At a glance
| Booth | M1248 |
| Country | TW |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Plating; Electro Chemical Plating for device assembly · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Plating; Electro Chemical Plating; Deposition Systems · Cleaning Chemicals; Solvents; Strippers · Glass Plates for FPD · Package Materials; Interconnect; Subcomponent; Subassembly Design Services · Device; Wafer; Display Panel Handling Products |
| Website | www.manz.com.tw/en |
Company profile
About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP / FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.
Exhibits
Manz Asia is a leading manufacturer of equipment for semiconductor panel-level packaging. With a core focus on panel-level packaging technology, the company drives innovation in both the technology and processes of panel packaging. With our technologies and innovative production solutions, we serve different sectors and industries. Our diversified positioning creates synergy effects from which our customers benefit greatly. With our technologies and services, we always have the right solution for our customers. We see ourselves as a development partner who works out solutions together with our customers. We support you right from the start in numerous stages of development and design through to after-sales service. Leading manufacturer of advanced semiconductor equipment Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the panel framework for panel-level packaging. From laboratory-scale and pilot production to full-scale manufacturing, Manz Asia offers comprehensive equipment solutions. Panel-level packaging adapts wafer-level techniques from round wafers to square panels, maximizing area utilization and throughput. High-density RDL metallization and interconnect design ensure reliable connections across substrates and materials, improving scalability, flexibility, and manufacturing efficiency. With the rapid growth of demand for AI and HPC chip testing, probe cards have become a key factor in overall test yield. We provide a comprehensive range of wet process equipment, covering surface treatment, development, etching, stripping, and plating, to help customers manufacture MLO probe card substrates and achieve higher reliability and competitiveness in semiconductor testing. Meanwhile, we are expanding into next-generation advanced packaging materials with equipment solutions for glass substrates. Leveraging their excellent flatness and thermal stability, our solutions enable higher-density interconnects and superior chip performance for the AI era. Whether functional or direct-to-product, direct-to-object or even direct-to-shape printing. It's all about high-quality and, above all, direct printing and finishing of products, components and surfaces. As part of its comprehensive technology portfolio, Manz Asia offers engineering solutions for the industrialization of digital printing using inkjet printing technology.
Capabilities and products
- IC substrate processing for glass and organic core substrates
- advanced packaging equipment for High-Density PLP / FOPLP
- automation and software integration for semiconductor equipment
- high-density RDL metallization and interconnect design
- inkjet printing equipment for semiconductor production
- plating equipment for semiconductor processing
- semiconductor panel-level packaging equipment
- wet process equipment for MLO probe card
- wet-chemistry semiconductor equipment