At a glance
| Booth | M1248 |
| Country | TW |
| Website | www.manz.com.tw/en |
Company profile
Manz delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration, with expertise extending across advanced packaging and IC-substrate processing. Its advanced-packaging scope includes High-Density PLP and FOPLP, while its IC-substrate work covers glass and organic cores, supporting customer programs from research and development through high-volume manufacturing. The company also provides system solutions, contract manufacturing, and sales representation, and describes these activities as supporting shorter time-to-market, improved yield, and competitiveness in the semiconductor industry. Manz describes its semiconductor-packaging production systems as drawing on more than 40 years of experience in automation and wet chemistry for the display, IC-substrate, and PCB industries, while continued development has added digital-printing solutions. Its equipment scope runs from customized individual machines for laboratory, pilot, and small-series production to standardized modules, complete systems, and turnkey solutions for high-volume manufacturing, with stated benefits including resource efficiency, higher throughput, and shorter time-to-market. Manz presents itself as a development partner that works with customers from early development and design stages through after-sales service, combining technology development with support across the equipment lifecycle. Beyond semiconductor equipment, its stated market and service portfolio includes FOPLP, IC substrate and Glass Core, Digital Printing, and Contract Manufacturing, with contract-manufacturing capabilities in Mechanical & Systems Engineering, Assembly & Clean Room Assembly, and Parts Manufacturing. The company states that it has evolved from a wet-chemical specialist into a global manufacturer of integrated production systems and maintains local locations intended to keep support close to customers.
Exhibits
For panel-level packaging, Manz provides equipment solutions from laboratory-scale and pilot production through full-scale manufacturing and describes panel-level packaging as adapting wafer-level techniques from round wafers to square panels to increase area utilization and throughput. Its panel-level approach uses high-density RDL metallization and interconnect design to create reliable connections across substrates and materials, with the stated goals of improving scalability, flexibility, and manufacturing efficiency. For AI and HPC chip-testing demand, Manz supplies wet-process equipment for MLO probe-card substrates covering surface treatment, development, etching, stripping, and plating, addressing the fabrication of probe-card substrates and the reliability requirements of semiconductor testing. The company is also expanding equipment solutions for glass substrates in next-generation advanced packaging, using the flatness and thermal stability of glass to support higher-density interconnects and chip performance. Its inkjet-printing engineering covers functional and direct printing, including direct-to-product, direct-to-object, and direct-to-shape approaches for printing and finishing products, components, and surfaces as part of the industrialization of digital printing. The product portfolio includes Cleaning, Developing, Etching, and Stripping equipment used primarily for semiconductor panel-level packaging, advanced IC substrates including glass substrates and probe-card MLO, and display production. For photoresist-related wet processes, Manz states 40 years of experience handling different materials and describes capabilities in high-efficiency particle removal, precise photoresist patterning, selective material removal, high-accuracy pattern transfer, and complete removal of residual photoresist. Its highly integrated continuous processing is described as improving production efficiency and yield, while equipment applications span Semiconductor FOPLP, IC Substrate Core, IC Substrate TGV, Probe Card MLO, and Display. The capability table lists EMC for Semiconductor FOPLP with 2/2 µm L/S and substrate size up to 700 x 700 mm, BT for IC Substrate Core with 10/8 µm L/S and 510 x 515 mm substrates, Glass for IC Substrate TGV with 2/2 µm L/S and 510 x 515 mm substrates, BT for Probe Card MLO with 30/30 µm L/S and 355 x 400 mm substrates, and Glass for Display with 2/2 µm L/S and substrate size up to 2940 x 3370 mm (G10.5). Wet-process equipment features include a high-precision gear configuration to reduce transmission vibration, a drying section after blow-drying to prevent oxidation of the conductive layer, a high-uniformity spray-plate configuration for small line width and spacing, and horizontal and vertical automated loading and unloading. The Omni X Series integrates ECD electrochemical deposition with wet-chemical process equipment; the Omni 310, Omni 510, and Omni 700 platforms support FOPLP, IC substrates, and glass-core applications over panel sizes from 310 mm to 700 mm, spanning R&D through mass production. For Desmear (DSM) and Plating Through Hole (PTH), Manz offers continuous horizontal DSM&PTH equipment purpose-built for high-aspect-ratio AI-server PCB production and a gantry-type DSM&PTH configuration designed specifically for probe-card MLO manufacturing. Its ECD equipment is identified as a key technology for implementing the RDL process in Panel Level Packaging, Through Glass Vias (TGV), and Probe card MLO. In inkjet printing for semiconductor IC packaging, the company states that its printing systems increase production flexibility and improve the environmental friendliness of the production system. For automation, Manz states that thousands of robotic systems are installed worldwide in display, PCB, and semiconductor panel-level-packaging industries, with handling and robotics expertise aimed at higher precision, faster throughput, and manufacturing efficiency. Its contract-manufacturing offering draws on production plants in Europe and Asia and covers plant manufacturing, parts production, and assembly work for customers across multiple industries. Within FOPLP, RDL serves as the interconnect between die and substrate, redistributing die I/O, shortening signal paths, and creating compact electrical connections that support high-speed and high-frequency performance for RFICs, AI, 5G components, and HPC applications. Manz describes RDL-based thin-film interconnects and advanced 2.5D/3D architectures as supporting higher functional density and heterogeneous integration beyond traditional PCB and substrate processes. For Chip-First processing, chips are attached to the carrier before the RDL is formed and the approach is positioned for smaller, simpler devices such as PMICs and RF ICs; in Chip-Last processing, chips are attached after completion of the RDL structure and the approach is positioned for higher-density, larger-chip applications such as AI chips and HPC processors. Coreless panel-level packaging for PMICs, RFICs, and similar devices uses RDL to connect dies directly with 10 µm - 30 µm high-density interconnects, shortening signal paths and reducing energy loss while lowering thermal resistance and improving heat dissipation. For high-density AI and HPC packaging, the company states that panel-level packaging can provide <10 µm line/space interconnects for higher routing density and flexible substrate design while increasing production throughput. A 700 × 700 mm panel is stated to hold about eight times more packages than a 12-inch wafer, improving throughput and area utilization while reducing manufacturing cost, and the approach supports multi-die integration and heterogeneous chip sizes. Across these panel-level solutions, Manz describes support for both chip-first flows associated with RFIC applications and chip-last flows associated with AI-chip applications, together with thinner package profiles, improved thermal performance, and reduced manufacturing costs.
Capabilities and products
- semiconductor wet-chemistry equipment
- semiconductor plating equipment
- semiconductor inkjet printing equipment
- semiconductor automation systems
- semiconductor software integration
- High-Density PLP/FOPLP equipment
- IC-substrate processing equipment for glass and organic cores
- semiconductor cleaning, developing, etching, and stripping equipment
- ECD electrochemical deposition equipment
- DSM/PTH equipment for AI-server PCBs
- wet-process equipment for probe-card MLO substrates
- robotic handling and automation for semiconductor panels
- clean-room assembly contract manufacturing
- mechanical and systems engineering contract manufacturing