At a glance
| Booth | K2035 |
| Country | TW |
| Website | www.marposs.com/eng/industry/electronic-electric-components |
Company profile
Marposs Company's headquarters are in Bentivoglio, about ten kilometres north of Bologna, Italy, with three side-by-side factories and service buildings covering 38,000 square metres, surrounded by 30,000 square metres of gardens plus yards and parking. The headquarters house central R&D, design, production, marketing, and education and training organizations, while manufacturing is divided between a Product Manufacturing Center for standard products and an Application Manufacturing Center for customized systems integrated into customer facilities. Marposs Company operates advanced equipment to assure product quality and identifies final-product quality assurance as a continuing target. The company offers gauging and monitoring solutions intended to improve manufacturing-process quality, capability, and productivity, with R&D, application specialists, and support engineers helping define solutions for electronic-component and device production applications. Its sensor and complete-solution areas include machine tools for semiconductor and die manufacturing, metrology and inspection for automated wafer, PCB, interposer, WLP, and camera-module applications, machine tools for consumer electronics including smartphone enclosures, cover glass, and back covers, defect inspection and metrology of critical consumer-electronics features, automated machines and processes for die packaging, off-line inspection, and leak testing of critical enclosures and assemblies.
Exhibits
Marposs Company provides specialized engineers and a strategically located worldwide service network for installed products and application solutions, with personalized support, repair and field services, and service agreements covering preventive maintenance, calibration, training, and process improvement. It can develop customized preventive-maintenance programs and scheduled service interventions to optimize production capacity and reduce costs, plan calibration programs to verify measurement-result reliability, product and process quality, and equipment compliance, and train maintenance and operator teams to attain maximum equipment performance. Marposs Company provides worldwide precision-metrology equipment for workshop use during and after machining operations and states that it has studied and sold semiconductor-industry applications since 1980, serving OEMs involved in improving wafer-fabrication reliability and performance. Its semiconductor offerings include probes, in-process gauges, and non-contact sensors for controlling CHIP or LED production lines through different process phases, together with solutions based on chromatic confocal and interferometry technologies. The company supplies gauging solutions for silicon, sapphire, SiC, and other semiconductor-wafer thickness measurements, systems for controlling wire-bonding dimensions during the drawing process, and machine-tool sensors for measuring physical quantities that affect and govern machining processes. Listed benefits include reduced working and checking times, increased production efficiency, scrap reduction, direct machine-tool control, and easier daily work for operators. Listed products include UNIMAR™ universal measuring gauges for grinders, ACOUSTIC SENSORS for grinders, REDCROWN 2™ displacement sensors, LEAK AND FLOW TESTERS, NCG non-contact gauges for layer-thickness measurement, IRIX™ chromatic-confocal non-contact measurement, CCS SERIES with ChromaPoint controller, MC2 SERIES with ChromaLine camera, LIGHTMASTER with MultiPoint controller, MPLS-DM SERIES with ChromaLine sensor, ZENITH CONTROLLER with ChromaPoint controller, STIL SYSTEMS for non-contact measurement within Industry 4.0, P3CF™ hybrid contact/non-contact chromatic-confocal measurement, and VBI (Visual Blade Inspector) sensors for dicing machines.
Capabilities and products
- gauging and monitoring solutions
- customized integrated gauging systems
- semiconductor wafer thickness measurement
- probes and in-process gauging for CHIP/LED production
- chromatic confocal non-contact measurement
- interferometry-based non-contact measurement
- wire-bonding dimension process control
- non-contact layer-thickness measurement
- leak and flow testing
- visual blade inspection for dicing machines
- automated metrology and inspection for wafer/PCB/interposer/WLP