At a glance
| Booth | R7918 |
| Country | TW |
| Website | www.mitsuboshidiamond.com |
Company profile
MDI Taiwan Innovations Co., Ltd. presents MDI processing technologies; MDI, founded in 1935, is a processing-equipment manufacturer that combines original cutting tools with SnB processing technology to provide suitable processing conditions and automation devices capable of carrying out those processes with high productivity. SnB, or Scribe & Break, is a processing technology suited to brittle materials such as glass and is widely used to cut hard and brittle materials including liquid-crystal glass substrates. MDI has developed a unique cutter wheel using the SnB method, a proprietary technology since the company's establishment, and has expanded the cutting application range to compound-semiconductor materials such as SiC (silicon carbide). The stated benefits of this SnB-based approach include addressing problems associated with traditional methods while enabling cutting processes with high productivity, high precision, low cost, and reduced environmental impact. The processing concept therefore links proprietary cutting tools, brittle-material know-how, automation devices, and SnB process control rather than relying on a single cutting tool or a single material family.
Exhibits
MDI's dry-processing development traces back to its 1935 start as a glass-cutter manufacturer, and the current processing scope goes beyond simple cutting to sophisticated shaped processing and drilling requirements. For each material, MDI proposes an appropriate processing method ranging from wheel scribing to laser scribing, and it provides a total solution that combines processes, tools, and equipment. Its high-precision processing equipment and tool products serve the semiconductor, FPD, perovskite solar cell, and electronic-components markets, while its processing technology also covers ultra-precise work on high-hardness PCD and cemented-carbide components. For semiconductor devices, MDI applies proprietary SnB (Scribe & Break) technology to advanced chip-making and wafer-singulation processes, addressing challenges of conventional methods while targeting high productivity, high precision, cost efficiency, and environmentally friendly processing. The equipment portfolio for semiconductor processing includes the DIALOGIC DL Series and DIALOGIC DLP Series, and DIALOGIC Plus+ is described as a modular wafer-singulation system developed for production requirements ranging from R&D through mass production. DIALOGIC Plus+ modularizes individual processes that incorporate MDI's SnB method, allowing customers to combine modules according to specific applications and production plans and to add modules later as production plans expand. Within SnB, the scribe step forms micro-cracks inside the wafer by rolling a wheel over its surface, while the break step propagates those micro-cracks by pushing from the opposite side. The DLP Full Auto Model supports cassette loading and integrates key SnB steps including film lamination, delamination, expand, and remount into a fully automated process flow intended to reduce human error. DIALOGIC Plus+ is stated to provide approximately 20% higher throughput than previous models, and its scalability allows modules to be added for expansion while supporting a smoother transition from R&D to mass production with minimized additional investment. For the FPD and glass market, MDI performs high-precision cutting and breaking of panels and glass across different sizes, thicknesses, and strengths, using specialized tools and equipment to implement suitable processes. For CIGS-based solar panels, MDI provides a one-stop manufacturing-process solution that covers patterning, drilling, and marking and uses high-speed processing, long-lasting tools, and high-precision machining to reduce dead areas and improve productivity. For electronic components, MDI offers dry-processing solutions for materials including sapphire and ceramics and provides processes and equipment for cutting and breaking brittle and multilayer substrates with high-speed and high-precision machining. Its tool-product business supplies consumable tools selected for different material properties, with development and manufacturing handled in-house at a factory in Japan to support stable supply. For high-hardness components such as PCD (polycrystalline diamond) and carbide materials, MDI provides ultra-precise micro-scale processing; PCD is stated to have a service life 10 to 100 times longer than other metal components, helping reduce production losses and waste. The named product range also includes the OZREE Glass Cutter in addition to the DIALOGIC DL Series and DIALOGIC DLP Series, extending the tool and equipment range across glass and semiconductor-related processing. For the global FPD industry, MDI combines decades of processing experience with specialized tools and equipment to select suitable processes for advanced materials, while its total-solution approach covers the process method, the tool, and the equipment used to execute it. For high-hardness tool production, MDI uses a fully integrated development and production system at its domestic factory to support stable supply, reduce production losses associated with machine downtime, and support initiatives toward the SDGs.
Capabilities and products
- SnB scribe-and-break processing for brittle materials
- glass substrate cutting
- SiC compound-semiconductor cutting
- wheel scribing
- laser scribing
- automated wafer singulation systems
- fully automated wafer singulation with lamination, delamination, expand and remount
- high-precision cutting and breaking for FPD and glass
- CIGS solar-panel patterning, drilling, and marking
- dry processing of sapphire and ceramics
- ultra-precision processing of PCD and carbide