At a glance
| Booth | R7100 |
| Country | TW |
| Website | www.mec-co.com/en/news/2026/405 |
Company profile
MEC TAIWAN COMPANY LTD. is MEC's Taiwan location and supplies specialty chemicals and related solutions for electronic substrates and parts, with product categories that include chemicals for electronic substrates and parts, chemicals used for metal surface treatment, specialized materials, and machinery or equipment. The company is also identified under the English name MEC TAIWAN COMPANY LTD. in Taiwan company-registry information, where listed business items include industrial additives, electronic components and materials, machinery, and design activities. Within electronics manufacturing, its public technology emphasis is on wet-process and surface-treatment chemistry, and the named focus includes Chemicals for electronic substrates and MEC’s advanced surface creation technologies. MEC TAIWAN COMPANY LTD. therefore supports manufacturing through chemistry and surface creation around electronic substrates rather than through finished semiconductor-device production.
Exhibits
MEC TAIWAN COMPANY LTD. supplies copper-surface treatments intended to create a surface topography suited to the application and to contribute to improved product reliability. The MECetchBOND CZ-8000 series, including CZ-8100, CZ-8101, and CZ-8201, is an organic-acid microetching solution that creates a super-roughened copper surface for processes that require high adhesion. Applications named for the CZ-8000 series include pretreatment before build-up resin lamination, dry-film lamination, and solder-mask application, where the roughened copper surface provides high physical bonding with resin materials. The CZ-8401+AP series uses an ultra-low etching amount to form a distinctive uneven copper surface and an organic film, improving adhesion while minimizing the reduction in conductor-pattern line width. In addition to limiting conductor-width reduction, this low-etch treatment is described as achieving good bonding with different resins through chemical bonding, so its adhesion mechanism is not limited to the physical roughness alone. MECBRITE CA-5330 and 5340 are H2SO4-H2O2 type copper-surface pretreatments dedicated to the MECetchBOND CZ series before copper super-roughening. With slight etching, MECBRITE CA-5330 and 5340 remove inhibitors that may reduce CZ roughening performance, including dry-film adhesive residue, fingerprints, and oxides, thereby helping maximize MECetchBOND performance and improve final-product reliability. MECetchBOND CL-8300 series is a temporary anti-tarnish treatment that protects copper surfaces roughened by the MECetchBOND CZ series from oxidation. CL-8300 also forms an organic film that improves adhesion between copper and high Tg resins, combining temporary anti-tarnish protection with improved chemical adhesion. The listed peel-strength reference for CL-8300 uses 35 μm copper foil with and without CL-8300 treatment, providing a stated test context for the adhesion treatment. Across these products, MEC TAIWAN COMPANY LTD. covers super-roughening adhesion enhancement, microetching, pretreatment, temporary anti-tarnish protection, and chemical-adhesion improvement for copper surfaces used with electronic-substrate materials. MEC also evaluates PWB-related performance through surface topography, pattern shape, and peel strength, placing the adhesion treatments in a printed-wiring-board process context rather than treating roughening only as a standalone chemical reaction.
Capabilities and products
- chemicals for electronic substrates
- copper-surface microetching and roughening treatment
- low-etch copper adhesion treatment
- H2SO4-H2O2 copper-surface pretreatment
- temporary anti-tarnish treatment for copper surfaces
- chemical adhesion treatment between copper and high-Tg resin