At a glance
| Booth | M1355 |
| Country | TW |
| Website | www.microsys-e.com.tw |
Company profile
Microsys Engineering Co., Ltd was established in 1991 and follows the business philosophy of professional, responsible and innovative work with customers in high-technology equipment and solutions. The company has an experienced sales team and a professionally trained after-sales service team and uses advisory sales and service to address customer demand for advanced technology. Its business scope includes high-technology equipment sales, installation, maintenance and repair services, software and hardware upgrade support, parts stock and technical training. Microsys Engineering Co., Ltd represents equipment brands from multiple countries, including AKONEER, DMC, FEMTIKA and Vital3D from Lithuania; Oxford Lasers from the United Kingdom; FEIE, Lüscher, Microqubic, nsm, Powatec and Synova from Switzerland; and LaserAtWork from Austria. Its represented brands also include Ensinger, LPKF, PSG, Raith, voxeljet and ZS-Handling from Germany, miDALIX from Slovenia and ScanCAD from the United States. The company's equipment portfolio covers laser technologies, electronic manufacturing, precision processing, 3D printing, semiconductor and optoelectronic equipment, and inspection and coating technologies. For equipment lifecycle support, Microsys Engineering Co., Ltd provides installation and maintenance intended to keep equipment operating stably, software and hardware upgrades, key spare-parts supply and professional technical training. Its maintenance organization also provides scheduled equipment maintenance and repair services, records repair requests and tracks repair progress through its technical-service process.
Exhibits
Microsys Engineering Co., Ltd supplies laser-related equipment and technologies including Laser plastic welding, Stencil Laser, 3D MID Technology, rapid prototyping, Femtosecond Laser, LTP laser transfer technology, Micro water jet laser, laser plotting equipment, laser glass micro-hole and forming equipment, micron-scale steel-stencil laser cutting and laser three-dimensional circuit processing. Precision-processing and direct-imaging equipment includes Femtosecond Laser processing systems, Micro water jet laser systems, SSAIL-process surface-modification copper femtosecond laser equipment, laser printing stencil, lithographic and steel-plate photo direct-imaging equipment. Electronic-manufacturing and inspection offerings include rapid PCB prototyping equipment, DI high-precision optical-alignment dry-film direct-imaging machines, PCB scanning and testing equipment, solder-paste printing equipment, dispensing equipment, reflow systems, 3D microscopes, and precision printing and coating systems. Semiconductor and optoelectronic equipment includes engineering-plastic wafer and substrate products, laser stencil direct-writing equipment, Wafer Mounter, UV Curing System, Expansion Tool, wafer mounting, debonding and expansion equipment, and non-contact Wafer/Solar cell pick-and-place devices. The broader equipment range also includes Microfluidic chips, interconnect printing on 2D and 3D substrates, glass imaging, 3D printers, industrial-grade precision casting, digital sand mold and FDM 3D printing equipment, industrial inkjet printing equipment, pick-and-place equipment, software for laser-system control, hot embossing machines, biocompatible material and mold-replication solutions. For maintenance after installation, Microsys Engineering Co., Ltd provides scheduled equipment maintenance and repair service, records service requests and follows repair progress so equipment issues can be managed through a defined technical-service workflow. The company's support package also includes software and hardware upgrade support, parts stock and training, complementing equipment sales, installation, maintenance and repair across the supplied high-technology systems. These offerings connect semiconductor and electronics manufacturing users with femtosecond-laser processing, micro water-jet laser equipment, PCB scanning and testing, wafer mounting and expansion, printing, dispensing, reflow, inspection and other process equipment within the same service portfolio.
Capabilities and products
- femtosecond laser equipment supply and technical service
- micro water-jet laser equipment supply and technical service
- PCB scanning and testing equipment supply and technical service
- solder-paste printing equipment supply and technical service
- dispensing equipment supply and technical service
- reflow equipment supply and technical service
- wafer mounting and expansion equipment supply and service
- 3D printing equipment supply and technical service