service, complementing the company's equipment design, development and build activities for semiconductor customers. Legacy-tool conversion is also listed among the supporting services, providing an option for semiconductor operations that need work on existing equipment as well as new equipment configurations.
Capabilities and products
- automated coating, baking, and cleaning system for thinned wafers on tape frames
- fully automated copper passivation systems
- automated single-wafer and batch coating, curing, and cleaning systems