At a glance
| Booth | L0116 |
| Country | US |
| Website | www.microcontrol.com |
Company profile
Micro Control Company was founded in 1972 as a manufacturer of test equipment for the electronics industry, and the company created its first microprocessor-controlled test system in 1973. The company now ships high-power burn-in and test systems to customers throughout the world and designs and builds burn-in boards and other burn-in accessories for reliability and production burn-in applications. Micro Control Company states that every system and burn-in board is made from high-quality components and rigorously tested prior to shipment, while its customer service extends from the first sales inquiry through post-installation support. Its engineering team develops customer-specific burn-in solutions for semiconductor test and burn-in with test requirements, using design, application knowledge and system experience to address individual requirements. The company's history records multiple industry-first developments, beginning with the 1973 microprocessor-controlled test system, followed by programmable clock edges in 1974, an algorithmic-pattern memory burn-in test system in 1976, and a system for alpha-particle sensitivity testing in 1977. Later milestones include a 10-MHz memory burn-in test system for 6,912 devices in 1981, a parallel memory burn-in test system testing 1,728 devices simultaneously in 1984, a 15-MHz environmental test system in 1986, and a 256-pin I/O burn-in test system for VLSI devices in 1989. The history also lists a logic burn-in system using ASIC technology in 1991, weighted random patterns in 1992, memory burn-in and test systems using ASICs in 1994, a large-scale high-power burn-in system and a massively parallel memory test system in 1997, and a 200 MHz memory test system in 1998. High-power milestones include individual temperature control for 200-watt devices in 1999, an air-cooled system for 75-watt devices and a system capable of full logic and memory testing in 2001, a 600-watt system in 2004, and an air-cooled 150-watt system with an individual pattern zone per burn-in board in 2005. More recent milestones include a low-cost burn-in system with individual temperature control in 2008, 125 Amp regulators in 2012, HPB-4 High Force trays in 2013, +- 150 Volt regulators in 2014, 1,000 Volt LC2 applications in 2016, the HPB-5C+ and LC-2 Automation systems in 2020, the LC-2+ in 2021, and a burn-in with test system for 1000-watt devices with individual temperature control in 2023. Micro Control Company also characterizes its role around unique solutions for test and burn-in with test challenges, with innovation and improvement treated as continuing responsibilities across the organization.
Exhibits
Micro Control Company provides high-power burn-in test solutions requiring individual temperature control and logic and memory burn-in test solutions for lower-power devices, with systems that can use a pattern zone per slot, multiple temperature zones and independent temperature control per DUT. Its general burn-in architecture can provide up to 64 M of vector memory behind 128 independent I/O channels and can support functional testing features including high-speed clocks, individual current monitoring and tight-pitch sockets. The HPB-8 is an extreme high-power burn-in with test system for devices over 2,000 watts, designed for automation and intended to reduce handling of expensive AI processors during burn-in cycles. HPB-8 specifications include support for 2000+ watt devices with up to 11,456A per BIB and 8,000W total per slot, 16 burn-in boards per system with 547 sq. in. of DUT space each, and 12+ independent temperature controllers per BIB with liquid-cooled sockets. Its thermal and pattern functions include a chiller-cooled water system, 16 pattern zones, high-current regulators rated to 350W max, low-current regulators rated to 60W max, and ganging supply modes for high and low current. HPB-8 test resources include 64M expandable vector memory, up to 8G expandable reconfigurable scan depth, 128 I/O channels plus 128 output-only channels, and 1.25 ns resolution with high-frequency clocks. With 16 BIBs and 192+ devices per system, the HPB-8 is configured for high-throughput operation while maintaining independent thermal zones, liquid-cooled sockets and scalable memory and scan resources. The HPB-6 is an ultra high-power burn-in with test system for dynamic burn-in with test on devices up to 1000 watts and is intended for production screening, engineering characterization and lifetime testing of logic devices and multi-die packages. HPB-6 uses water-cooled high-force sockets for individual device temperature control, 16 independent burn-in-board slots, 24 high-power programmable supplies per board rated 250 W, 175 A and 0.3V to 1.8V, and 24 low-power supplies rated 60 W, 15 A and 0.3V to 4.0V. Its digital resources include 64M standard and 128M optional parallel vector depth, 8G scan vector depth, 128 formatted vector I/O channels plus 128 output-only channels, a 100 MHz fast scan mode on 16 dedicated channels, and eight programmable high-frequency clocks up to 350 MHz. The HPB-6 architecture is designed to isolate circuits inside the DUT with multiple regulated supplies, maintain device temperature throughout test, apply proper thermal stress, exercise high-pin-count devices, test more parts in parallel, translate and run device test programs, and test both logic and memory functions. A standalone chiller is provided for maintenance, while the available vector depth supports large test-vector sets without repeated reloads. The LC-3 is a burn-in-with-test system for production burn-in of logic, mixed-signal, analog and memory devices, with 50% more power supplies than an HPB-5C, twice the temperature-control channels of an LC-2, and up to 32 user-defined independent pattern zones. LC-3 supports individual temperature control for 48 20-watt devices per BIB, with 80 watts available for fewer devices, programmable chamber control up to 150°C, and individual temperature control up to 175°C. Each LC-3 BIB provides 24 total power supplies, 544A and 2240W available per BIB with a 1000W limit, including 16 high-power supplies rated 30A, .5V to 9.5V and 120W and eight low-power supplies rated 8A, .25V to 5.0V and 40W. The LC-3 provides up to 32 pattern and power zones, 128 formatted vector I/O channels, 128 unformatted BIB input-only channels, compatibility with other Micro Control Company burn-in systems and industry-standard BIBs, and C-Breez software using vectors compatible with LC-2 and HPB-5C. Its production functions are intended to support high-volume burn-in, multiple device types at the same time, parallel testing, optimum-temperature stress, programming flexibility, logic and memory testing, test-vector execution without lengthy reloads and flexible DUT power. Micro Control Company also designs and manufactures burn-in boards for many electronic devices and burn-in-system types, with dedicated and universal designs from 2 to 34 layers, gold-plated edge connectors, a 200°C maximum temperature, and socket options including BGA, LGA, PGA, QFP, TSOP, micro-BGA, SOJ, PLCC, DIP and custom designs. Burn-in-board operating ranges extend from -55°C to +150°C and up to 250°C with special board materials, with loader and unloader compatibility plus services covering design, layout and test, prototype through production quantities, engineering support, mechanical design for custom heatsinks and vector development.
Capabilities and products
- high-power burn-in and test systems
- burn-in testing for 2000+ W devices
- dynamic burn-in testing for 1000 W devices
- semiconductor burn-in board design and manufacturing
- logic and memory burn-in testing