At a glance
| Booth | M1355 |
| Country | TW |
| Product categories | PV: Modules · PV: Stand-Alone Systems · PV-Building-Integrated Solutions · Dicing; Sawing; Scribing; Separation Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Hot Embossing System · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Printing Equipment; Screen-printing; Alignment ; Film Printing · Solder Reflow; Soldering & Brazing Equipment · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Laser Treatment; Cutting Systems for Panels & Photocells · Cutting; Drilling; Laser ablation; Beveling Equipment · Welding Equipment · Microscopes: Optical Microscopes · Thin Film · Bumping Systems · Crystal Growing & Machining Equipment · Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Printing Masks; Screens · Mask plate blanks; Glass · Manufacturing Execution Software (MES) · Marketing or Sales Consultants · Education, Training |
| Website | www.microsys-e.com.tw |
Company profile
Microsys Engineering Co., Ltd. established in 1991. "Professional, responsible, and innovative" is our business philosophy to work with our customers. We have a top sales team and a professionally trained service team to provide advisory sales and services to meet customers' demand for advanced technology. With the innovation and development of technology and the rise of emerging industries, the investment in the high-tech field has also enabled Microsys to assist many customers in connecting with the world's advanced technology, and has been at the forefront of innovation. Our business scope includes sales, installation, maintenance, repair services, software and hardware upgrade support, parts stock, and training of high-tech equipment. Related fields and equipment: Laser plastic welding, Stencil Laser, 3D MID Technology, rapid prototyping, Femtosecond Laser, LTP laser transfer technology, Micro water jet laser, Microfluidic chips, printing of interconnects on both 2D and 3D substrates, glass imaging, 3D printer, industrial-grade precision casting, digital sand mold, and FDM 3D printing equipment., industrial inkjet printing equipment, PCB scanning and testing equipment, solder paste printing equipment, dispensing equipment, Wafer Mounter, UV Curing System, and Expansion Tool, pick and place equipment, reflow, Software for Laser system control,Hot embossing machine, biocompatible material, mold replication solution
Capabilities and products
- 3D MID Technology equipment
- Femtosecond Laser systems
- LTP laser transfer technology
- Micro water jet laser equipment
- PCB scanning and testing equipment
- Stencil Laser equipment
- Wafer Mounter, UV Curing System and Expansion Tool
- industrial inkjet printing equipment
- laser plastic welding equipment
- solder paste printing and dispensing equipment