At a glance
| Booth | R7112 |
| Country | DE |
| Website | www.muehlbauer.de |
Company profile
MB Automation GmbH & Co. KG represents a Muehlbauer Group portfolio built on more than 40 years of experience in automated production, with semiconductor technologies, precision manufacturing, equipment, software, and service capabilities developed for industrial use. The semiconductor portfolio includes Die Sorting, AI-supported Vision Inspection, Smart Carrier Tape, and CTLM technology for 100% die-level traceability and process transparency. The broader organization combines Precision Parts, Visionary Equipment, Secure Identity, and Next Gen Energy activities for semiconductor, automation, aerospace, medical, mobility, identity, and other demanding applications. A global network of sites and service hubs supports customers and partners around the world, with thousands of employees and tens of thousands of machines operating in the field. Service infrastructure includes worldwide technical support, an online service desk, and around-the-clock assistance for equipment in operation. Precision manufacturing is vertically integrated across three production sites with more than 1,000 manufacturing experts, over 450 production machines, and 77K+ m² of production area. The precision-parts organization reports more than 65 million euros invested in six years and combines milling, turning, laser processing, welding, grinding, assembly, surface technology, deburring, and quality assurance under one roof. Production at Roding, Stollberg, and Nitra spans development, prototyping, serial production, assembly, and surface finishing, with DIN EN ISO 9001 certification stated for worldwide production of individual parts and large series. Automation activities connect mechanical engineering, R&D, production, software, inspection, and service teams to turn customized equipment concepts into series-ready manufacturing systems. Secure Identity activities cover complete identity lifecycles and are used by governments and public authorities, while the organization cites experience from hundreds of identity projects worldwide. Next Gen Energy activities extend automation into battery cells, fuel cells, battery-management systems, and automotive wire embedding for mobility and energy manufacturing. Across these fields, the operating model emphasizes in-house manufacturing depth, integrated engineering, traceability, inspection, and service support rather than isolated machine supply.
Exhibits
Precision Parts provides a one-stop production chain that includes milling, turning, sheet-metal processing, laser work, welding, grinding, eroding, clean-room assembly, galvanic processes, powder coating, wet painting, deburring, and final quality assurance. An ISO class 7 clean room is available within the in-house assembly range, and large raw-material stocks support independent and predictable delivery for individual parts, assemblies, system modules, and complete machines. Medical manufacturing includes high-precision components for MRT and CT systems with tolerances up to ±0.002 mm, while aerospace work includes machined chassis and structural components for aircraft and satellites. Railway and new-mobility work covers laser-cut and bent sheet-metal parts through final module assembly, and security and defense work includes tightly toleranced turned parts and complete-system assembly with clean-room capability when required. Express Production uses in-house raw-material storage, around-the-clock operation, reserved capacity for urgent work, priority quality inspection, and express delivery to restart prototypes or production runs after disruptions. Quality systems are audited by neutral institutions and re-audited regularly, with additional customer audits conducted on site to verify continued compliance with required standards. Visionary Equipment covers modular production and automation for smart cards, ePassports, RFID, semiconductor backend processes, inspection, and related manufacturing, combining machinery with software integration and customer-specific inspection technologies. Document Technologies includes more than 100 standard and customized systems for card and smart-card production and personalization, while RFID Smart Factory provides an integrated equipment platform for labels, tickets, tags, cards, and ID documents. Inspection Solutions include integrated and scalable equipment for banknote and coin production, and Software Solutions extend into identity, mobility, and payment applications. The automation portfolio is installed in more than 170 countries across secure-document production, smart-card manufacturing, RFID, semiconductor technologies, and emerging applications, with 90K+ machines stated to be in the field. Semiconductor and AI equipment combines advanced die sorting with inspection and carrier-tape technologies for applications ranging from standard devices to advanced packaging and silicon photonics. Die sorting supports wafer, tape & reel, tray, and panel handling and is designed to connect the wafer stage with downstream formats needed for packaging and further production. Carrier tapes are developed and manufactured in-house for secure handling, transport, and storage of sensitive semiconductor components and are designed to connect directly with die-sorting output. The semiconductor portfolio states throughput up to 1 million dies per day and inspection resolution down to 1 µm for high-volume, precision-oriented backend manufacturing. Vision Inspection combines visible and infrared imaging with intelligent inspection for full 6-side checking, real-time defect detection, process transparency, and 100% inline quality control without reducing throughput. In-house carrier-tape production uses intelligent vision and matrix-scan technologies to control quality, reduce waste, and support customized tape designs for semiconductor components. The die-sorting technology stack also includes AOI vision for front, back, and sidewall inspection, visible-light and infrared crack detection, grayscale or color processing, AI-based defect classification, and self-calibrating smart-factory functions. MB AI Vision turns inspected dies into training data, MB IQ Studio manages inspection models, and MB ADI provides Autonomous Diagnostic Intelligence for routine diagnostics. DS MERLIN 60K is positioned for ultra-high-speed die sorting with AI-driven 6-side AOI inspection and high-volume tape-and-reel processing up to 1 million dies per day. For DS MERLIN 60K, multi-spectrum imaging includes visible, NIR, and SWIR channels, while reported optimization results include a 60% reduction in yield loss, up to 20% higher daily output, and automatic self-alignment that can reduce setup-related cost and dependency by around 25%. DS MERLIN WAFER-TO-WAFER/WAFER-TO-PANEL supports output to wafer, panel, or tray, including 12-inch reconstructed wafer or panel and 600 mm panel bonding, with reconstructed fan-in and fan-out sorting and direct die bonding on PCB without carrier tape. MB ALBATROSS supports lights-out production, dual handling, automated changeover in less than 30 minutes, coplanarity control, and automated-factory integration, with output to tape & reel, tray, and reconstructed-wafer formats. DS VARIATION PRO supports reconstructed wafers, trays, tape & reel, and de-taping, with placement accuracy up to ±10 μm, integrated 1 μm inspection, sidewall and IR inspection, and die sizes from 0.2 to 50 mm and beyond on one platform. DS VARIATION ECO-LINE provides wafer, waffle-pack, tape-and-reel, and de-taping capability with integrated wafer, placement, sidewall, and tray-scan inspection, and placement precision of ±30 μm with ±20 μm optional. Carrier Tape Technologies includes the CT 8/24 D rotary forming system, which supports positive and negative forming for tape widths from 8 mm to 24 mm and throughput below 600 m/h depending on process, cavity size, and material. The CT 12/88D linear forming system processes carrier tapes from 12 mm to 88 mm and offers optional Deep Pocket Stamping for cavity depths up to 30 mm. CT LM/D1 laser marking engraves Data Matrix Codes with a 0.1 mm dot size, verifies code position and readability with integrated vision, creates D1 vacuum holes down to 0.08 mm, and operates inline with existing carrier-tape production. Secure Identity solutions span document design, enrollment, identity management, production, personalization, and verification as one connected lifecycle. Enrollment systems securely capture and process demographic and biometric data, while identity-management systems maintain data through its lifecycle for authorized access, traceability, and authentication. Production solutions are modular and integrate production and process management, while personalization transfers personal and biometric data to connect each identity document with its holder. Verification solutions authenticate people and documents at borders, checkpoints, airports, and digital-government services. Identity-project conception combines consulting, solution architecture, and design, considering machines, devices, software, infrastructure, logistics, locations, and operational processes as one implementation-ready system. The identity organization states more than 300 projects worldwide and more than 31 years of experience, with service and support connected to later lifecycle stages. Next Gen Energy includes production equipment and assembly systems for battery cells, fuel cells, battery-management systems, and automotive wire embedding under the MB ATECH Advanced Energy Technologies activity. The Battery Cell Assembly Line manufactures pouch and prismatic lithium-ion cells with a reduced carbon footprint, low energy cost, and a small production footprint. The fuel-cell portfolio includes a fully automated MEA production line with inline quality control for handling CCM and subgasket materials and accurately placing GDLs. Automotive Wire Embedding uses the MTT 2462 platform and applies more than 15 years of platform performance to heating elements, battery systems, sensors, and other automotive uses. MB ATECH reports more than 100 million euros invested in eMobility, more than 1K+ m² of dry-room space for production and testing, and new eMobility centers in Europe. An ATECH GIGA center is described on a 20-acre site, and additional production sites are being established in Nitra, Slovakia, and Stara Pazova, Serbia. Across semiconductor, identity, and energy systems, the service model combines global experts, local sites, online support, and field experience to keep production equipment operating through its lifecycle.
Capabilities and products
- die sorting
- AI-supported vision inspection
- semiconductor carrier tape development and manufacturing
- 100% die-level traceability technology
- precision milling
- precision turning
- laser processing
- welding
- grinding
- sheet metal working
- electrical discharge machining (EDM)
- ISO class 7 clean-room assembly
- galvanic surface treatment
- powder coating
- wet paint coating
- medical imaging components with tolerances up to ±0.002 mm
- aircraft and satellite chassis and structural component machining
- sheet metal laser cutting and bending
- complete module assembly
- express production for prototypes and production runs
- smart-card production systems
- smart-card personalization systems
- integrated RFID equipment platform
- banknote and coin production inspection solutions
- multi-format die sorting and handling
- six-side visible and infrared die inspection
- front, back and sidewall crack inspection
- AI-based defect classification
- GEM300 automated fab integration
- Visible/NIR/SWIR multispectral inspection
- direct die bonding on PCB without carrier tape
- fan-in/fan-out reconstructed die sorting
- die placement accuracy up to ±10 μm
- integrated 1 μm defect inspection
- die handling from 0.2–50 mm and beyond
- 8–24 mm carrier tape positive and negative forming
- 12–88 mm carrier tape linear forming
- deep pocket stamping up to 30 mm
- Data Matrix laser marking with 0.1 mm dot size
- D1 vacuum holes down to 0.08 mm
- end-to-end secure identity lifecycle solutions
- demographic and biometric data capture and processing
- identity lifecycle data management and authentication
- modular identity document production
- identity document personalization
- people and identity document verification
- identity system consulting, architecture and design
- pouch and prismatic lithium-ion battery cell assembly line
- fully automated MEA fuel-cell production line
- CCM/subgasket handling and precise GDL placement
- wire embedding for heating elements, battery systems and sensors