At a glance
| Booth | K2035 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Fiber Optic Inspection Instruments · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Instruments; Bench Top Test · Leak Detection Systems - Vacuum or Gas · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Package Inspection; Lead Scanners · Thermal Sensing, Measurement, Analysis · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation |
| Website | www.marposs.com/eng/industry/electronic-electric-components |
Company profile
The headquarters facilities are in Bentivoglio, about ten kilometres north of Bologna, Italy. The headquarters consist of three factories set side by side, plus other service buildings (an internal restaurant and technological centres). The total covered space measures 38,000 square metres, surrounded by 30,000 square metres of gardens, plus yards and parking lot. This is the location of the central research and development, design, production, marketing and education/training organizations. The manufacturing organization has two major components: the Product Manufacturing Center which produces standard products; the Application Manufacturing Center, which produces customized systems to be integrated into customers' facilities. Marposs operates with the most advanced equipment to assure the quality of its products. Quality Assurance of the final product has been always a target for Marposs. We are open to share our experiences, proposing Gauging and Monitoring solutions that can upgrade your manufacturing process quality, capability and productivity. Marposs R&D, Application Specialists and Support Engineers are ready to help you define the most effective solution for your specific electronic component or device production applications. We can provide Sensors & complete Solutions for: Machine tools for semiconductor and die manufacturing Metrology & Inspection for Automated Machines for wafer, PCB, interposers, WLP, module camera applications Machine tools for consumer electronics (Smartphone enclosures, cover glass, back cover, etc) Defect Inspection & Metrology of consumer electronics critical features Automated Machines & Processes for die packaging Off-line Inspection Solutions Leak Testing of Critical enclosures & assemblies
Capabilities and products
- automated machines and processes for die packaging
- gauging and monitoring solutions
- leak testing of critical enclosures and assemblies
- machine tools for semiconductor and die manufacturing
- metrology and inspection for PCB, interposers, WLP and module camera applications
- metrology and inspection for wafer automated machines
- off-line inspection solutions
- sensors for semiconductor and die manufacturing
Related product topics
- Semiconductor Packaging Equipment
- Vacuum and Gas Leak Detection Systems
- Semiconductor Inspection Equipment
- Semiconductor Packaging Inspection Systems
- Wafer Inspection Systems
- Vision Measuring and Inspection Systems
- Maskless Direct-Write Lithography Systems
- Precision Measurement Equipment
- Measurement Sensors
- Inspection & Metrology Equipment
- Process-Control Metrology Solutions
- Semiconductor Equipment Sensors